Process to fabricate an integrated micro-fluidic system on a single wafer
    4.
    发明授权
    Process to fabricate an integrated micro-fluidic system on a single wafer 有权
    在单个晶片上制造集成的微流体系统的过程

    公开(公告)号:US06716661B2

    公开(公告)日:2004-04-06

    申请号:US10147006

    申请日:2002-05-16

    IPC分类号: H01L2100

    摘要: Formation of micro-fluidic systems is normally achieved using a multi-wafer fabrication procedure. The present invention teaches how a complete micro-fluidic system can be implemented on a single chip. The invention uses only dry etch processes to form micro-chambers. In particular, it makes use of deep reactive ion etching whereby multiple trenches of differing depths may be formed simultaneously. Buried micro-chambers are formed by isotropically increasing trench widths using an etchant that does not attack the mask so the trenches grow wider beneath the surface until they merge. Deposition of a dielectric layer over the trenches allows some trenches to be sealed and some to be left open. Micro-pumps are formed by including in the micro-chamber roof a layer that is used to change chamber volume either through electrostatically induced motion or through thermal mismatch as a result of its being heated.

    摘要翻译: 微流体系统的形成通常使用多晶片制造程序来实现。 本发明教导了如何在单个芯片上实现完整的微流体系统。 本发明仅使用干蚀刻工艺来形成微室。 特别地,它利用深反应离子蚀刻,从而可以同时形成不同深度的多个沟槽。 通过使用不侵蚀掩模的蚀刻剂各向同性地增加沟槽宽度来形成掩埋的微室,使得沟槽在表面下方变得更宽,直到它们合并。 电介质层沉积在沟槽上方允许一些沟槽被密封,有些则被打开。 通过在微室顶中包含用于通过静电诱导运动或通过其被加热的结果的热失配来改变室容积的层而形成微泵。