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公开(公告)号：US06592973B1
公开(公告)日：2003-07-15
申请号：US09641951
申请日：2000-08-21
IPC分类号： B32B2736
CPC分类号： G06K19/07779 , G06K19/02 , G06K19/07749 , G06K19/07783 , H01L23/293 , H01L2924/0002 , H05K3/284 , Y10S428/901 , Y10T428/24917 , H01L2924/00
摘要： A card sealed by using a composition which includes an acrylate compound polymerizable by an ionizing radiation and 1 to 40 parts by weight of a polyfunctional isocyanate compound per 100 parts by weight of the acrylate compound and can be cured by irradiation of the ionizing radiation and a process for producing a card disposing a coating layer of the composition between a substrate sheet and a cover sheet and curing the coating layer by irradiation of an ionizing radiation.
摘要翻译： 通过使用包含通过电离辐射聚合的丙烯酸酯化合物和每100重量份丙烯酸酯化合物1〜40重量份的多官能异氰酸酯化合物的组合物密封的卡片，并且可以通过照射电离辐射而固化，以及 用于制造在基片和覆盖片之间设置该组合物的涂层的卡并通过照射电离辐射使该涂层固化的方法。
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2.发明授权Flat coil component, characteristic adjusting method of flat coil component, ID tag, and characteristic adjusting method of ID tag 失效扁平线圈部件，扁平线圈部件的特性调整方法，ID标签，ID标签的特性调整方法公开(公告)号：US06853286B2
公开(公告)日：2005-02-08
申请号：US10141976
申请日：2002-05-10
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077 , H01F5/00 , H01F17/00 , H01F21/12 , H01F41/04 , H01Q7/00
CPC分类号： G06K19/0726 , G06K19/07749 , H01F5/003 , H01F21/12 , H01F41/045 , Y10T29/4902
摘要： To present the ID tag including flat coil component, and characteristic adjusting method of ID tag capable of suppressing product fluctuations about the desired characteristic. The flat coil component of the ID tag of the invention comprises a flat coil composed of a conductive material provided continuously and spirally on an insulating substrate, and a jumper disposed on the flat coil with insulation, from one of inner end or outer end of this flat coil to the outside or inside of the flat coil where other end is positioned, in which the jumper is composed of a plurality of jumpers variable in the number of pieces in arrangement. The characteristic is adjusted by varying the number of effective pieces for forming the parallel arrangement.
摘要翻译： 呈现包括扁平线圈分量的ID标签，以及能够抑制关于期望特性的产品波动的ID标签的特性调整方法。 本发明的ID标签的扁平线圈部件包括由在绝缘基板上连续且螺旋地设置的导电材料构成的扁平线圈，以及设置在具有绝缘的扁平线圈上的跳线，从该端子的内端或外端 扁平线圈到平线圈的外部或内部，其中另一端被定位，其中跳线由多个可调节的多个跳线组成。 通过改变用于形成平行布置的有效片的数量来调整特性。
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3.发明授权Reinforcement material for silicon wafer and process for producing IC chip using said material 失效用于硅晶片的增强材料和使用所述材料制造IC芯片的工艺公开(公告)号：US06765289B2
公开(公告)日：2004-07-20
申请号：US09840864
申请日：2001-04-25
申请人： Yasukazu Nakata , Yuichi Iwakata , Takeshi Kondo , Hideo Senoo
发明人： Yasukazu Nakata , Yuichi Iwakata , Takeshi Kondo , Hideo Senoo
IPC分类号： H01L2314
CPC分类号： H01L21/6836 , H01L21/78 , H01L23/3164 , H01L23/562 , H01L24/27 , H01L24/32 , H01L2221/68327 , H01L2224/274 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01058 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/3512 , H01L2924/00
摘要： Reinforcing material having Rockwell hardness of 60 or above and comprising base material and adhesive is formed, and then the reinforcing material is attached to one side of silicon wafer on which circuits are not formed prior to dicing.
摘要翻译： 形成洛氏硬度为60以上并且包含基材和粘合剂的增强材料，然后在切割之前将增强材料附着到未形成回路的硅晶片的一侧。
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4.发明授权Method of processing semiconductor wafer and semiconductor wafer supporting member 失效半导体晶片和半导体晶片支撑元件的处理方法公开(公告)号：US06718223B1
公开(公告)日：2004-04-06
申请号：US09573463
申请日：2000-05-17
IPC分类号： G06F1900
CPC分类号： H01L21/67294
摘要： A method of processing a semiconductor wafer. The wafer is secured to a wafer supporting member having a data carrier. Information required for working the semiconductor wafer is input to the data carrier. The wafer is then worked according to information read from the data carrier. The data carrier is configured to permit operations such as back grinding, dicing and pickup of the wafer, and prevents wafer breakage when the wafer is carried between different operations.
摘要翻译： 一种处理半导体晶片的方法。 晶片被固定到具有数据载体的晶片支撑构件上。 将半导体晶片加工所需的信息输入到数据载体。 然后根据从数据载体读取的信息对晶片进行加工。 数据载体被配置为允许诸如晶片的背面研磨，切割和拾取等操作，并且当晶片在不同操作之间传送时防止晶片断裂。
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公开(公告)号：US06844859B2
公开(公告)日：2005-01-18
申请号：US10293928
申请日：2002-11-14
申请人： Ryuzo Noda , Taiga Matsushita , Yuichi Iwakata
发明人： Ryuzo Noda , Taiga Matsushita , Yuichi Iwakata
CPC分类号： H01Q1/2216 , G06K19/07758 , H01Q1/22 , H01Q7/00 , H01Q21/29
摘要： A loop antenna is constructed by bending a linear conductor so that it forms concavo-convex portions within an antenna plane. As an example, the shape of the loop antenna comprises a long straight line portion (LP) which elongates substantially straight in the direction of the arrow X, a short straight line portion (TP1) which is at a predetermined angle (θ1) with respect to the long straight line portion (LP) and shorter than the long straight line portion (LP), and a short straight line portion (TP2) which is at a predetermined angle (θ3) with respect to the short straight line portion (TP1) and at a predetermined angle (θ2) with respect to the long straight line portion (LP) and has approximately same length as the short straight line portion (TP1), wherein an acute angle portion (TG1) which is formed by the short straight line portions (TP1) and (TP2), and acute angle portions (TG 2, TG 3 and TG4) each having approximately same shape as the acute angle portion (TG1) are succeeding in the opposite direction of the arrow X to the vicinity of a feeding point (P2).
摘要翻译： 通过弯曲线性导体使其在天线平面内形成凹凸部而构成环形天线。 作为示例，环形天线的形状包括沿箭头X的方向基本上直线延伸的长直线部分（LP），相对于预定角度（θ1）的短直线部分（TP1）相对于 相对于长直线部分（LP）短并且比长直线部分（LP）短，并且相对于短直线部分（TP1）处于预定角度（θ3）的短直线部分（TP2） 并且相对于长直线部分（LP）以预定角度（θ2）并且具有与短直线部分（TP1）大致相同的长度，其中由短直线形成的锐角部分（TG1） 每个具有与锐角部分（TG1）大致相同形状的锐角部分（TP1）和（TP2）以及锐角部分（TG2，TG3和TG4）都沿箭头X的相反方向继续到a 喂食点（P2）。
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6.发明申请Connecting Part For Mounting IC Chip, Antenna Circuit, IC Inlet, IC Tag and Method of Adjusting Capacitance 失效连接部件用于安装IC芯片，天线电路，IC入口，IC标签和调整电容的方法公开(公告)号：US20080164326A1
公开(公告)日：2008-07-10
申请号：US11969177
申请日：2008-01-03
申请人： Yuichi Iwakata , Taiga Matsushita
发明人： Yuichi Iwakata , Taiga Matsushita
CPC分类号： G06K19/07749 , G06K19/0726 , G06K19/0775
摘要： When at least one IC chip is mounted on electrode parts, a connecting part for mounting IC chip according to the present invention can control an area of an overlap between the electrode parts on which each IC chip is mounted and each IC chip according to a mounting position of each IC chip. An antenna circuit according to the present invention includes a connecting part for mounting IC chip and an antenna unit of the present invention. An IC inlet according to the present invention includes at least one IC chip on the connecting part for mounting IC chip of the antenna circuit of the present invention.
摘要翻译： 当至少一个IC芯片安装在电极部件上时，根据本发明的用于安装IC芯片的连接部分可以根据安装的方式控制安装有每个IC芯片的电极部件与每个IC芯片之间的重叠区域 每个IC芯片的位置。 根据本发明的天线电路包括用于安装IC芯片的连接部分和本发明的天线单元。 根据本发明的IC入口包括用于安装本发明的天线电路的IC芯片的连接部分上的至少一个IC芯片。
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公开(公告)号：US20070063058A1
公开(公告)日：2007-03-22
申请号：US11509470
申请日：2006-08-24
申请人： Yuichi Iwakata , Chisato Iino , Takehiko Nishikawa
发明人： Yuichi Iwakata , Chisato Iino , Takehiko Nishikawa
CPC分类号： G06K7/10326 , B41J2/4753 , G06K19/0723 , G06K19/08 , G06K19/083
摘要： An IC tag which has a means for recording and erasing invisible information and a means for recording and erasing visible information, both allowing recording and erasing information in a non-contact manner, exhibits flexibility and can have a small size is provided. The IC tag has a means for recording and erasing invisible information and a means for recording and erasing visible information which are disposed on the surface of a support and allow recording and erasure of the information in a non-contact manner, wherein the means for recording and erasing visible information has a layer of a heat sensitive color developing material (I), a layer of a material absorbing light and converting absorbed light into heat (II) and a protective layer (III) laminated on the surface of the support successively from the surface, or (II), (I) and (III) laminated on the surface of the support successively from the surface.
摘要翻译： 具有用于记录和擦除不可见信息的装置的IC标签和用于记录和擦除可见信息的装置，其允许以非接触方式记录和擦除信息，这表现出灵活性并且可以具有小尺寸。 IC标签具有用于记录和擦除不可见信息的装置，以及用于记录和擦除可见信息的装置，其被布置在支撑体的表面上并允许以非接触方式记录和擦除信息，其中记录装置 并且擦除可见信息具有一层热敏彩色显影材料（I），吸收光并将吸收的光转换成热（II）的材料层和层叠在支撑体表面上的保护层（III） 表面，或（II），（I）和（III）从表面上依次层压在支撑体的表面上。
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8.发明授权公开(公告)号：US08392011B2
公开(公告)日：2013-03-05
申请号：US11476382
申请日：2006-06-28
申请人： Takeshi Segawa , Koichi Yamaguchi , Yuichi Iwakata
发明人： Takeshi Segawa , Koichi Yamaguchi , Yuichi Iwakata
CPC分类号： H01L21/67294
摘要： A semiconductor wafer processing tape sticking apparatus is provided and is capable of sticking a semiconductor wafer processing tape to a semiconductor wafer under the optimum conditions based on the processing data that has been written to a data carrier member and that has been read from the data carrier member without accessing the host computer unlike a conventional method. The semiconductor wafer processing tape sticking apparatus includes: a feeding apparatus provided with a feeding shaft to which a semiconductor wafer processing tape winding body can be detachably attached; a tape data read/write device for reading and writing the processing data that has been written to a data carrier member of the semiconductor wafer processing tape winding body; and a tape sticking apparatus for sticking a semiconductor wafer processing tape that has been fed out from the feeding apparatus to the semiconductor wafer based on the processing data that has been read by the tape data read/write device.
摘要翻译： 提供半导体晶片处理带贴附装置，并且能够在最佳条件下将半导体晶片处理带粘贴到半导体晶片处理带上，该条件基于已经写入数据载体成员并从数据载体读取的处理数据 不像常规方法那样访问主机。 半导体晶片处理带贴附装置包括：馈送装置，其具有可以可拆卸地安装半导体晶片加工带卷绕体的馈送轴; 用于读取和写入已经写入到半导体晶片处理带卷绕体的数据载体构件的处理数据的磁带数据读/写装置; 以及胶带粘贴装置，用于根据由磁带数据读/写装置读取的处理数据，将从馈送装置输出的半导体晶片处理带粘贴到半导体晶片。
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公开(公告)号：US07637435B2
公开(公告)日：2009-12-29
申请号：US11509470
申请日：2006-08-24
申请人： Yuichi Iwakata , Chisato Iino , Takehiko Nishikawa
发明人： Yuichi Iwakata , Chisato Iino , Takehiko Nishikawa
IPC分类号： G06K19/06
CPC分类号： G06K7/10326 , B41J2/4753 , G06K19/0723 , G06K19/08 , G06K19/083
摘要： An IC tag has a layer of heat sensitive color developing material (I), a layer of material absorbing light and converting absorbed light into heat (II) and a protective layer (III) laminated on the surface of the support successively from the surface, or (II), (I) and (III) laminated on the surface of the support successively from the surface. This structure permits recording and erasing invisible information and recording and erasing visible information, both allowing recording and erasing information in a non-contact manner. The structure is flexible and can have a small size.
摘要翻译： IC标签具有热敏彩色显影材料层（I），吸收光并将吸收的光转换成热（II）的材料层和从表面依次层压在支撑体表面上的保护层（III） 或（II），（I）和（III）从表面依次层压在支撑体的表面上。 这种结构允许记录和擦除不可见的信息，并且记录和擦除可见信息，这两者都允许以非接触的方式记录和擦除信息。 结构灵活，尺寸小。
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10.发明申请公开(公告)号：US20070162175A1
公开(公告)日：2007-07-12
申请号：US11476382
申请日：2006-06-28
申请人： Takeshi Segawa , Koichi Yamaguchi , Yuichi Iwakata
发明人： Takeshi Segawa , Koichi Yamaguchi , Yuichi Iwakata
IPC分类号： G06F19/00
CPC分类号： H01L21/67294
摘要： A semiconductor wafer processing tape sticking apparatus is provided and is capable of sticking a semiconductor wafer processing tape to a semiconductor wafer under the optimum conditions based on the processing data that has been written to a data carrier member and that has been read from the data carrier member without accessing the host computer unlike a conventional method. The semiconductor wafer processing tape sticking apparatus includes: a feeding apparatus provided with a feeding shaft to which a semiconductor wafer processing tape winding body can be detachably attached; a tape data read/write device for reading and writing the processing data that has been written to a data carrier member of the semiconductor wafer processing tape winding body; and a tape sticking apparatus for sticking a semiconductor wafer processing tape that has been fed out from the feeding apparatus to the semiconductor wafer based on the processing data that has been read by the tape data read/write device.
摘要翻译： 提供半导体晶片处理带贴附装置，并且能够在最佳条件下将半导体晶片处理带粘贴到半导体晶片处理带上，该条件基于已经写入数据载体成员并从数据载体读取的处理数据 不像常规方法那样访问主机。 半导体晶片处理带贴附装置包括：馈送装置，其具有可以可拆卸地安装半导体晶片加工带卷绕体的馈送轴; 用于读取和写入已经写入到半导体晶片处理带卷绕体的数据载体构件的处理数据的磁带数据读/写装置; 以及胶带粘贴装置，用于根据由磁带数据读/写装置读取的处理数据，将从馈送装置输出的半导体晶片处理带粘贴到半导体晶片。
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