LED package frame and LED package having the same
    2.
    发明申请
    LED package frame and LED package having the same 有权
    LED封装框架和LED封装相同

    公开(公告)号:US20060169999A1

    公开(公告)日:2006-08-03

    申请号:US11319101

    申请日:2005-12-28

    IPC分类号: H01L33/00

    摘要: The invention relates to an LED package frame and an LED package incorporating the same. The LED package frame comprises an LED chip; and a heat conductive member made of a lump of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member to separate the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability. Also, it is possible to provide an LED package frame and a high power LED package by fixing the lead fixed to the heat conductive member without a jig.

    摘要翻译: 本发明涉及一种LED封装框架和一个包含该LED封装框架的LED封装件。 LED封装框架包括LED芯片; 以及由高导热性材料块制成的导热构件。 导热构件在侧部具有接收部,并且安装有LED芯片。 引线一端插入导热部件的接收部分,并与LED芯片电连接。 电绝缘层被放置在引导件和导热构件的接收部分之间的紧密接触中以将引线与接收部分分离。 通过将导线插入导热构件,可以在保持高导热性和稳定性的同时减小尺寸。 此外,通过将固定在导热构件上的引线固定而不用夹具,可以提供LED封装框架和大功率LED封装。

    Direct-illumination backlight apparatus having transparent plate acting as light guide plate
    3.
    发明申请
    Direct-illumination backlight apparatus having transparent plate acting as light guide plate 失效
    具有用作导光板的透明板的直接照明背光装置

    公开(公告)号:US20060187651A1

    公开(公告)日:2006-08-24

    申请号:US11136529

    申请日:2005-05-25

    IPC分类号: G01D11/28

    摘要: A direct-illumination backlight apparatus uses LEDs as a light source. This backlight apparatus comprises: a flat reflective plate; an LED light source arranged on the reflective plate; a transparent plate arranged above the LED light source; a scattering pattern arranged on an underside of the transparent plate in a position corresponding to the LED light source; and a light guide made of transparent material, and arranged around the scattering pattern to introduce light incident from below into the transparent plate so that the light is internally reflected by the transparent plate. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel. This can remove any dark area above the LED light source in the transparent plate and thus reduce the thickness of the direct-illumination backlight apparatus.

    摘要翻译: 直接照明背光装置使用LED作为光源。 该背光装置包括:平面反射板; 布置在所述反射板上的LED光源; 布置在LED光源上方的透明板; 散布图案,布置在与LED光源相对应的位置的透明板的下侧上; 以及由透明材料制成的导光体,并且布置在散射图案周围以将从下方入射的光引入透明板,使得光被透明板内部反射。 该光导用于从LED光源引入部分光,使得部分光被捕获在透明板的内部,散射图用于将捕获的光束分散在LED光源正上方的位置,从而 散射的光束从透明板向LCD面板逸出。 这可以去除透明板中的LED光源上方的任何暗区,从而减小直射照明背光装置的厚度。

    Side-emission typy LED package
    4.
    发明申请
    Side-emission typy LED package 有权
    侧排型式LED封装

    公开(公告)号:US20060171151A1

    公开(公告)日:2006-08-03

    申请号:US11318837

    申请日:2005-12-28

    IPC分类号: F21V5/00

    CPC分类号: H01L33/60 F21K9/68 H01L33/54

    摘要: A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.

    摘要翻译: 提供了侧面发射型LED封装。 LED封装包括LED芯片,下部结构和上部结构。 下部结构具有下反射镜和透明密封构件。 下部结构支持LED芯片。 下镜从LED芯片向上和向外延伸,从而将来自LED芯片的光线向上反射。 透明密封件形成在下反射镜内部的LED芯片周围。 上部结构组合到下部结构的上部,以将由下部结构向上反射的光反射到径向横向方向。 如上所述,下部结构和上部结构彼此分开设置并组合,从而提高了密封构件的模制效率,并且可以容易地制造侧面发射型LED封装。

    Led backlight apparatus
    5.
    发明申请
    Led backlight apparatus 审中-公开
    LED背光装置

    公开(公告)号:US20060146530A1

    公开(公告)日:2006-07-06

    申请号:US11134430

    申请日:2005-05-23

    IPC分类号: F21V7/00

    CPC分类号: G02F1/133603 G02F1/133605

    摘要: This invention relates to an LED backlight apparatus. The LED backlight apparatus comprises: a housing having an upper opening; a reflective sheet provided on a bottom inside the housing; a plurality of LED light sources arranged above the reflective sheet at a predetermined distance to emit light toward the reflective sheet; and a light source support connected to a side wall of the housing to support the LED light sources. The light sources are arranged opposite to the reflective sheet so that light beams emitted from the LED light sources reflect from the reflective sheet before entering a diffuser plate behind the LED light sources from the reflective sheet, thereby potentially reducing the thickness of the backlight apparatus while ensuring a distance for the light beams to sufficiently mix together before entering the differ plate.

    摘要翻译: 本发明涉及一种LED背光装置。 LED背光装置包括:具有上开口的壳体; 设置在所述壳体内的底部的反射片; 多个LED光源,以预定距离布置在反射片上方,以向反射片发射光; 以及连接到壳体的侧壁以支撑LED光源的光源支撑件。 光源与反射片相对布置,使得从LED光源发射的光束从反射片反射到反射片之后,从LED反射片进入漫射板后面,从而潜在地减小背光装置的厚度,同时 确保在进入不同板之前使光束充分混合在一起的距离。

    Large size backlight apparatus reduced in thickness
    6.
    发明申请
    Large size backlight apparatus reduced in thickness 失效
    大尺寸背光设备厚度减小

    公开(公告)号:US20060083021A1

    公开(公告)日:2006-04-20

    申请号:US11060286

    申请日:2005-02-18

    IPC分类号: F21V7/04

    摘要: The present invention relates to a backlight apparatus used in an LCD, in which upper and lower reflective plates are installed under upper and lower transparent plates, respectively. The lower transparent plates and the lower reflective plates introduce light generated by lower light sources in upward directions and the upper transparent plate and the upper reflective plates introduce light generated by an upper light source into those areas, which are not lighted by the lower light sources. This can prevent the formation of dark areas above the lower light sources as a problem of a conventional large-sized backlight apparatus, thereby enhancing the overall uniformity of light. In this way, the backlight apparatus of the invention can be designed thin even when applied to a large-sized LCD.

    摘要翻译: 本发明涉及一种在LCD中使用的背光装置,其中上反射板和下反射板分别安装在上透明板和下透明板之下。 下透明板和下反射板在向上方向引入由下光源产生的光,并且上透明板和上反射板将由上光源产生的光引入那些未被下光源照射的区域 。 这可以防止在较低光源之上形成暗区域作为常规大型背光装置的问题,从而增强光的整体均匀性。 以这种方式,即使应用于大型LCD也能够将本发明的背光装置设计得很薄。

    Led array circuit
    7.
    发明申请
    Led array circuit 审中-公开
    LED阵列电路

    公开(公告)号:US20060157657A1

    公开(公告)日:2006-07-20

    申请号:US11304821

    申请日:2005-12-16

    IPC分类号: G02B27/00

    摘要: Provided is an LED array circuit that has reduced power consumption and can protect an LED from a reverse voltage. The LED array circuit includes an LED pair, and an AC power source for supplying an AC voltage to the LED pair. The LED pair includes a first LED and a second LED that are connected in parallel to each other with biasing polarity connected in reverse.

    摘要翻译: 提供了一种LED阵列电路,其具有降低的功率消耗并且可以保护LED免受反向电压的影响。 LED阵列电路包括LED对,以及用于向LED对提供AC电压的AC电源。 LED对包括彼此并联连接的偏置极性相反的第一LED和第二LED。

    Backlight apparatus reduced in thickness
    8.
    发明申请
    Backlight apparatus reduced in thickness 失效
    背光装置的厚度减小

    公开(公告)号:US20060083019A1

    公开(公告)日:2006-04-20

    申请号:US11059406

    申请日:2005-02-17

    IPC分类号: G02F1/1335

    摘要: The invention relates to a backlight apparatus in use for an LCD, in which a plurality of bar-shaped first LED light sources are arranged on the reflective plate to laterally emit light. A plurality of light shades are arranged above the first light sources. A transparent plate is placed above the light shades. Scattering patterns are formed in the bottom of the transparent plate in positions corresponding to the light shades. A bar-shaped second LED light source is arranged at a side of the transparent plate to emit light into the transparent plate. The light source arranged at the side of the transparent plate prevents the formation of dark areas as a problem in the prior art, thereby enhancing the entire uniformity of light. Then, the backlight apparatus can be maintained thin even when applied to a large-sized LCD.

    摘要翻译: 本发明涉及一种用于LCD的背光装置,其中多个条形第一LED光源被布置在反射板上以横向发光。 多个浅色调布置在第一光源的上方。 透明板放置在浅色调之上。 散射图案形成在透明板底部的对应于浅色调的位置上。 在透明板的一侧设置条状的第二LED光源,以将光发射到透明板中。 布置在透明板一侧的光源防止了现有技术中的黑色区域的形成,从而增强了光的整体均匀性。 然后,即使应用于大型LCD也能够使背光装置保持薄型化。

    White light emitting device
    10.
    发明申请
    White light emitting device 有权
    白色发光装置

    公开(公告)号:US20070228935A1

    公开(公告)日:2007-10-04

    申请号:US11723961

    申请日:2007-03-22

    IPC分类号: H01L33/00

    摘要: A high quality white light emitting device suitable for miniaturization. The white light emitting device according to the present invention includes a substrate and a light emitting structure composed of an n-semiconductor layer, an active layer and a p-semiconductor layer. The light emission structure emits first emission light. The white light emitting device also includes a wavelength-converting film for absorbing and converting the first emission light to second emission light of another wavelength. The wavelength-converting film is made of europium-silicate.

    摘要翻译: 适合小型化的高品质白光发光装置。 根据本发明的白色发光器件包括基板和由n半导体层,有源层和p半导体层构成的发光结构。 发光结构发射第一发射光。 白色发光装置还包括用于吸收并将第一发射光转换成另一波长的第二发射光的波长转换膜。 波长转换膜由硅酸铕制成。