摘要:
The present invention relates to novel thiourea derivatives as a modulator for vanilloid receptor (VR) and the pharmaceutical compositions containing the same. As diseases associated with the activity of vanilloid receptor, pain acute pain, chronic pain, neuropathic pain, post-operative pain, migraine, arthralgia, neuropathies, nerve injury, diabetic neuropathy, neurodegeneration, neurotic skin disorder, stroke, urinary bladder hypersensitiveness, irritable bowel syndrome, a respiratory disorder such as asthma or chronic obstructive pulmonary disease, irritation of skin, eye or mucous membrane, fervescence, stomach-duodenal ulcer, inflammatory bowel disease and inflammatory diseases can be enumerated. The present invention provides a pharmaceutical composition for prevention or treatment of these diseases.
摘要:
A heat pump equipped with an extraction heat exchanger includes a compressor sucking low-temperature-and-low-pressure liquid refrigerant, and compressing and discharging the low-temperature-and-low-pressure liquid refrigerant into high-temperature-and-high-pressure liquid refrigerant, a condenser in which air passing therethrough absorbs heat from the liquid refrigerant to liquefy the liquid refrigerant, an evaporator in which refrigerant absorbs heat from indoor air and is evaporated to cool indoor air, a main electronic expansion valve connected between the condenser and the evaporator to decompress the liquid refrigerant liquefied in the condenser such that the decompressed refrigerant is easily evaporated in the evaporator and flows at a predetermined flow rate; and the extraction heat exchanger branching a part of the high-temperature-and-high-pressure liquid refrigerant, and performing and bypassing heat exchange between high-temperature-and-high-pressure super-cooled liquid refrigerant and high-temperature-and-high-pressure refrigerant passing through a heat exchanging refrigerant tube between the condenser and the main electronic expansion valve to an accumulator.
摘要:
A laser induced thermal imaging (LITI) apparatus and a method of making an electronic device using the same are disclosed. The LITI apparatus includes a chamber, a substrate support, a contact frame, and a laser source or oscillator. The LITI apparatus transfers a transferable layer from a film donor device onto a surface of an intermediate electronic device. The LITI apparatus uses a magnetic force to provide a close contact between the transferable layer and the surface of the intermediate device. The magnetic force is generated by magnetic materials formed in two components of the LITI apparatus that are spaced apart interposing transferable layer and the surface of the intermediate device. Magnets or magnetic materials are formed in the two following components of the LITI apparatus: 1) the intermediate device and the film donor device; 2) the intermediate device and the contact frame; 3) the substrate support and the film donor device; or 4) the substrate support and the contact frame.
摘要:
A laser induced thermal imaging (LITI) apparatus and a method of making an electronic device using the same are disclosed. The LITI apparatus includes a chamber, a substrate support, a contact frame, and a laser source or oscillator. The LITI apparatus transfers a transferable layer from a film donor device onto a surface of an intermediate electronic device. The LITI apparatus uses a magnetic force to provide a close contact between the transferable layer and the surface of the intermediate device. The magnetic force is generated by magnetic materials formed in two components of the LITI apparatus that are spaced apart interposing transferable layer and the surface of the intermediate device. Magnets or magnetic materials are formed in the two following components of the LITI apparatus: 1) the intermediate device and the film donor device; 2) the intermediate device and the contact frame; 3) the substrate support and the film donor device; or 4) the substrate support and the contact frame.
摘要:
A laser induced thermal imaging (LITI) apparatus and a method of making an electronic device using the same are disclosed. The LITI apparatus includes a chamber, a substrate support, a contact frame, and a laser source or oscillator. The LITI apparatus transfers a transferable layer from a film donor device onto a surface of an intermediate electronic device. The LITI apparatus uses a magnetic force to provide a close contact between the transferable layer and the surface of the intermediate device. The magnetic force is generated by magnetic materials formed in two components of the LITI apparatus that are spaced apart interposing transferable layer and the surface of the intermediate device. Magnets or magnetic materials are formed in the two following components of the LITI apparatus: 1) the intermediate device and the film donor device; 2) the intermediate device and the contact frame; 3) the substrate support and the film donor device; or 4) the substrate support and the contact frame.
摘要:
A laser induced thermal imaging (LITI) apparatus and a method of making an electronic device using the same are disclosed. The LITI apparatus includes a chamber, a substrate support, a contact frame, and a laser source or oscillator. The LITI apparatus transfers a transferable layer from a film donor device onto a surface of an intermediate electronic device. The LITI apparatus uses a magnetic force to provide a close contact between the transferable layer and the surface of the intermediate device. The magnetic force is generated by magnetic materials formed in two components of the LITI apparatus that are spaced apart interposing transferable layer and the surface of the intermediate device. Magnets or magnetic materials are formed in the two following components of the LITI apparatus: 1) the intermediate device and the film donor device; 2) the intermediate device and the contact frame; 3) the substrate support and the film donor device; or 4) the substrate support and the contact frame.
摘要:
A laser induced thermal imaging apparatus and a manufacturing method of organic light emitting diodes using the same, which reduce or prevent the occurrence of impurities or void between an acceptor substrate and a donor film while performing a laser induced thermal imaging in a vacuum state. A laser induced thermal imaging apparatus includes: a substrate stage including an acceptor substrate for receiving an imaging layer, the imaging layer being formed on the acceptor substrate, and an electromagnet, a donor film having a permanent magnet being placed and laminated on the substrate stage, and the electromagnet forming a magnetic force with a permanent magnet of the donor film; a laser oscillator for irradiating a laser to the donor film; and a chamber having at least the substrate stage located therein.
摘要:
A laser induced thermal imaging (LITI) apparatus and a method of making an electronic device using the same are disclosed. The LITI apparatus includes a chamber, a substrate support, a contact frame, and a laser source or oscillator. The LITI apparatus transfers a transferable layer from a film donor device onto a surface of an intermediate electronic device. The LITI apparatus uses a magnetic force to provide a close contact between the transferable layer and the surface of the intermediate device. The magnetic force is generated by magnetic materials formed in two components of the LITI apparatus that are spaced apart interposing transferable layer and the surface of the intermediate device. Magnets or magnetic materials are formed in the two following components of the LITI apparatus: 1) the intermediate device and the film donor device; 2) the intermediate device and the contact frame; 3) the substrate support and the film donor device; or 4) the substrate support and the contact frame.
摘要:
Methods of forming integrated circuit devices include patterning an electrically insulating layer to support dual-damascene interconnect structures therein. The steps of patterning the electrically insulating layer include using multiple planarization layers having different porosity characteristics. Forming an interconnect structure within an integrated circuit device may include forming an electrically insulating layer on a substrate and forming at least one via hole extending at least partially through the electrically insulating layer. The at least one via hole is filled with a first electrically insulating material having a first porosity. The filled at least one via hole is then covered with a second electrically insulating material layer having a second porosity lower than the first porosity. The second electrically insulating material layer is selectively etched back to expose a first portion of the first electrically insulating material in the at least one via hole. The electrically insulating layer is selectively etched to define a trench therein that exposes a second portion of the first electrically insulating material in the at least one via hole. The first electrically insulating material, which has a relatively high degree of porosity, is then removed from the at least one via hole. This removal step may be performed using a relatively mild ashing process because of the high porosity of the first electrically insulating material.