公开(公告)号：US20080181437A1

公开(公告)日：2008-07-31

申请号：US11839149

申请日：2007-08-15

申请人： Toshihisa Suzuki ,  Yuusaku Ebihara ,  Masayoshi Omura

发明人： Toshihisa Suzuki ,  Yuusaku Ebihara ,  Masayoshi Omura

IPC分类号： H04R25/00

CPC分类号： H04R19/016

摘要： An electroacoustic transducer serving as a speaker or a microphone is reduced in size and weight and is capable of generating sound with relatively high sound pressure. It is constituted of a housing having a cavity having an opening in the exterior, a fixed electrode positioned opposite to the opening of the housing, a diaphragm having an electrode positioned between the opening and the fixed electrode, and an elastic deformation portion for supporting the diaphragm with respect to the housing and for allowing the diaphragm to vibrate in the thickness direction. The fixed electrode is electrically insulated from the electrode of the diaphragm. The diaphragm is distanced from the fixed electrode by means of the elastic deformation portion placed in the balanced state. When the elastic deformation portion is subjected to elastic deformation, the diaphragm vibrates with relatively large amplitude such that it comes in contact with the fixed electrode.

摘要翻译： 用作扬声器或麦克风的电声换能器的尺寸和重量减小，并且能够产生具有较高声压的声音。 它由具有在外部具有开口的空腔的壳体，与壳体的开口相对定位的固定电极，具有位于开口和固定电极之间的电极的隔膜，以及用于支撑 隔膜相对于壳体并且允许隔膜在厚度方向上振动。 固定电极与隔膜的电极电绝缘。 隔膜通过置于平衡状态的弹性变形部分与固定电极分开。 当弹性变形部分发生弹性变形时，膜片以相对较大的振幅振动，使其与固定电极接触。

公开(公告)号：US08031890B2

公开(公告)日：2011-10-04

申请号：US11839149

申请日：2007-08-15

申请人： Toshihisa Suzuki ,  Yuusaku Ebihara ,  Masayoshi Omura

发明人： Toshihisa Suzuki ,  Yuusaku Ebihara ,  Masayoshi Omura

IPC分类号： H04R25/00

CPC分类号： H04R19/016

摘要： An electroacoustic transducer serving as a speaker or a microphone is reduced in size and weight and is capable of generating sound with relatively high sound pressure. It is constituted of a housing having a cavity having an opening in the exterior, a fixed electrode positioned opposite to the opening of the housing, a diaphragm having an electrode positioned between the opening and the fixed electrode, and an elastic deformation portion for supporting the diaphragm with respect to the housing and for allowing the diaphragm to vibrate in the thickness direction. The fixed electrode is electrically insulated from the electrode of the diaphragm. The diaphragm is distanced from the fixed electrode by means of the elastic deformation portion placed in the balanced state. When the elastic deformation portion is subjected to elastic deformation, the diaphragm vibrates with relatively large amplitude such that it comes in contact with the fixed electrode.

摘要翻译： 用作扬声器或麦克风的电声换能器的尺寸和重量减小，并且能够产生具有较高声压的声音。 它由具有在外部具有开口的空腔的壳体，与壳体的开口相对定位的固定电极，具有位于开口和固定电极之间的电极的隔膜，以及用于支撑 隔膜相对于壳体并且允许隔膜在厚度方向上振动。 固定电极与隔膜的电极电绝缘。 隔膜通过置于平衡状态的弹性变形部分与固定电极分开。 当弹性变形部分发生弹性变形时，膜片以相对较大的振幅振动，使其与固定电极接触。

公开(公告)号：US08126167B2

公开(公告)日：2012-02-28

申请号：US11691943

申请日：2007-03-27

申请人： Seiji Hirade ,  Tamito Suzuki ,  Yukitoshi Suzuki ,  Masayoshi Omura ,  Yuusaku Ebihara

发明人： Seiji Hirade ,  Tamito Suzuki ,  Yukitoshi Suzuki ,  Masayoshi Omura ,  Yuusaku Ebihara

IPC分类号： H04R25/00

CPC分类号： H04R19/04 ,  H04R19/005 ,  H04R31/00

摘要： The present invention provides a condenser microphone, in which, with a simple manufacturing process, vibration characteristics of a diaphragm are improved, and a parasitic capacitance occurring between the diaphragm and a back plate is reduced, thus improving sensitivity. Specifically, the diaphragm having a gear-like shape including a center portion and a plurality of arms and the back plate having a gear-like shape including a center portion and a plurality of arms are positioned opposite to each other above a substrate, wherein the arms of the diaphragm and the arms of the back plate are not positioned opposite to each other. Alternatively, it is possible to independently support the diaphragm and the back plate above the substrate. Furthermore, it is possible to support the back plate above the substrate by means of a plurality of supports inserted into a plurality of holes formed in the center portion of the diaphragm.

摘要翻译： 本发明提供了一种电容麦克风，其中通过简单的制造工艺，提高了隔膜的振动特性，并且减小了在隔膜和背板之间产生的寄生电容，从而提高了灵敏度。 具体而言，具有中央部和多个臂的齿轮状的隔膜和具有中心部和多个臂的齿轮状的背板位于基板的上方相对的位置， 隔膜的臂和背板的臂不彼此相对定位。 或者，可以独立地支撑基板上方的隔膜和背板。 此外，可以通过插入形成在隔膜的中心部分中的多个孔中的多个支撑件来将基板支撑在基板上。

公开(公告)号：US20090060232A1

公开(公告)日：2009-03-05

申请号：US12221573

申请日：2008-08-05

申请人： Seiji Hirade ,  Tamito Suzuki ,  Masayoshi Omura ,  Yuusaku Ebihara

发明人： Seiji Hirade ,  Tamito Suzuki ,  Masayoshi Omura ,  Yuusaku Ebihara

IPC分类号： H04R25/00

CPC分类号： H04R19/005 ,  H04R31/00

摘要： A condenser microphone includes a substrate having an opening in a back cavity, a diaphragm including a center portion and a plurality of arms extended in the radial direction from the center portion, a plate positioned opposite the diaphragm, and a support structure for supporting the periphery of the diaphragm and the periphery of the plate above the substrate while insulating the diaphragm and the plate both having conductive properties from each other. The support structure forms gaps between the substrate, the diaphragm, and the plate. Projections having insulating properties are formed in the center portion and the arms of the diaphragm so as to project towards the substrate and are separated from each other in the circumferential direction of the diaphragm. This prevents the diaphragm from being unexpectedly adhered and fixed to the substrate, thus improving the sensitivity of the condenser microphone.

摘要翻译： 一种电容式麦克风，包括：在后腔中具有开口的基板，包括中心部分的中心部分和沿径向方向从中心部延伸的多个臂的隔膜，与隔膜相对设置的板，以及支撑结构， 的隔膜和板的周边，同时使具有导电性质的隔膜和板彼此绝缘。 支撑结构在基板，隔膜和板之间形成间隙。 在隔膜的中心部分和臂部形成具有绝缘性能的突出部，以朝向基板突出，并且在隔膜的圆周方向上彼此分离。 这防止隔膜意外地粘附并固定到基板，从而提高电容式麦克风的灵敏度。

公开(公告)号：US20070286438A1

公开(公告)日：2007-12-13

申请号：US11691943

申请日：2007-03-27

申请人： Seiji Hirade ,  Tamito Suzuki ,  Yukitoshi Suzuki ,  Masayoshi Omura ,  Yuusaku Ebihara

发明人： Seiji Hirade ,  Tamito Suzuki ,  Yukitoshi Suzuki ,  Masayoshi Omura ,  Yuusaku Ebihara

IPC分类号： H04R19/04

CPC分类号： H04R19/04 ,  H04R19/005 ,  H04R31/00

摘要： The present invention provides a condenser microphone, in which, with a simple manufacturing process, vibration characteristics of a diaphragm are improved, and a parasitic capacitance occurring between the diaphragm and a back plate is reduced, thus improving sensitivity. Specifically, the diaphragm having a gear-like shape including a center portion and a plurality of arms and the back plate having a gear-like shape including a center portion and a plurality of arms are positioned opposite to each other above a substrate, wherein the arms of the diaphragm and the arms of the back plate are not positioned opposite to each other. Alternatively, it is possible to independently support the diaphragm and the back plate above the substrate. Furthermore, it is possible to support the back plate above the substrate by means of a plurality of supports inserted into a plurality of holes formed in the center portion of the diaphragm.

摘要翻译： 本发明提供了一种电容麦克风，其中通过简单的制造工艺，提高了隔膜的振动特性，并且减小了在隔膜和背板之间产生的寄生电容，从而提高了灵敏度。 具体而言，具有中央部和多个臂的齿轮状的隔膜和具有中心部和多个臂的齿轮状的背板位于基板的上方相对的位置， 隔膜的臂和背板的臂不彼此相对定位。 或者，可以独立地支撑基板上方的隔膜和背板。 此外，可以通过插入形成在隔膜的中心部分中的多个孔中的多个支撑件来将基板支撑在基板上。

公开(公告)号：US20090230487A1

公开(公告)日：2009-09-17

申请号：US11908590

申请日：2006-03-14

申请人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Masayoshi Omura

发明人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Masayoshi Omura

IPC分类号： H01L29/84 ,  H01L23/58 ,  H01L23/538 ,  H01L23/04 ,  H01L21/50

CPC分类号： B81C1/00333 ,  B81B7/0061 ,  B81B7/0064 ,  B81B2201/0264 ,  H01L21/561 ,  H01L21/568 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes: a substrate; a semiconductor chip that is fixed to a first surface of the substrate; a chip covering lid body that is provided on the first surface of the substrate so as to cover the semiconductor chip and that forms a hollow first space portion that surrounds the semiconductor chip, and in which there is provided a substantially cylindrical aperture portion that extends to the outer side of the first space portion and has an aperture end at a distal end thereof and that is connected to the first space portion; and a first resin mold portion that forms the first space portion via the chip covering lid body and covers the substrate such that the aperture end is exposed, and that fixes the substrate integrally with the chip covering lid body.

摘要翻译： 半导体器件包括：衬底; 固定到所述基板的第一表面的半导体芯片; 芯片覆盖盖体，其设置在基板的第一表面上以覆盖半导体芯片，并且形成围绕半导体芯片的中空的第一空间部分，并且其中设置有基本上圆柱形的开口部分，其延伸到 第一空间部分的外侧，并且在其远端具有开口端，并且连接到第一空间部分; 以及第一树脂模制部，其经由所述芯片盖体形成所述第一空间部，并且覆盖所述基板，使得所述开口端露出，并且将所述基板与所述芯片盖体一体地固定。

公开(公告)号：US08164120B2

公开(公告)日：2012-04-24

申请号：US12949637

申请日：2010-11-18

申请人： Masayoshi Omura

发明人： Masayoshi Omura

IPC分类号： H01L23/52

CPC分类号： H01L28/40 ,  H01L27/0629 ,  H01L2924/0002 ,  H01L2924/00

摘要： An upper electrode of a capacitor has a two-layer structure of first and second upper electrodes. A gate electrode of a MOS field effect transistor and a fuse are formed by patterning conductive layers used to form the lower electrode, first upper electrode and second upper electrode of the capacitor. In forming a capacitor and a fuse on a semiconductor substrate by a conventional method, at least three etching masks are selectively used to pattern respective layers to form the capacitor and fuse before wiring connection. The number of etching masks can be reduced in manufacturing a semiconductor device having capacitors, fuses and MOS field effect transistors so that the number of processes can be reduced and it becomes easy to improve the productivity and reduce the manufacture cost.

摘要翻译： 电容器的上电极具有第一和第二上电极的两层结构。 通过构图用于形成电容器的下电极，第一上电极和第二上电极的导电层来形成MOS场效应晶体管的栅电极和熔丝。 在通过常规方法在半导体衬底上形成电容器和熔丝时，选择性地使用至少三个蚀刻掩模来对各层进行图案化，以在布线连接之前形成电容器并熔断。 在制造具有电容器，保险丝和MOS场效应晶体管的半导体器件中，可以减少蚀刻掩模的数量，从而可以减少工艺数量，并且容易提高生产率并降低制造成本。

公开(公告)号：US08138757B2

公开(公告)日：2012-03-20

申请号：US11214986

申请日：2005-08-31

申请人： Hiroshi Adachi ,  Hiroshi Saitoh ,  Kenichi Shirasaka ,  Hideki Sato ,  Masayoshi Omura

发明人： Hiroshi Adachi ,  Hiroshi Saitoh ,  Kenichi Shirasaka ,  Hideki Sato ,  Masayoshi Omura

IPC分类号： G01R33/02

CPC分类号： G01R33/0206 ,  G01C17/30 ,  H01L21/565 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T29/49169 ,  Y10T29/49174 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost thereof.

摘要翻译： 磁传感器由安装在由互连构件支撑的台架上的磁传感器芯片和在引线框架中具有引线的框架构成。 这里，阶段倾向于互连构件的塑性变形。 当框架保持在金属模具中并且阶段被按压时，互连构件弹性变形，使得磁性传感器芯片被接合到基本上位于同一平面上的台架上，然后与引线接线。 此后，各级从压力释放，使互连构件从其弹性变形状态恢复。 当磁传感器芯片组合在一起以实现三个感测方向时，可以精确地测量磁性的三维轴承，并且可以降低磁性传感器的尺寸并降低成本。

公开(公告)号：US07883466B2

公开(公告)日：2011-02-08

申请号：US11636678

申请日：2006-12-08

申请人： Hideo Adachi ,  Yoshiyjki Okuno ,  Akiko Mizunuma ,  Katsuhiro Wakabayashi ,  Takuya Imahashi ,  Yukihiko Sawada ,  Masayoshi Omura ,  Etsuko Omura, legal representative ,  Kozaburo Suzuki ,  Shuji Otani ,  Naomi Shimoda ,  Miyuki Murakami ,  Kiyoshi Nemoto

发明人： Hideo Adachi ,  Yoshiyjki Okuno ,  Akiko Mizunuma ,  Katsuhiro Wakabayashi ,  Takuya Imahashi ,  Yukihiko Sawada ,  Masayoshi Omura ,  Kozaburo Suzuki ,  Shuji Otani ,  Naomi Shimoda ,  Miyuki Murakami ,  Kiyoshi Nemoto

IPC分类号： A61B8/00

CPC分类号： A61B8/00 ,  A61B8/12 ,  A61B8/4483 ,  A61B8/4488 ,  A61B2562/028 ,  B06B1/0292 ,  G01S7/52026 ,  G01S15/8913 ,  G01S15/895 ,  G01S15/8963 ,  G01S15/8979

摘要： An ultrasonic probe apparatus which applies a RF pulse signal with a DC bias signal superimposed thereon to c-MUTs and transmits/receives an ultrasound wave is configured such that a transmission control system includes bias regulators which regulate the voltage value of the DC bias signal, a reception control system has a plurality of different frequency band pass filtering characteristics including at least those for a low pass and high pass and a frequency band pass filtering processing section which can select at least one frequency band pass filtering characteristic from those frequency band pass filtering characteristics. The apparatus controls voltage settings of the bias regulators in conjunction with the selection of frequency band pass filtering characteristics of the frequency band pass filtering processing section.

摘要翻译： 将其上叠加有DC偏置信号的RF脉冲信号施加到c-MUT并发送/接收超声波的超声波探头装置被配置为使得传输控制系统包括调节DC偏置信号的电压值的偏置调节器， 接收控制系统具有至少包括用于低通和高通的那些频带通滤波特性的多个不同的频带滤波特性，以及能够从这些频带滤波特性中选出至少一个频带滤波特性的频带滤波处理部 特点 该装置结合频带滤波处理部分的频带滤波特性的选择来控制偏置调节器的电压设置。

公开(公告)号：US20090033912A1

公开(公告)日：2009-02-05

申请号：US12145042

申请日：2008-06-24

申请人： Masaharu Sasaki ,  Masayoshi Omura

发明人： Masaharu Sasaki ,  Masayoshi Omura

IPC分类号： G01N21/00

CPC分类号： G06K9/2036

摘要： An identification mark constituted of irregularities is formed on the surface of a wafer, which is sealed with a resin layer and a dicing tape may be adhered to the backside. Multiple infrared units irradiate infrared rays towards the surface of the wafer from the backside thereof, wherein they transmit through the wafer and are then reflected at the interface between the resin layer and the surface of the wafer, thus producing reflected rays. An image pickup device picks up an image of the interface including the identification mark based on reflected rays. Optical axes of the infrared units extend to cross the surface of the wafer in different directions; hence, the image pickup device receives only a part of reflected rays, which are reflected at the interface in a prescribed direction. A polarizer can be arranged in proximity to the infrared unit or the image pickup device.

摘要翻译： 在由树脂层密封的晶片的表面上形成由凹凸构成的识别标记，并且切割带可以粘附到背面。 多个红外线单元从其背面向晶片的表面照射红外线，其中它们透过晶片，然后在树脂层与晶片表面之间的界面反射，从而产生反射光线。 图像拾取装置基于反射光线拾取包括识别标记的界面的图像。 红外单元的光轴延伸以在不同方向上跨越晶片的表面; 因此，图像拾取装置仅接收沿着规定方向在界面反射的反射光线的一部分。 偏振器可以布置在靠近红外单元或图像拾取装置的位置。