摘要:
A method of fabricating a memory device includes alternately stacking a plurality of insulating layers and a plurality of sacrificial layers on a substrate, forming a channel hole by etching the insulating layers and the sacrificial layers to expose a partial region of the substrate, forming a channel structure in the channel hole, forming an opening by etching the insulating layers and the sacrificial layers to exposed a portion of the substrate, forming a plurality of side openings that include first side openings and a second side opening by removing the sacrificial layers through the opening, forming gate electrodes to fill the first side openings, and forming a blocking layer to fill the second side opening.
摘要:
A vertical semiconductor device includes a channel structure extending from a substrate in a first direction perpendicular to an upper surface of the substrate, and a ground selection line, word lines, and a string selection line sequentially formed on a side surface of the channel structure in the first direction to be separated from one another. The channel structure includes a protruding region formed in a side wall portion of the channel structure between the ground selection line and the upper surface of the substrate, the protruding region protruding in a horizontal direction perpendicular to the first direction.
摘要:
A zoom lens including, in a sequence from an object side to an image plane side: a first lens group having a negative refractive power; a second lens group having a positive refractive power; a third lens group having a negative refractive power; and a fourth lens group having a positive refractive power. During zooming from a wide angle position to a telephoto position, an interval between the first lens group and the second lens group decreases, an interval between the second lens group and the third lens group increases, and an interval between the third lens group and the fourth lens group decreases. When the location of an object changes from ∞ to a close location, the first lens group is moved toward the object to perform focusing.
摘要:
A compact wide-angle zoom lens and an image pickup device having the same. The zoom lens includes a first lens group having a negative refractive power and a second lens group having a positive refractive power in an order from an object side to an image side, performs zooming by varying a distance between the first and second lens groups, and performs focusing by using a first lens closest to the object side in the second lens group.
摘要:
A compact wide-angle zoom lens and an image pickup device having the same. The zoom lens includes a first lens group having a negative refractive power and a second lens group having a positive refractive power in an order from an object side to an image side, performs zooming by varying a distance between the first and second lens groups, and performs focusing by using a first lens closest to the object side in the second lens group.
摘要:
A fuse area of a semiconductor device capable of preventing moisture-absorption and a method for manufacturing the fuse area are provided. When forming a guard ring for preventing permeation of moisture through the sidewall of an exposed fuse opening portion, an etch stop layer is formed over a fuse line. A guard ring opening portion is formed using the etch stop layer. The guard ring opening portion is filled with a material for forming the uppermost wiring of multi-level interconnect wirings or the material of a passivation layer, thereby forming the guard ring concurrently with the uppermost interconnect wiring or the passivation layer. Accordingly, permeation of moisture through an interlayer insulating layer or the interface between interlayer insulating layers around the fuse opening portion can be efficiently prevented by a simple process. In addition, the etch stop layer is also formed under the fuse opening portion so that an insulating layer remaining on the fuse line can be controlled to have a predetermined thickness when forming the fuse opening portion, thereby improving the cutting efficiency of fuses.
摘要:
Provided is a zoom lens optical system suitable for cameras using solid state imaging devices, which is designed compact, has a high zooming ratio and telecentricity, and compensates for color aberration. The zoom lens optical system includes a first lens group having a positive refractive power, for performing zooming, a second lens group having a negative refractive power, for performing zooming, a third lens group having a positive refractive power, for performing zooming, and a fourth lens group having a positive refractive power. The first, second, third, and fourth lens groups are sequentially arranged from an object and satisfy the following equations: f T f W ≥ 8.0 0.2 ≤ L III f W · f T ≤ 0.6 , where fw denotes the overall focal length of the zoom lens optical system at the wide angle position, fT denotes the overall focal length of the zoom lens optical system at the telephoto position, and LIII denotes the amount of movement of the third lens group from the wide angle position to the telephoto position. Zooming from the wide angle position to a telephoto position is performed so that the distance between the third lens group and the fourth lens group increases.
摘要:
A structure having trench isolation which protects a nitride liner in the trench during subsequent plasma processing. The structure includes a trench formed in a semiconductor substrate, the trench having sidewalls and a bottom. A thermal oxide layer is formed on the bottom and sidewalls of the trench so as to remove substrate damage caused during etching of the semiconductor substrate to form the trench. A material layer is formed on the thermal oxide layer so as to prevent the bottom and sidewalls of the trench from being oxidized. Then, a protection layer is formed on the oxidation barrier layer. The trench is filled with a trench fill material uniformly with respect to the bottom and sidewalls of the trench.
摘要:
A method for manufacturing a VLSI semiconductor memory device, in which a cell transistor is formed in the cell array section of a semiconductor substrate, successively, a cell capacitor. Then, a transistor is formed in the periphery circuit section of the substrate. Therefore, access transistors of the cell array section are formed independently from transistors of the peripheral circuit section, optimizing transistor performance.
摘要:
Semiconductor devices are provided. The semiconductor devices may include a substrate, a ground selection gate electrode, and a channel structure. The channel structure may extend the ground selection gate electrode in a first direction perpendicular to a top surface of the substrate, and include a channel layer, a channel contact layer, and a stepped portion. The channel contact layer may contact the substrate and include a first width in a second direction perpendicular to the first direction. The channel layer may contact the channel contact layer, include a bottom surface between a bottom surface of the ground selection gate electrode and the top surface of the substrate in the first direction, and include a second width in the second direction different from the first width.