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公开(公告)号:USD311614S
公开(公告)日:1990-10-23
申请号:US152604
申请日:1988-02-04
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公开(公告)号:USD318542S
公开(公告)日:1991-07-23
申请号:US141344
申请日:1988-01-06
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公开(公告)号:USD307936S
公开(公告)日:1990-05-15
申请号:US87948
申请日:1987-08-21
申请人: Yukio Hirano , Tadakazu Narikawa , Junichi Yamada
设计人: Yukio Hirano , Tadakazu Narikawa , Junichi Yamada
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公开(公告)号:USD356557S
公开(公告)日:1995-03-21
申请号:US15277
申请日:1993-11-12
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公开(公告)号:USD350346S
公开(公告)日:1994-09-06
申请号:US15313
申请日:1993-11-15
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公开(公告)号:USD356554S
公开(公告)日:1995-03-21
申请号:US15673
申请日:1993-11-24
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公开(公告)号:USD354954S
公开(公告)日:1995-01-31
申请号:US16211
申请日:1993-12-10
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公开(公告)号:US20090073358A1
公开(公告)日:2009-03-19
申请号:US12293221
申请日:2007-02-19
IPC分类号: G02F1/1335
CPC分类号: G02F1/133555 , G02F2201/52
摘要: Realizes a structure for a transreflective liquid crystal display device in which one pixel is defined by four or more picture elements, the structure providing a high aperture ratio and being suitable for display for which the transmission mode is prioritized.A liquid crystal display device according to the present invention is a transreflective liquid crystal display device, comprising a plurality of picture elements including a first picture element, a second picture element, a third picture element and a fourth picture element for displaying different colors from one another; in which each of the plurality of picture elements includes a transmission area for providing display in a transmission mode and a reflection area for providing display in a reflection mode. Each picture element includes a mesh portion shaped to be meshable with an adjacent picture element; and the reflection area of each picture element is located in the mesh portion.
摘要翻译: 实现了其中一个像素由四个或更多个像素限定的透反射液晶显示装置的结构,该结构提供高开口率并且适于显示传输模式被优先化的显示。 根据本发明的液晶显示装置是一种透反射液晶显示装置,包括多个像素,包括第一像素,第二像素,第三像素和第四像素,用于从一个 另一个; 其中多个像素中的每一个包括用于在传输模式中提供显示的传输区域和用于以反射模式提供显示的反射区域。 每个像素包括成形为可与相邻像素相啮合的网格部分; 并且每个像素的反射区域位于网格部分中。
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公开(公告)号:USD512755S1
公开(公告)日:2005-12-13
申请号:US29205911
申请日:2004-05-21
申请人: Tohru Nishiyama , Junichi Yamada , Nobutaka Kato
设计人: Tohru Nishiyama , Junichi Yamada , Nobutaka Kato
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公开(公告)号:US06441502B2
公开(公告)日:2002-08-27
申请号:US09746842
申请日:2000-12-23
申请人: Junichi Yamada , Hideki Sato , Kunihiro Tsubosaki , Yo Shimazaki
发明人: Junichi Yamada , Hideki Sato , Kunihiro Tsubosaki , Yo Shimazaki
IPC分类号: H01L2348
CPC分类号: H01L21/6835 , H01L21/4832 , H01L23/3107 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45164 , H01L2224/45169 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/484 , H01L2224/48599 , H01L2224/85001 , H01L2224/85399 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/181 , H01L2924/20752 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A member for mounting of semiconductor is comprised of a substrate, a concave portions for electrode and a concave portion for wire formed on one surface of the substrate, electrode terminals formed in the concave portions for electrode, and a wire formed in the concave portion for wire, in which the concave portions for electrode terminals are formed deeper than the concave portions for wire. In the pattern-forming process, resist pattern having an opening for wire and openings for electrode in which a width of the openings for electrode is larger than a width of the portion for wire is formed on one surface of a substrate. In the etching process, a substrate is half-cut by etching a substrate through the resist pattern as a mask so that concave portions for electrode and a opening for wire are formed on the surface of the substrate. In the plating process, the substrate is plated through the same resist pattern as a mask to form electrode terminals in the concave portions for electrode and a wire in the concave portion for wire. In the peeling process, the resist pattern is removed off from the substrate, so that a member for mounting of semiconductor can be obtained.
摘要翻译: 用于安装半导体的部件包括基板,用于电极的凹部和形成在基板的一个表面上的线的凹部,形成在电极用凹部中的电极端子和形成在凹部中的线, 线,其中用于电极端子的凹部形成为比线的凹部更深。 在图案形成处理中,在基板的一个表面上形成具有用于电线的开口的电极的开口和用于电极的开口的宽度大于线的宽度的电极的开口的抗蚀剂图案。 在蚀刻工艺中,通过蚀刻通过抗蚀剂图案的衬底作为掩模来将衬底半切割,使得在衬底的表面上形成用于电极的凹部和线的开口。 在电镀处理中,通过与掩模相同的抗蚀剂图案对基板进行电镀,以在电极用凹部和电线用凹部中形成电极端子。 在剥离处理中,将抗蚀剂图案从基板上除去,从而可以获得用于安装半导体的部件。
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