公开(公告)号：US20110256666A1

公开(公告)日：2011-10-20

申请号：US13087617

申请日：2011-04-15

申请人： Yuki SUGO ,  Shumpei TANAKA ,  Kouichi INOUE

发明人： Yuki SUGO ,  Shumpei TANAKA ,  Kouichi INOUE

IPC分类号： H01L21/50 ,  B32B7/12

CPC分类号： H01L24/83 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68336 ,  H01L2221/68359 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3025 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a thermosetting type die bond film that can be preferably broken by tensile force. It is a thermosetting type die bond film used for a method of obtaining a semiconductor element from a semiconductor wafer by forming a reforming region by irradiating the semiconductor wafer with a laser beam and then breaking the semiconductor wafer in the reforming region or a method of obtaining a semiconductor element from a semiconductor wafer by forming grooves that do not reach the backside of the semiconductor wafer on a surface thereof and then exposing the grooves from the backside by grinding the backside of the semiconductor wafer, wherein the elongation rate at break at 25° C. before thermal curing is larger than 40% and 500% or less.

摘要翻译： 本发明提供一种可以优选地通过拉伸力断裂的热固型型模接合膜。 用于通过用激光束照射半导体晶片，然后在重整区域中破坏半导体晶片，通过形成重整区域，从半导体晶片获得半导体元件的方法中使用的热固型型芯片接合膜或获得半导体元件的方法 半导体晶片的半导体元件，通过在其表面上形成不到达半导体晶片的背面的槽，然后通过研磨半导体晶片的背面，从背面露出槽，其中在25°的断裂伸长率 热固化前大于40％和500％以下。

公开(公告)号：US20130027626A1

公开(公告)日：2013-01-31

申请号：US13558411

申请日：2012-07-26

申请人： Satoshi NAMIKI ,  Tomokazu SAITOU ,  Kouichi INOUE

发明人： Satoshi NAMIKI ,  Tomokazu SAITOU ,  Kouichi INOUE

IPC分类号： G02F1/1368

CPC分类号： G02F1/13458 ,  G02F1/133528 ,  G02F1/134363 ,  G02F1/136204 ,  G02F2001/133334 ,  G02F2001/136218 ,  G02F2202/28

摘要： An object of the present invention is to reliably ground an external conductive film formed on an opposed substrate to secure a stable shield effect in an IPS-type liquid crystal display device. An external conductive film formed on an opposed substrate is connected to an earth pad formed on a TFT substrate through a conductive thermocompression bonding tape. The conductive thermocompression bonding tape is connected by a thermocompression bonding head to form a conductive area. The width of the conductive area on the opposed substrate is made larger than the width of the conductive area on the TFT substrate to prevent the conductive thermocompression bonding tape from peeling off from the opposed substrate. Accordingly, the external conductive film of the opposed substrate is reliably grounded.

摘要翻译： 本发明的目的是可靠地研磨形成在相对基板上的外部导电膜，以确保IPS型液晶显示装置中的稳定的屏蔽效果。 形成在对置基板上的外部导电膜通过导电性热压接带与TFT基板上形成的接地焊盘连接。 导电热压接带通过热压接头连接以形成导电区域。 使相对基板上的导电区域的宽度大于TFT基板上的导电区域的宽度，以防止导电热压接带从相对基板剥离。 因此，相对基板的外部导电膜可靠地接地。

公开(公告)号：US20100324430A1

公开(公告)日：2010-12-23

申请号：US12854345

申请日：2010-08-11

申请人： Kouichi INOUE

发明人： Kouichi INOUE

IPC分类号： A61B5/02

CPC分类号： A61B5/022 ,  A61B5/02116 ,  A61B5/02141 ,  A61B5/02225 ,  A61B5/7239

摘要： A high-accuracy blood pressure value deriving method that is hardly influenced by individual differences of a person to be measured is provided. A blood pressure measuring apparatus includes a cuff member comprising a compression air bladder, a sub air bladder, and a pulse wave detection air bladder, pressure control means for pressurizing or depressurizing each air bladder, a pressure sensor which senses the internal pressure of each air bladder, pulse wave signal extracting means for extracting time-series data of a pulse wave signal superposed on a cuff internal pressure, in the process during which the pressure control means pressurizes or depressurizes each air bladder, and blood pressure value deriving means for deriving a systolic blood pressure value and/or a diastolic blood pressure value based on a change in feature amount of the pulse wave signal and a cuff internal pressure at a point of time of the change.

摘要翻译： 提供了几乎不受被测量者的个体差异影响的高精度血压值导出方法。 一种血压测量装置，包括：包括压缩空气囊，副气囊和脉搏波检测气囊的袖带构件，用于对每个气囊进行加压或减压的压力控制装置，感测每个空气的内部压力的压力传感器 膀胱脉波信号提取装置，用于在压力控制装置对每个气囊进行加压或减压的过程中提取叠加在袖带内压上的脉搏波信号的时间序列数据;以及血压值导出装置，用于导出 基于脉搏波信号的特征量的变化和在变化的时间点的袖带内部压力的收缩压值和/或舒张压值。

公开(公告)号：US20100210957A1

公开(公告)日：2010-08-19

申请号：US12766558

申请日：2010-04-23

申请人： Kouichi INOUE ,  Osamu Tochikubo

发明人： Kouichi INOUE ,  Osamu Tochikubo

IPC分类号： A61B5/0225

CPC分类号： A61B5/02225 ,  A61B5/02141 ,  A61B5/0225

摘要： This invention provides a user with information by which the reliability of a measured blood pressure value can be determined. A blood pressure measurement device includes a cuff which presses a blood pressure measurement portion, a pressure control means for pressurizing or depressurizing the interior of the cuff, a pressure sensor which senses the internal pressure of the cuff, a pulse wave signal extracting means for extracting time-series data of a pulse wave signal superposed on the cuff internal pressure sensed by the pressure sensor, in the process in which the pressure control means pressurizes or depressurizes the cuff, and a display means for displaying a pulse waveform corresponding to a pulse wave signal of at least one period, together with the value of a cuff internal pressure corresponding to the pulse wave signal, based on the extracted pulse wave signal time-series data.

摘要翻译： 本发明为用户提供可以确定测量血压值的可靠性的信息。 血压测量装置包括按压血压测量部的袖带，用于对袖带内部进行加压或减压的压力控制装置，感测袖带内压的压力传感器，用于提取袖带的脉搏波信号提取装置 在压力控制装置对压脉袋进行加压或减压的过程中叠加在由压力传感器感测到的袖带内部压力上的脉搏波信号的时间序列数据，以及显示装置，用于显示对应于脉搏波的脉搏波形 基于所提取的脉搏波信号时间序列数据，至少一个周期的信号以及与脉搏波信号相对应的袖带内部压力的值。