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1.发明授权Method of processing semiconductor wafer and semiconductor wafer supporting member 失效半导体晶片和半导体晶片支撑元件的处理方法公开(公告)号：US06718223B1
公开(公告)日：2004-04-06
申请号：US09573463
申请日：2000-05-17
IPC分类号： G06F1900
CPC分类号： H01L21/67294
摘要： A method of processing a semiconductor wafer. The wafer is secured to a wafer supporting member having a data carrier. Information required for working the semiconductor wafer is input to the data carrier. The wafer is then worked according to information read from the data carrier. The data carrier is configured to permit operations such as back grinding, dicing and pickup of the wafer, and prevents wafer breakage when the wafer is carried between different operations.
摘要翻译： 一种处理半导体晶片的方法。 晶片被固定到具有数据载体的晶片支撑构件上。 将半导体晶片加工所需的信息输入到数据载体。 然后根据从数据载体读取的信息对晶片进行加工。 数据载体被配置为允许诸如晶片的背面研磨，切割和拾取等操作，并且当晶片在不同操作之间传送时防止晶片断裂。
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公开(公告)号：US6156423A
公开(公告)日：2000-12-05
申请号：US58591
申请日：1998-04-10
IPC分类号： B32B27/30 , B32B27/28 , C08F290/06 , C09J7/02 , C09J133/00 , H01L21/02 , H01L21/78 , B32B7/12
CPC分类号： H01L21/6836 , B32B27/28 , C09J7/0296 , H01L21/78 , C09J2201/162 , C09J2203/326 , C09J2423/003 , C09J2433/006 , C09J2475/006 , H01L2221/68327 , Y10T428/2809 , Y10T428/2848 , Y10T428/2852
摘要： A layer of base material has a film layer and a barrier layer on the film layer, and also adhesive tape has the base material and an adhesive layer on the barrier layer. Thus, they do not have any fish-eye or foreign substance on their surfaces, so that accuracy in thickness are improved and contamination of a material to be adhered with the adhesive layer is also improved.
摘要翻译： 基材层在膜层上具有膜层和阻挡层，并且胶带在阻挡层上具有基材和粘合剂层。 因此，它们在其表面上没有任何鱼眼或异物，从而提高了厚度的精度，同时改善了粘附层粘附的材料的污染。
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公开(公告)号：US06592973B1
公开(公告)日：2003-07-15
申请号：US09641951
申请日：2000-08-21
IPC分类号： B32B2736
CPC分类号： G06K19/07779 , G06K19/02 , G06K19/07749 , G06K19/07783 , H01L23/293 , H01L2924/0002 , H05K3/284 , Y10S428/901 , Y10T428/24917 , H01L2924/00
摘要： A card sealed by using a composition which includes an acrylate compound polymerizable by an ionizing radiation and 1 to 40 parts by weight of a polyfunctional isocyanate compound per 100 parts by weight of the acrylate compound and can be cured by irradiation of the ionizing radiation and a process for producing a card disposing a coating layer of the composition between a substrate sheet and a cover sheet and curing the coating layer by irradiation of an ionizing radiation.
摘要翻译： 通过使用包含通过电离辐射聚合的丙烯酸酯化合物和每100重量份丙烯酸酯化合物1〜40重量份的多官能异氰酸酯化合物的组合物密封的卡片，并且可以通过照射电离辐射而固化，以及 用于制造在基片和覆盖片之间设置该组合物的涂层的卡并通过照射电离辐射使该涂层固化的方法。
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公开(公告)号：US06171672B2
公开(公告)日：2001-01-09
申请号：US09201383
申请日：1998-11-30
申请人： Hiroshi Koike , Katsuhisa Taguchi , Kazuyoshi Ebe
发明人： Hiroshi Koike , Katsuhisa Taguchi , Kazuyoshi Ebe
IPC分类号： C09J702
CPC分类号： H01L21/67336 , H01L21/6835 , H01L2221/68313 , H01L2924/19041 , Y10T428/14 , Y10T428/1476 , Y10T428/149 , Y10T428/1495 , Y10T428/2839
摘要： A cover tape for chip transportation stuck to a surface of a carrier tape which has parts for accommodating chips formed intermittently in its lengthwise direction, to thereby seal the chip accommodating parts, wherein said cover tape comprises a tape-shaped substrate and pressure sensitive adhesive parts superimposed on one side of the tape-shaped substrate so that the pressure sensitive adhesive parts do not face the chip accommodating parts, the above pressure sensitive adhesive parts comprising a silicone pressure sensitive adhesive and a crosslinking agent (C) capable of crosslinking therewith, the above silicone pressure sensitive adhesive comprising: (A) a silicone resin component and (B) a silicone rubber component which contains a phenyl group. This cover tape for chip transportation enables avoiding a lifting/separation of cover tape from carrier tape caused by a difference in thermal shrinkage ratio when a polystyrene carrier tape is used.
摘要翻译： 用于芯片输送的盖带粘附到载带的表面上，该载带具有用于容纳沿其长度方向间歇地形成的芯片的部件，从而密封芯片容纳部分，其中所述盖带包括带状基板和压敏粘合部件 叠层在带状基板的一侧，使得压敏粘合剂部分不面向芯片容纳部分，上述压敏粘合剂部件包括硅氧烷压敏粘合剂和能够与其交联的交联剂（C）， （A）有机硅树脂组分和（B）含有苯基的硅橡胶组分。 这种用于芯片输送的覆盖带能够避免当使用聚苯乙烯载带时由于热收缩率差引起的覆盖带与载带的提起/分离。
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公开(公告)号：US5187007A
公开(公告)日：1993-02-16
申请号：US549496
申请日：1990-06-29
IPC分类号： C09J4/06 , C09J7/02 , C09J175/16 , H01L21/00 , H01L21/302 , H01L21/68
CPC分类号： H01L21/6835 , C09J175/16 , C09J4/06 , C09J7/0207 , C09J7/0239 , C09J7/0246 , H01L21/302 , H01L21/67132 , H01L21/6836 , C09J2203/326 , H01L2221/68322 , H01L2221/68327 , Y10T428/28 , Y10T428/2809 , Y10T428/2891 , Y10T428/2896
摘要： An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, which compound is a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chips as picked up.
摘要翻译： 根据本发明的粘合片包括在其表面上涂覆有由粘合剂和可辐射聚合化合物组成的粘合剂层的基材，该化合物是分子量为3,000-10,000，优选4,000-8,000的氨基甲酸酯丙烯酸酯低聚物 。 粘合片优选用于使半导体晶片进行切割操作，并且没有粘合剂粘附并保留在拾取的晶片芯片的背侧表面上。
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公开(公告)号：US4965127A
公开(公告)日：1990-10-23
申请号：US111849
申请日：1987-10-22
IPC分类号： C09J4/06 , C09J7/02 , C09J175/16 , H01L21/00 , H01L21/302 , H01L21/68
CPC分类号： C09J4/06 , C09J175/16 , C09J7/0207 , C09J7/0239 , C09J7/0246 , H01L21/302 , H01L21/67132 , H01L21/6835 , H01L21/6836 , C08L2205/03 , C08L33/00 , C08L75/04 , C09J2203/326 , H01L2221/68322 , H01L2221/68327 , Y10S428/901 , Y10T428/28 , Y10T428/2809
摘要： An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, which compound is a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chips as picked up.
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公开(公告)号：US4756968A
公开(公告)日：1988-07-12
申请号：US932210
申请日：1986-11-18
IPC分类号： C09J4/06 , C09J7/02 , C09J175/16 , H01L21/00 , H01L21/302 , H01L21/68 , B05D3/06
CPC分类号： C09J4/06 , C09J175/16 , C09J7/0207 , C09J7/0239 , C09J7/0246 , H01L21/302 , H01L21/67132 , H01L21/6835 , H01L21/6836 , C08L2205/03 , C08L33/00 , C08L75/04 , C09J2203/326 , H01L2221/68322 , H01L2221/68327 , Y10S428/901 , Y10T428/28 , Y10T428/2809
摘要： An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, said compound being a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chip as picked up.
摘要翻译： 根据本发明的粘合片包括在其表面上涂覆有由粘合剂和可辐射聚合化合物组成的粘合剂层的基材，所述化合物是分子量为3,000-10,000，优选4,000-8,000的氨基甲酸酯丙烯酸酯低聚物 。 粘合片优选用于对半导体晶片进行切割操作，并且在拾取时没有粘合剂粘附到晶片芯片的背侧表面并保留在其上。
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公开(公告)号：US20060273179A1
公开(公告)日：2006-12-07
申请号：US10514495
申请日：2003-05-14
CPC分类号： G06K19/0739 , G06K19/07749
摘要： The present invention provides an IC tag which has a structure comprising a first adhesive layer formed on a surface of a substrate sheet, an electronic circuit and an IC chip connecting both ends of the electronic circuit, both formed on the surface of the first adhesive layer, and a second adhesive layer covering the electronic circuit and the IC chip. The IC tag further includes a release agent layer formed at positions corresponding to the both ends of the electronic circuit and located at the interface between the substrate sheet and the first adhesive layer. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.
摘要翻译： 本发明提供一种IC标签，其具有包括形成在基板的表面上的第一粘合层，连接电子电路的两端的电子电路和IC芯片，二者形成在第一粘合层的表面上 以及覆盖电子电路和IC芯片的第二粘合层。 IC标签还包括形成在对应于电子电路的两端的位置并且位于基板和第一粘合剂层之间的界面处的脱模剂层。 当附着在物品上的IC标签被剥离时，内置的电子电路肯定会损坏。
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公开(公告)号：US5691038A
公开(公告)日：1997-11-25
申请号：US361362
申请日：1994-12-21
CPC分类号： C09J7/02 , H05K13/0084 , C09J2201/28 , Y10T428/24793 , Y10T428/28 , Y10T428/2848 , Y10T428/2891
摘要： The present invention provides a cover tape comprising a tapelike base material 1, adhesive parts 2 formed on one side of the base material 1 at both edges along the longitudinal direction thereof, and a nonadhesive resin part 3 formed between the adhesive parts 2 and having substantially the same thickness as that of the adhesive parts 2. This cover tape is used to collectively pack chips and other small items while keeping them separate from each other to thereby permit the storage, transportation and automatic takeout thereof, which cover tape can be rendered very long. Further, the present invention provides a coating applicator suitable for use in the production of the above cover tape.
摘要翻译： 本发明提供一种覆盖带，其包括带状基材1，在基材1的沿着其纵向的两个边缘的一侧上形成的粘合剂部分2和形成在粘合剂部分2之间并具有基本上 与粘合部件2的厚度相同。该盖带用于在保持彼此分离的同时将芯片和其他小物品集中包装，从而允许其保存，运输和自动取出，从而可以使覆盖带非常 长。 此外，本发明提供一种适用于生产上述盖带的涂布器。
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10.发明授权Optical fiber connector cleaner, and method of cleaning optical fiber connector connection surface 有权光纤连接器清洁器，以及清洁光纤连接器连接面的方法公开(公告)号：US07971304B2
公开(公告)日：2011-07-05
申请号：US10568076
申请日：2004-07-09
申请人： Takahisa Kida , Katsuhisa Taguchi
发明人： Takahisa Kida , Katsuhisa Taguchi
CPC分类号： B08B11/00 , G02B6/381 , G02B6/3866
摘要： An optical fiber connector cleaner (1) comprises a housing (10), a winding means (32) and a delivery means (34) for a cleaning tape (T) which are disposed in the housing, a cleaning means (20) having a bar-like cleaning section (21) projecting outwardly of the housing, on the front-end of the cleaning section the cleaning tape delivered from the delivery means being movably mounted under tension in an exposed state, the front-end of the cleaning section being brought into contact with the end surface of an optical fiber connector to thereby clean the end surface, a cleaning section rotating means (23) coaxially connected to the cleaning section in the housing and rotatably supported with respect to the housing; and a transmission means (40) which rotates the winding means and the cleaning section rotating means substantially simultaneously in a predetermined direction through a predetermined angle and then reverses the cleaning section rotating means to its original position.
摘要翻译： 一种光纤连接器清洁器（1），包括壳体（10），绕组装置（32）和用于清洁带（T）的输送装置（34），其设置在壳体中;清洁装置（20） 从壳体向外突出的棒状清洁部分（21），在清洁部分的前端处，从传送装置传送的清洁带在张力下以暴露状态可移动地安装，清洁部分的前端为 与光纤连接器的端面接触，从而清洁端面;清洁部旋转装置，其同轴地连接到壳体中的清洁部分并相对于壳体可旋转地支撑; 以及使卷绕机构和清扫部转动机构基本上同时沿预定方向旋转预定角度的传动装置（40），然后将清洁部分旋转装置反转到其初始位置。
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