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公开(公告)号：US20090175477A1
公开(公告)日：2009-07-09
申请号：US12228589
申请日：2008-08-14
IPC分类号： H04R19/04
CPC分类号： H04R19/04
摘要： A vibration transducer (e.g. a condenser microphone) having a high sensitivity is constituted of a housing composed of an airtight material having a through-hole, a vibration conversion die (e.g. a microphone die) which is attached to the interior surface of the housing at the prescribed position embracing the through-hole in plan view, and a barrier diaphragm composed of an airtight material whose external periphery is attached to the exterior surface of the housing in an airtight manner oppositely to the prescribed position. The barrier diaphragm has a vibration area which is larger than the sectional area of the through-hole. A space allowing the barrier diaphragm to vibrate is formed between the barrier diaphragm and the exterior surface of the housing, wherein the distance between the barrier diaphragm and the exterior surface of the housing can be gradually reduced from the vibration axis to the external periphery.
摘要翻译： 具有高灵敏度的振动传感器（例如，电容麦克风）由具有通孔的气密材料，振动转换模具（例如，麦克风模头）组成的壳体构成，该模具连接到壳体的内表面 在平面图中包含通孔的规定位置，以及由外周以与规定位置相反的气密方式附接到壳体的外表面的气密材料构成的阻隔膜。 阻挡隔膜的振动面积大于通孔的截面积。 阻挡隔膜与外壳的外表面之间形成允许隔膜振动的空间，其中阻挡隔膜与壳体外表面之间的距离可以从振动轴逐渐减小到外周。
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公开(公告)号：US20090190782A1
公开(公告)日：2009-07-30
申请号：US12284776
申请日：2008-09-25
IPC分类号： H04R11/04
CPC分类号： H04R19/005 , B81B3/0008 , B81B2201/0257 , H04R1/04 , H04R3/06 , H04R7/04 , H04R7/20 , H04R19/04 , H04R31/00 , H04R2307/201 , H04R2307/207
摘要： A vibration transducer includes a substrate, a diaphragm formed using deposited films having conductive property, which has a plurality of arms extended from the center portion in a radial direction, a plate formed using deposited films having conductive property, and a plurality of diaphragm supports formed using deposited films, which join the arms so as to support the diaphragm above the substrate with a prescribed gap therebetween. A plurality of bumps is formed in the arms of the diaphragm so as to prevent the diaphragm from being attached to the substrate or the plate. When the diaphragm vibrates relative to the plate, an electrostatic capacitance therebetween is varied so as to detect variations of pressure applied thereto. In addition, a plurality of diaphragm holes is appropriately aligned in the arms of the diaphragm so as to improve the sensitivity while avoiding the occurrence of adherence.
摘要翻译： 振动传感器包括：基板，使用具有导电性的沉积膜形成的隔膜，其具有从半径方向中央部延伸的多个臂，使用具有导电性的沉积膜形成的板，以及形成的多个隔膜支架 使用沉积膜，其连接臂，以便在基板之间以规定的间隙支撑隔膜。 在隔膜的臂上形成多个凸块，以防止隔膜附着在基板或板上。 当隔膜相对于板振动时，它们之间的静电电容变化，以便检测施加到其上的压力的变化。 此外，多个隔膜孔适当地对准在隔膜的臂中，以便提高灵敏度，同时避免粘附的发生。
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公开(公告)号：US08787601B2
公开(公告)日：2014-07-22
申请号：US11677465
申请日：2007-02-21
IPC分类号： H04R25/00
CPC分类号： H04R19/005 , B81B3/0072 , B81B2201/0257 , B81B2203/0127 , H04R2499/11
摘要： A condenser microphone includes a substrate having a cavity, first and second spacers defining an opening, a diaphragm having a rectangular shape positioned inside of the opening, and a plate having a rectangular shape positioned just above the diaphragm. Plate joint portions integrally interconnected with two sides of the plate are directly attached onto the second spacer. Supports, which are attached onto the second spacer across the opening and project inwardly of the opening, are connected to the prescribed portions of the diaphragm via third spacers relatively to the other two sides of the plate. The center portion of the diaphragm can be designed in a multilayered structure, and the peripheral portion can be bent outwardly. In addition, both ends of the diaphragm are fixed in position, while free ends of the diaphragm vibrate due to sound waves.
摘要翻译： 电容麦克风包括具有空腔的基板，限定开口的第一和第二间隔件，位于开口内部的具有矩形形状的隔膜以及位于隔膜正上方的具有矩形形状的板。 与板的两侧整体连接的板接合部分直接附接到第二间隔件上。 通过开口附接到第二间隔件并且向开口内部突出的支撑件相对于板的另外两侧经由第三间隔件连接到隔膜的规定部分。 隔膜的中心部分可以设计成多层结构，并且周边部分可以向外弯曲。 此外，隔膜的两端固定就位，隔膜的自由端由于声波而振动。
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公开(公告)号：US20070201710A1
公开(公告)日：2007-08-30
申请号：US11677647
申请日：2007-02-22
申请人： Yukitoshi Suzuki , Toshihisa Suzuki
发明人： Yukitoshi Suzuki , Toshihisa Suzuki
IPC分类号： H04R25/00
CPC分类号： H04R31/006 , B81B3/0072 , B81B2201/0257 , B81B2203/0109 , H04R7/06 , H04R19/005
摘要： A condenser microphone includes a support, a plate having a fixed electrode bridged across the supports, a diaphragm, which has a moving electrode at a center portion thereof and which vibrates due to sound waves applied thereto, and a spacer, in which a first end is fixed to the plate, and a second end is fixed to the near-end portion of the diaphragm so as to surround the center portion of the diaphragm, wherein an air gap is formed between the plate and the diaphragm. This reduces the tensile stress of the diaphragm so as to increase the amplitude of vibration of the diaphragm. Hence, it is possible to increase the sensitivity of the condenser microphone. A structure constituted of the plate, the diaphragm, and the spacer is bridged across the support by means of the bridges, which absorb the residual stress of the diaphragm due to the deformation thereof.
摘要翻译： 电容麦克风包括支撑体，具有桥接在支撑件上的固定电极的板，隔膜，其中心部分具有移动电极，并且由于施加的声波而振动;以及间隔件，其中第一端 固定在板上，第二端固定在隔膜的近端部分，以便围绕隔膜的中心部分，其中在板和隔膜之间形成气隙。 这减小了隔膜的拉伸应力，从而增加隔膜的振动幅度。 因此，可以提高电容麦克风的灵敏度。 由板，隔膜和间隔件构成的结构通过桥梁桥接跨过支撑件，桥接件由于其变形而吸收隔膜的残余应力。
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公开(公告)号：US20070201709A1
公开(公告)日：2007-08-30
申请号：US11677465
申请日：2007-02-21
CPC分类号： H04R19/005 , B81B3/0072 , B81B2201/0257 , B81B2203/0127 , H04R2499/11
摘要： A condenser microphone includes a substrate having a cavity, first and second spacers defining an opening, a diaphragm having a rectangular shape positioned inside of the opening, and a plate having a rectangular shape positioned just above the diaphragm. Plate joint portions integrally interconnected with two sides of the plate are directly attached onto the second spacer. Supports, which are attached onto the second spacer across the opening and project inwardly of the opening, are connected to the prescribed portions of the diaphragm via third spacers relatively to the other two sides of the plate. The center portion of the diaphragm can be designed in a multilayered structure, and the peripheral portion can be bent outwardly. In addition, both ends of the diaphragm are fixed in position, while free ends of the diaphragm vibrate due to sound waves.
摘要翻译： 电容麦克风包括具有空腔的基板，限定开口的第一和第二间隔件，位于开口内部的具有矩形形状的隔膜以及位于隔膜正上方的具有矩形形状的板。 与板的两侧整体互连的板接合部分直接附接到第二间隔件上。 通过开口附接到第二间隔件并且向开口内部突出的支撑件相对于板的另外两侧经由第三间隔件连接到隔膜的规定部分。 隔膜的中心部分可以设计成多层结构，并且周边部分可以向外弯曲。 此外，隔膜的两端固定就位，隔膜的自由端由于声波而振动。
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公开(公告)号：US07560811B2
公开(公告)日：2009-07-14
申请号：US11634384
申请日：2006-12-06
IPC分类号： H01L29/82
CPC分类号： B81B7/007 , B81B2201/0257 , B81B2201/0264 , B81C1/0023 , H01L2224/45139 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
摘要： A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.
摘要翻译： 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上，该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里，基板被模制树脂密封，使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此，可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。
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公开(公告)号：US20090096041A1
公开(公告)日：2009-04-16
申请号：US12333092
申请日：2008-12-11
IPC分类号： H01L29/84
CPC分类号： B81B7/007 , B81B2201/0257 , B81B2201/0264 , B81C1/0023 , H01L2224/45139 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/15153 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
摘要： A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.
摘要翻译： 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上，该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里，基板被模制树脂密封，使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此，可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。
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公开(公告)号：US20080181437A1
公开(公告)日：2008-07-31
申请号：US11839149
申请日：2007-08-15
IPC分类号： H04R25/00
CPC分类号： H04R19/016
摘要： An electroacoustic transducer serving as a speaker or a microphone is reduced in size and weight and is capable of generating sound with relatively high sound pressure. It is constituted of a housing having a cavity having an opening in the exterior, a fixed electrode positioned opposite to the opening of the housing, a diaphragm having an electrode positioned between the opening and the fixed electrode, and an elastic deformation portion for supporting the diaphragm with respect to the housing and for allowing the diaphragm to vibrate in the thickness direction. The fixed electrode is electrically insulated from the electrode of the diaphragm. The diaphragm is distanced from the fixed electrode by means of the elastic deformation portion placed in the balanced state. When the elastic deformation portion is subjected to elastic deformation, the diaphragm vibrates with relatively large amplitude such that it comes in contact with the fixed electrode.
摘要翻译： 用作扬声器或麦克风的电声换能器的尺寸和重量减小，并且能够产生具有较高声压的声音。 它由具有在外部具有开口的空腔的壳体，与壳体的开口相对定位的固定电极，具有位于开口和固定电极之间的电极的隔膜，以及用于支撑 隔膜相对于壳体并且允许隔膜在厚度方向上振动。 固定电极与隔膜的电极电绝缘。 隔膜通过置于平衡状态的弹性变形部分与固定电极分开。 当弹性变形部分发生弹性变形时，膜片以相对较大的振幅振动，使其与固定电极接触。
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公开(公告)号：US4113441A
公开(公告)日：1978-09-12
申请号：US775373
申请日：1977-03-07
申请人： Akira Suzuki , Kantaro Nakamura , Tetsuo Maejima , Masaru Kajiura , Toshio Aso , Shoichi Abe , Toshihisa Suzuki , Katsuaki Takemura , Masaya Kuno , Kazumichi Yoshida , Junji Yokokawa , Takeshi Miyasugi , Hiroshi Yagi , Kiyohisa Mukai
发明人： Akira Suzuki , Kantaro Nakamura , Tetsuo Maejima , Masaru Kajiura , Toshio Aso , Shoichi Abe , Toshihisa Suzuki , Katsuaki Takemura , Masaya Kuno , Kazumichi Yoshida , Junji Yokokawa , Takeshi Miyasugi , Hiroshi Yagi , Kiyohisa Mukai
CPC分类号： B01J8/062 , B01J8/0005 , C01B3/384 , B01J2208/00212
摘要： A steam reactor comprises a pressure shell having inlet and outlet nozzles for each of a process gas and a heating gas, a plurality of metal catalyst tubes packed with a catalyst and located substantially vertically within the pressure shell, one and of each of the catalyst tubes being connected to a pipe and the other end being communicated with the inlet nozzle of the process gas; and a riser pipe located substantially vertically within the pressure shell, one end of the riser pipe being connected to the pipes and the other end being terminated in the outlet nozzle of the process gas. A support member is provided on the pressure shell to support the catalyst tubes and the riser pipe. The plurality of pipes which connect the catalyst tubes and the riser pipe have a diameter which is smaller than that of the catalyst tubes and the riser pipe and a structure capable of taking up the difference in thermal expansion between the catalyst tubes and the riser pipe. The pressure shell may be insulated on a part or the whole of the inner surface thereof.
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公开(公告)号：US07579678B2
公开(公告)日：2009-08-25
申请号：US11848837
申请日：2007-08-31
申请人： Toshihisa Suzuki , Junya Suzuki
发明人： Toshihisa Suzuki , Junya Suzuki
IPC分类号： H01L23/02
CPC分类号： H04R19/005
摘要： A semiconductor microphone unit includes a semiconductor microphone chip having a diaphragm covering an inner hole of a support. The support is adhered onto the surface of a support substrate whose thermal expansion coefficient higher than the thermal expansion coefficient of the support via a thermosetting adhesive in such a way that the diaphragm is positioned opposite to the surface of the support substrate. The thermosetting adhesive has a tensile elastic modulus allowing a contraction of the support substrate to be transmitted to the support in a hardened state when the semiconductor microphone chip is cooled together with the support substrate. Thus, it is possible to reduce the tensile stress of the diaphragm, which occurs during the manufacturing of the semiconductor microphone chip, thus preventing the diaphragm from being unexpectedly reduced in strength; hence, it is possible to improve the sensitivity of the semiconductor microphone chip.
摘要翻译： 半导体麦克风单元包括具有覆盖支撑件的内孔的隔膜的半导体麦克风芯片。 支撑体以热膨胀系数高于载体的热膨胀系数通过热固性粘合剂粘附到支撑基板的表面上，使得隔膜与支撑基板的表面相对定位。 当半导体麦克风芯片与支撑基板一起冷却时，热固性粘合剂具有允许支撑基板的收缩在硬化状态下传递到支撑件的拉伸弹性模量。 因此，可以减少在制造半导体麦克风芯片期间发生的隔膜的拉伸应力，从而防止隔膜意外地降低强度; 因此，可以提高半导体麦克风芯片的灵敏度。
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