-
公开(公告)号：US07281327B2
公开(公告)日：2007-10-16
申请号：US11122369
申请日：2005-05-05
IPC分类号： H01K3/10
CPC分类号： H05K3/427 , H05K1/116 , H05K3/421 , H05K2201/09736 , H05K2203/0353 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： An insulating substrate with metal foils on both sides thereof is prepared, and a through hole that passes through the metal foils and insulating substrate is formed. An electroless copper plating layer is formed on an inner surface of the through hole and a surface of each of the metal foils, followed by the formation of an electrolytic copper plating layer on the overall surface of the electroless copper plating layer. After removing the electrolytic copper plating layer except the portions on the inner surface and a peripheral region of the through hole, the metal foils are processed to form conductor patterns.
摘要翻译： 制备在其两侧具有金属箔的绝缘基板，并且形成穿过金属箔和绝缘基板的通孔。 在通孔的内表面和每个金属箔的表面上形成化学镀铜层，然后在无电镀铜层的整个表面上形成电解铜电镀层。 除去除了通孔的内表面和周边区域之外的电解铜电镀层，处理金属箔以形成导体图案。
-
公开(公告)号：US20060016072A1
公开(公告)日：2006-01-26
申请号：US11122369
申请日：2005-05-05
IPC分类号： H05K3/36
CPC分类号： H05K3/427 , H05K1/116 , H05K3/421 , H05K2201/09736 , H05K2203/0353 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： An insulating substrate with metal foils on both sides thereof is prepared, and a through hole that passes through the metal foils and insulating substrate is formed. An electroless copper plating layer is formed on an inner surface of the through hole and a surface of each of the metal foils, followed by the formation of an electrolytic copper plating layer on the overall surface of the electroless copper plating layer. After removing the electrolytic copper plating layer except the portions on the inner surface and a peripheral region of the through hole, the metal foils are processed to form conductor patterns.
摘要翻译： 制备在其两侧具有金属箔的绝缘基板，并且形成穿过金属箔和绝缘基板的通孔。 在通孔的内表面和每个金属箔的表面上形成化学镀铜层，然后在无电镀铜层的整个表面上形成电解铜电镀层。 除去除了通孔的内表面和周边区域之外的电解铜电镀层，处理金属箔以形成导体图案。
-
3.发明申请公开(公告)号：US20100157560A1
公开(公告)日：2010-06-24
申请号：US12654034
申请日：2009-12-08
IPC分类号： H05K1/14
CPC分类号： H05K1/147 , G11B5/4813 , G11B5/4853 , G11B5/486 , H05K1/056 , H05K1/142 , H05K1/145 , H05K1/189 , H05K2201/10689
摘要： A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electrically connected with the suspension board with circuit; and a second wired circuit board for electrically connecting with the external circuit. The first wired circuit board and the second wired circuit board are electrically connected through a preamplifier. The first wired circuit board includes a first metal supporting layer; a first insulating base layer; a first conductive layer and a first insulating cover layer.
摘要翻译： 一种用于将悬挂板与包括金属支撑层，绝缘基底层，导电层和绝缘覆盖层的电路电连接的布线电路板和外部电路，包括与悬挂板电连接的第一布线电路板 带电路; 以及用于与外部电路电连接的第二布线电路板。 第一布线电路板和第二布线电路板通过前置放大器电连接。 第一布线电路板包括第一金属支撑层; 第一绝缘基层; 第一导电层和第一绝缘覆盖层。
-
4.发明授权公开(公告)号：US08174844B2
公开(公告)日：2012-05-08
申请号：US12654034
申请日：2009-12-08
IPC分类号： H05K1/11
CPC分类号： H05K1/147 , G11B5/4813 , G11B5/4853 , G11B5/486 , H05K1/056 , H05K1/142 , H05K1/145 , H05K1/189 , H05K2201/10689
摘要： A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electrically connected with the suspension board with circuit; and a second wired circuit board for electrically connecting with the external circuit. The first wired circuit board and the second wired circuit board are electrically connected through a preamplifier. The first wired circuit board includes a first metal supporting layer; a first insulating base layer; a first conductive layer and a first insulating cover layer.
摘要翻译： 一种用于将悬挂板与包括金属支撑层，绝缘基底层，导电层和绝缘覆盖层的电路电连接的布线电路板和外部电路，包括与悬挂板电连接的第一布线电路板 带电路; 以及用于与外部电路电连接的第二布线电路板。 第一布线电路板和第二布线电路板通过前置放大器电连接。 第一布线电路板包括第一金属支撑层; 第一绝缘基层; 第一导电层和第一绝缘覆盖层。
-
公开(公告)号：US07985926B2
公开(公告)日：2011-07-26
申请号：US11870769
申请日：2007-10-11
IPC分类号： H05K1/00
CPC分类号： H05K1/0206 , H05K1/113 , H05K3/0061 , H05K3/4069 , H05K2201/0969 , Y10T29/49124 , Y10T29/4913
摘要： A base material in which a base insulating layer and a metallic layer are laminated is prepared. The metallic layer is processed into a predetermined pattern to form conductor patterns including terminal parts. A hole is formed in a region under a predetermined terminal part where the base insulating layer is formed by directing a laser beam from below. A reinforcing board having a through hole is attached to the lower surface of the base insulating layer by a sheet-like adhesive having a through hole, with the holes being aligned with one another. An opening space formed by the holes is filled with metallic paste by screen printing. In this way, a printed circuit board is fabricated. An electronic component is mounted on this printed circuit board.
摘要翻译： 准备层叠基材绝缘层和金属层的基材。 将金属层加工成预定图案以形成包括端子部分的导体图案。 在通过从下方引导激光束而形成基底绝缘层的预定端子部分下方的区域中形成孔。 具有通孔的加强板通过具有通孔的片状粘合剂附接到基底绝缘层的下表面，并且孔彼此对准。 由孔形成的开口空间通过丝网印刷填充金属膏。 以这种方式制造印刷电路板。 电子部件安装在该印刷电路板上。
-
公开(公告)号：US07307854B2
公开(公告)日：2007-12-11
申请号：US10778167
申请日：2004-02-17
申请人： Akinori Itokawa
发明人： Akinori Itokawa
CPC分类号： H05K1/147 , H05K1/142 , H05K1/189 , H05K3/0058 , H05K2201/2009
摘要： A flexible wired circuit board having a fine pitch conductor wiring pattern that can be produced with a high yield rate and improved productivity, includes a first and a second flexible wired circuit board which are disposed to be adjacent to each other on a supporting board so that a first and a second connection terminal are connected to a same electronic component. When a defect occurs in the first flexible wired circuit board in the production process in which the first conductor wiring pattern of the first flexible wired circuit board is formed into the fine pitch, only the defective first flexible wired circuit board can be screened out as a defective product. Thus, the first flexible wired circuit board having no defects can be selected for combination with the second flexible wired circuit board. Thus, the flexible wired circuit board can be produced in a high yield rate.
摘要翻译： 具有可以以高产率和提高生产率制造的具有细间距导体布线图案的柔性布线电路板包括第一和第二柔性布线电路板，其布置成在支撑板上彼此相邻，使得 第一和第二连接端子连接到相同的电子部件。 当在第一柔性布线电路板的第一导体布线图案形成为细间距的生产过程中在第一柔性布线电路板中出现缺陷时，只有有缺陷的第一柔性布线电路板可被屏蔽为 有缺陷的产品。 因此，可以选择不具有缺陷的第一柔性布线电路板来与第二柔性布线电路板组合。 因此，柔性布线电路板可以以高产率生产。
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.019 秒)
