公开(公告)号：US20060169999A1

公开(公告)日：2006-08-03

申请号：US11319101

申请日：2005-12-28

申请人： Young Park ,  Seung Lee ,  Hun Hahm ,  Hyung Kim ,  Bum Kim ,  Young Jeong ,  Ho Ahn ,  Jung Park

发明人： Young Park ,  Seung Lee ,  Hun Hahm ,  Hyung Kim ,  Bum Kim ,  Young Jeong ,  Ho Ahn ,  Jung Park

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

摘要： The invention relates to an LED package frame and an LED package incorporating the same. The LED package frame comprises an LED chip; and a heat conductive member made of a lump of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member to separate the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability. Also, it is possible to provide an LED package frame and a high power LED package by fixing the lead fixed to the heat conductive member without a jig.

摘要翻译： 本发明涉及一种LED封装框架和一个包含该LED封装框架的LED封装件。 LED封装框架包括LED芯片; 以及由高导热性材料块制成的导热构件。 导热构件在侧部具有接收部，并且安装有LED芯片。 引线一端插入导热部件的接收部分，并与LED芯片电连接。 电绝缘层被放置在引导件和导热构件的接收部分之间的紧密接触中以将引线与接收部分分离。 通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。 此外，通过将固定在导热构件上的引线固定而不用夹具，可以提供LED封装框架和大功率LED封装。

公开(公告)号：US20060157657A1

公开(公告)日：2006-07-20

申请号：US11304821

申请日：2005-12-16

申请人： Young Jeong ,  Hun Hahm ,  Hyung Kim ,  Jung Park ,  Young Park ,  Ho Ahn ,  Bum Kim

发明人： Young Jeong ,  Hun Hahm ,  Hyung Kim ,  Jung Park ,  Young Park ,  Ho Ahn ,  Bum Kim

IPC分类号： G02B27/00

CPC分类号： H05B33/0821 ,  G02F1/133603 ,  Y02B20/341

摘要： Provided is an LED array circuit that has reduced power consumption and can protect an LED from a reverse voltage. The LED array circuit includes an LED pair, and an AC power source for supplying an AC voltage to the LED pair. The LED pair includes a first LED and a second LED that are connected in parallel to each other with biasing polarity connected in reverse.

摘要翻译： 提供了一种LED阵列电路，其具有降低的功率消耗并且可以保护LED免受反向电压的影响。 LED阵列电路包括LED对，以及用于向LED对提供AC电压的AC电源。 LED对包括彼此并联连接的偏置极性相反的第一LED和第二LED。

公开(公告)号：US20060187651A1

公开(公告)日：2006-08-24

申请号：US11136529

申请日：2005-05-25

申请人： Hyung Kim ,  Jung Park ,  Ho Ahn ,  Young Jeong ,  Young Park ,  Hun Hahm ,  Bum Kim

发明人： Hyung Kim ,  Jung Park ,  Ho Ahn ,  Young Jeong ,  Young Park ,  Hun Hahm ,  Bum Kim

IPC分类号： G01D11/28

CPC分类号： G02B6/0021 ,  G02B6/0038 ,  G02B6/0041 ,  G02F1/133603

摘要： A direct-illumination backlight apparatus uses LEDs as a light source. This backlight apparatus comprises: a flat reflective plate; an LED light source arranged on the reflective plate; a transparent plate arranged above the LED light source; a scattering pattern arranged on an underside of the transparent plate in a position corresponding to the LED light source; and a light guide made of transparent material, and arranged around the scattering pattern to introduce light incident from below into the transparent plate so that the light is internally reflected by the transparent plate. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel. This can remove any dark area above the LED light source in the transparent plate and thus reduce the thickness of the direct-illumination backlight apparatus.

摘要翻译： 直接照明背光装置使用LED作为光源。 该背光装置包括：平面反射板; 布置在所述反射板上的LED光源; 布置在LED光源上方的透明板; 散布图案，布置在与LED光源相对应的位置的透明板的下侧上; 以及由透明材料制成的导光体，并且布置在散射图案周围以将从下方入射的光引入透明板，使得光被透明板内部反射。 该光导用于从LED光源引入部分光，使得部分光被捕获在透明板的内部，散射图用于将捕获的光束分散在LED光源正上方的位置，从而 散射的光束从透明板向LCD面板逸出。 这可以去除透明板中的LED光源上方的任何暗区，从而减小直射照明背光装置的厚度。

公开(公告)号：US20060171151A1

公开(公告)日：2006-08-03

申请号：US11318837

申请日：2005-12-28

申请人： Young Park ,  Hyung Kim ,  Jung Park ,  Ho Ahn ,  Young Jeong ,  Hun Hahm ,  Bum Kim

发明人： Young Park ,  Hyung Kim ,  Jung Park ,  Ho Ahn ,  Young Jeong ,  Hun Hahm ,  Bum Kim

IPC分类号： F21V5/00

CPC分类号： H01L33/60 ,  F21K9/68 ,  H01L33/54

摘要： A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.

摘要翻译： 提供了侧面发射型LED封装。 LED封装包括LED芯片，下部结构和上部结构。 下部结构具有下反射镜和透明密封构件。 下部结构支持LED芯片。 下镜从LED芯片向上和向外延伸，从而将来自LED芯片的光线向上反射。 透明密封件形成在下反射镜内部的LED芯片周围。 上部结构组合到下部结构的上部，以将由下部结构向上反射的光反射到径向横向方向。 如上所述，下部结构和上部结构彼此分开设置并组合，从而提高了密封构件的模制效率，并且可以容易地制造侧面发射型LED封装。

公开(公告)号：US20060146530A1

公开(公告)日：2006-07-06

申请号：US11134430

申请日：2005-05-23

申请人： Jung Park ,  Hun Hahm ,  Ho Ahn ,  Bum Kim ,  Young Park ,  Hyung Kim ,  Young Jeong

发明人： Jung Park ,  Hun Hahm ,  Ho Ahn ,  Bum Kim ,  Young Park ,  Hyung Kim ,  Young Jeong

IPC分类号： F21V7/00

CPC分类号： G02F1/133603 ,  G02F1/133605

摘要： This invention relates to an LED backlight apparatus. The LED backlight apparatus comprises: a housing having an upper opening; a reflective sheet provided on a bottom inside the housing; a plurality of LED light sources arranged above the reflective sheet at a predetermined distance to emit light toward the reflective sheet; and a light source support connected to a side wall of the housing to support the LED light sources. The light sources are arranged opposite to the reflective sheet so that light beams emitted from the LED light sources reflect from the reflective sheet before entering a diffuser plate behind the LED light sources from the reflective sheet, thereby potentially reducing the thickness of the backlight apparatus while ensuring a distance for the light beams to sufficiently mix together before entering the differ plate.

摘要翻译： 本发明涉及一种LED背光装置。 LED背光装置包括：具有上开口的壳体; 设置在所述壳体内的底部的反射片; 多个LED光源，以预定距离布置在反射片上方，以向反射片发射光; 以及连接到壳体的侧壁以支撑LED光源的光源支撑件。 光源与反射片相对布置，使得从LED光源发射的光束从反射片反射到反射片之后，从LED反射片进入漫射板后面，从而潜在地减小背光装置的厚度，同时 确保在进入不同板之前使光束充分混合在一起的距离。

公开(公告)号：US20060083021A1

公开(公告)日：2006-04-20

申请号：US11060286

申请日：2005-02-18

申请人： Young Jeong ,  Hyung Kim ,  Jung Park ,  Ho Ahn ,  Young Park ,  Bum Kim ,  Hun Hahm

发明人： Young Jeong ,  Hyung Kim ,  Jung Park ,  Ho Ahn ,  Young Park ,  Bum Kim ,  Hun Hahm

IPC分类号： F21V7/04

CPC分类号： G02B6/0021 ,  G02B6/0036 ,  G02B6/0055 ,  G02B6/0061 ,  G02B6/0068 ,  G02B6/0076

摘要： The present invention relates to a backlight apparatus used in an LCD, in which upper and lower reflective plates are installed under upper and lower transparent plates, respectively. The lower transparent plates and the lower reflective plates introduce light generated by lower light sources in upward directions and the upper transparent plate and the upper reflective plates introduce light generated by an upper light source into those areas, which are not lighted by the lower light sources. This can prevent the formation of dark areas above the lower light sources as a problem of a conventional large-sized backlight apparatus, thereby enhancing the overall uniformity of light. In this way, the backlight apparatus of the invention can be designed thin even when applied to a large-sized LCD.

摘要翻译： 本发明涉及一种在LCD中使用的背光装置，其中上反射板和下反射板分别安装在上透明板和下透明板之下。 下透明板和下反射板在向上方向引入由下光源产生的光，并且上透明板和上反射板将由上光源产生的光引入那些未被下光源照射的区域 。 这可以防止在较低光源之上形成暗区域作为常规大型背光装置的问题，从而增强光的整体均匀性。 以这种方式，即使应用于大型LCD也能够将本发明的背光装置设计得很薄。

公开(公告)号：US20060034097A1

公开(公告)日：2006-02-16

申请号：US10953816

申请日：2004-09-30

申请人： Hun Hahm ,  Jung Park ,  Young Jeong ,  Young Park ,  Hyung Kim ,  Ho Ahn

发明人： Hun Hahm ,  Jung Park ,  Young Jeong ,  Young Park ,  Hyung Kim ,  Ho Ahn

IPC分类号： F21V7/04

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/60

摘要： The present invention relates to an LED lens, in which a planar bottom has a pair of halves symmetrically connected with each other about a reference line and narrowed in the vicinity of the reference line. A pair of substantially semicircular reflecting surfaces are extended from both edges of the bottom connected with both ends of the reference line. A radiating surface is connected with remaining edges of the bottom and semicircular edges of the reflecting surfaces. The reflecting surfaces reflect light beams are introduced from the LED chip through the bottom toward the radiating surface. The radiating surface radiates the light beams to the outside when the light beams are introduced to the radiating surface through reflection from the reflecting surfaces and directly through the bottom, so that the light beams are radiated to the outside in a predetermined beam angle.

摘要翻译： 本发明涉及一种LED透镜，其中平面底部具有围绕参考线彼此对称连接并在基准线附近变窄的一对半部。 一对基本上半圆形的反射表面从与参考线的两端连接的底部的两个边缘延伸。 辐射表面与反射表面的底部和半圆形边缘的剩余边缘连接。 反射面反射光束从LED芯片通过底部朝向辐射表面引入。 当光束通过反射表面反射而直接通过底部将光束引入辐射表面时，辐射表面将光束照射到外部，使得光束以预定的光束角度辐射到外部。

公开(公告)号：US20060055843A1

公开(公告)日：2006-03-16

申请号：US10997895

申请日：2004-11-29

申请人： Hun Hahm ,  Jung Park ,  Young Jeong ,  Young Park ,  Hyung Kim ,  Ho Ahn

发明人： Hun Hahm ,  Jung Park ,  Young Jeong ,  Young Park ,  Hyung Kim ,  Ho Ahn

IPC分类号： G02F1/1335

CPC分类号： G02B6/0028 ,  G02B5/021 ,  G02B5/0284 ,  G02B6/0018 ,  G02B6/003 ,  G02B6/0038 ,  G02B6/0068 ,  G02B6/0073

摘要： The invention relates to an LCD backlight apparatus, which includes a light guide plate placed under an LCD panel of the LCD to guide light to the LCD panel. The light guide plate has an even upper surface and a scattering pattern formed in a bottom surface. A plurality of monochromatic light sources are placed in line at a side of the light guide plate to radiate light along the plane direction of the light guide plate between the upper and bottom surfaces of the light guide plate. The light sources are adapted to radiate light beams in a predetermined beam angle so that the light beams reach the scattering pattern only after having propagated a predetermined reference length necessary for forming white light when mixed together. The LCD backlight apparatus can reduce the Bezel width without increasing the thickness of an LCD.

摘要翻译： 本发明涉及一种LCD背光装置，其中包括一个导光板，该导光板放置在LCD的LCD面板的下方，以将光引向LCD面板。 导光板具有均匀的上表面和形成在底面中的散射图案。 多个单色光源在导光板的一侧成直线放置，以在导光板的上表面和底表面之间沿着导光板的平面方向辐射光。 光源适于以预定的光束角度辐射光束，使得光束仅在已经传播了当混合在一起形成白光所需的预定参考长度之后才到达散射图案。 LCD背光装置可以在不增加LCD的厚度的情况下减少边框宽度。

公开(公告)号：US20060208269A1

公开(公告)日：2006-09-21

申请号：US11370021

申请日：2006-03-08

申请人： Bum Kim ,  Hyung Kim ,  Ho Ahn ,  Young Jeong ,  Sung Yang

发明人： Bum Kim ,  Hyung Kim ,  Ho Ahn ,  Young Jeong ,  Sung Yang

IPC分类号： H01L33/00

CPC分类号： H01L33/54 ,  G02F1/133603 ,  G02F1/133615 ,  H01L33/60 ,  H01L2933/0091

摘要： The invention provides an LED package and a backlight device incorporating the LED lens. The LED package has a bottom surface and a light exiting surface cylindrically extended around a central axis of the package from the bottom surface. Also, a reflecting surface is positioned on an opposite side of the bottom surface and symmetrical around the central axis such that light incident from the bottom surface is reflected toward the light exiting surface. Further, a scattering area is formed on the reflecting surface. According to the invention, by applying scattering materials on the reflecting surface of the LED package, a reflecting paper does not need to be attached, thereby simplifying a process and reducing the manufacture time and cost.

摘要翻译： 本发明提供了一种LED封装和结合了LED透镜的背光装置。 LED封装具有底表面和从底表面围绕封装的中心轴线圆柱形延伸的光出射表面。 此外，反射表面位于底表面的相对侧并且围绕中心轴对称，使得从底表面入射的光被反射到光出射表面。 此外，在反射面上形成散射区域。 根据本发明，通过在LED封装的反射面上施加散射材料，不需要附着反射纸，从而简化了工艺并缩短了制造时间和成本。

公开(公告)号：US20060284203A1

公开(公告)日：2006-12-21

申请号：US11444397

申请日：2006-06-01

申请人： Kyung Han ,  Hun Hahm ,  Dae Kim ,  Ho Ahn ,  Seong Han ,  Young Park ,  Seon Lee

发明人： Kyung Han ,  Hun Hahm ,  Dae Kim ,  Ho Ahn ,  Seong Han ,  Young Park ,  Seon Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.

摘要翻译： 本发明涉及一种侧面发光LED封装及其制造方法。 本发明提供一种用于从侧向发光的侧光发射LED封装件，其包括形成有电极的基板。 封装还包括设置在基板上的光源，覆盖并保护其上具有光源的基板的模制部件和覆盖模制部件的外表面的反射层。 具有反射层的模制部件在其一侧形成透光表面。 本发明允许容易地制造所需形状的反射表面，而不管LED芯片尺寸如何，小型化，LED阵列中的批量生产，显着提高生产率。