摘要:
Disclosed is an orthodontic appliance for straightening misaligned teeth. The orthodontic appliance is made of a shape memory polymer, and is formed in a cap-shaped tray capable of covering the maxillary or mandibular teeth. An original shape of the tray-type orthodontic appliance made of the shape memory polymer is identical to that of perfectly aligned teeth obtained after orthodontic treatment, and a temporarily formed shape of the tray-type orthodontic appliance is identical to that of the teeth alignment of a patient before orthodontic treatment. The tray-type orthodontic appliance is restored to the original shape memorized at a temperature above a specified glass transition temperature. The orthodontic appliance can be easily manufactured to perform orthodontic treatment, also providing appealing esthetics, in which the orthodontic appliance can be colored to be identical to a tooth with inexpensive manufacturing cost.
摘要:
A method of manufacturing a single crystal ingot, and a single crystal ingot and a wafer manufactured thereby are provided. The method of manufacturing a single crystal ingot according to an embodiment includes forming a silicon melt in a crucible inside a chamber, preparing a seed crystal on the silicon melt, and growing a single crystal ingot from the silicon melt, and pressure of the chamber may be controlled in a range of 90 Torr to 500 Torr.
摘要:
The present invention reports a defect that has not been reported, and discloses a defect-controlled silicon ingot, a defect-controlled wafer, and a process and apparatus for manufacturing the same. The new defect is a crystal defect generated when a screw dislocation caused by a HMCZ (Horizontal Magnetic Czochralski) method applying a strong horizontal magnetic field develops into a jogged screw dislocation and propagates to form a cross slip during thermal process wherein a crystal is cooled. The present invention changes the shape and structure of an upper heat shield structure arranged between a heater and an ingot above a silicon melt, and controls initial conditions or operation conditions of a silicon single crystalline ingot growth process to reduce a screw dislocation caused by a strong horizontal magnetic field and prevent the screw dislocation from propagating into a cross slip.
摘要翻译:本发明报道了未报道的缺陷,并公开了缺陷控制硅锭,缺陷控制晶片及其制造方法和装置。 新的缺陷是当由施加强水平磁场的HMCZ(Horizontal Magnetic Czochralski)方法引起的螺旋位错产生于慢跑螺钉位错时产生的晶体缺陷,并且在冷却晶体的热处理期间传播以形成交叉滑移。 本发明改变了布置在硅熔体上方的加热器和锭之间的上部隔热结构的形状和结构,并且控制了硅单晶锭生长过程的初始条件或操作条件以减少由强的 水平磁场,防止螺丝错位传播到十字滑移。
摘要:
An UpLink (UL) scheduling method and apparatus considering a characteristic of a power amplifier in a mobile communication terminal are provided. The UL scheduling method includes calculating a packet transmission time, which minimizes energy consumed in packet transmission, by using a Direct Current (DC) voltage used in a power amplifier for signal amplification and by using nonlinear amplification efficiency; and scheduling UL data by using the calculated packet transmission time.
摘要:
An apparatus and method for updating a neighbor list in a mobile communication system are provided. The system includes a Mobile Station (MS), a second Base Station (BS), and a first BS. The MS stores first log information, performs a network entry process with the second BS, and generates and transmits second log information to the second BS. The second BS allocates a bandwidth to the MS, receives the second log information, determines if neighbor list update is required using the second log information and, if the neighbor list update is required, updates a neighbor list and transmits the updated neighbor list information to the previous BS.
摘要:
The present invention reports a defect that has not been reported, and discloses a defect-controlled silicon ingot, a defect-controlled wafer, and a process and apparatus for manufacturing the same. The new defect is a crystal defect generated when a screw dislocation caused by a HMCZ (Horizontal Magnetic Czochralski) method applying a strong horizontal magnetic field develops into a jogged screw dislocation and propagates to form a cross slip during thermal process wherein a crystal is cooled. The present invention changes the shape and structure of an upper heat shield structure arranged between a heater and an ingot above a silicon melt, and controls initial conditions or operation conditions of a silicon single crystalline ingot growth process to reduce a screw dislocation caused by a strong horizontal magnetic field and prevent the screw dislocation from propagating into a cross slip.
摘要翻译:本发明报道了未报道的缺陷,并公开了缺陷控制硅锭,缺陷控制晶片及其制造方法和装置。 新的缺陷是当由施加强水平磁场的HMCZ(Horizontal Magnetic Czochralski)方法引起的螺旋位错产生于慢跑螺钉位错时产生的晶体缺陷,并且在冷却晶体的热处理期间传播以形成交叉滑移。 本发明改变了布置在硅熔体上方的加热器和锭之间的上部隔热结构的形状和结构,并且控制了硅单晶锭生长过程的初始条件或操作条件以减少由强的 水平磁场,防止螺丝错位传播到十字滑移。
摘要:
The present invention reports a defect that has not been reported, and discloses a defect-controlled silicon ingot, a defect-controlled wafer, and a process and apparatus for manufacturing the same. The new defect is a crystal defect generated when a screw dislocation caused by a HMCZ (Horizontal Magnetic Czochralski) method applying a strong horizontal magnetic field develops into a jogged screw dislocation and propagates to form a cross slip during thermal process wherein a crystal is cooled. The present invention changes the shape and structure of an upper heat shield structure arranged between a heater and an ingot above a silicon melt, and controls initial conditions or operation conditions of a silicon single crystalline ingot growth process to reduce a screw dislocation caused by a strong horizontal magnetic field and prevent the screw dislocation from propagating into a cross slip.
摘要翻译:本发明报道了未报道的缺陷,并公开了缺陷控制硅锭,缺陷控制晶片及其制造方法和装置。 新的缺陷是当由施加强水平磁场的HMCZ(Horizontal Magnetic Czochralski)方法引起的螺旋位错产生于慢跑螺钉位错时产生的晶体缺陷,并且在冷却晶体的热处理期间传播以形成交叉滑移。 本发明改变了布置在硅熔体上方的加热器和锭之间的上部隔热结构的形状和结构,并且控制了硅单晶锭生长过程的初始条件或操作条件以减少由强的 水平磁场,防止螺丝错位传播到十字滑移。
摘要:
The present invention reports a defect that has not been reported, and discloses a defect-controlled silicon ingot, a defect-controlled wafer, and a process and apparatus for manufacturing the same. The new defect is a crystal defect generated when a screw dislocation caused by a HMCZ (Horizontal Magnetic Czochralski) method applying a strong horizontal magnetic field develops into a jogged screw dislocation and propagates to form a cross slip during thermal process wherein a crystal is cooled. The present invention changes the shape and structure of an upper heat shield structure arranged between a heater and an ingot above a silicon melt, and controls initial conditions or operation conditions of a silicon single crystalline ingot growth process to reduce a screw dislocation caused by a strong horizontal magnetic field and prevent the screw dislocation from propagating into a cross slip.
摘要翻译:本发明报道了未报道的缺陷,并公开了缺陷控制硅锭,缺陷控制晶片及其制造方法和装置。 新的缺陷是当由施加强水平磁场的HMCZ(Horizontal Magnetic Czochralski)方法引起的螺旋位错产生于慢跑螺钉位错时产生的晶体缺陷,并且在冷却晶体的热处理期间传播以形成交叉滑移。 本发明改变了布置在硅熔体上方的加热器和锭之间的上部隔热结构的形状和结构,并且控制了硅单晶锭生长过程的初始条件或操作条件以减少由强的 水平磁场,防止螺丝错位传播到十字滑移。
摘要:
A method and apparatus for providing load state information of a Base Station (BS) in a broadband wireless communication system are provided. The method includes determining a ratio of a whole allocated resource compared to a whole resource of the BS and a ratio of a resource allocated for a rate requiring security compared to the whole resource, generating at least one load indicator for indicating a first value expressing the ratio of the whole allocated resource and a second value expressing the ratio of the resource allocated for the rate requiring security, and transmitting the at least one load indicator.
摘要:
The present invention reports a defect that has not been reported, and discloses a defect-controlled silicon ingot, a defect-controlled wafer, and a process and apparatus for manufacturing the same. The new defect is a crystal defect generated when a screw dislocation caused by a HMCZ (Horizontal Magnetic Czochralski) method applying a strong horizontal magnetic field develops into a jogged screw dislocation and propagates to form a cross slip during thermal process wherein a crystal is cooled. The present invention changes the shape and structure of an upper heat shield structure arranged between a heater and an ingot above a silicon melt, and controls initial conditions or operation conditions of a silicon single crystalline ingot growth process to reduce a screw dislocation caused by a strong horizontal magnetic field and prevent the screw dislocation from propagating into a cross slip.