Organic light emitting diode display
    1.
    发明授权
    Organic light emitting diode display 有权
    有机发光二极管显示

    公开(公告)号:US08536609B2

    公开(公告)日:2013-09-17

    申请号:US13552100

    申请日:2012-07-18

    IPC分类号: H01L33/00

    CPC分类号: H01L51/5253 H01L51/5256

    摘要: An organic light emitting diode display includes a substrate, an organic light emitting diode provided on the substrate and including a first electrode, an organic emission layer, and a second electrode, a packed layer on the organic light emitting diode, and a protective layer on the packed layer, the protective layer including at least one of a graphene oxide and a graphene nitride.

    摘要翻译: 有机发光二极管显示器包括:衬底,设置在衬底上的有机发光二极管,包括第一电极,有机发射层和第二电极,有机发光二极管上的封装层和保护层 所述填充层,所述保护层包括氧化石墨烯和氮化石墨烯中的至少一种。

    ORGANIC LIGHT EMITTING DIODE DISPLAY
    2.
    发明申请
    ORGANIC LIGHT EMITTING DIODE DISPLAY 有权
    有机发光二极管显示

    公开(公告)号:US20130200422A1

    公开(公告)日:2013-08-08

    申请号:US13552100

    申请日:2012-07-18

    IPC分类号: H01L33/44

    CPC分类号: H01L51/5253 H01L51/5256

    摘要: An organic light emitting diode display includes a substrate, an organic light emitting diode provided on the substrate and including a first electrode, an organic emission layer, and a second electrode, a packed layer on the organic light emitting diode, and a protective layer on the packed layer, the protective layer including at least one of a graphene oxide and a graphene nitride.

    摘要翻译: 有机发光二极管显示器包括:衬底,设置在衬底上的有机发光二极管,包括第一电极,有机发射层和第二电极,有机发光二极管上的封装层和保护层 所述填充层,所述保护层包括氧化石墨烯和氮化石墨烯中的至少一种。

    Semiconductor device and method of manufacturing the same
    8.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08937313B2

    公开(公告)日:2015-01-20

    申请号:US13477802

    申请日:2012-05-22

    CPC分类号: H01L29/78603 H01L27/1218

    摘要: A semiconductor device and a method of manufacturing the same are disclosed. In one embodiment, the semiconductor device includes a substrate, a first silicon nitride layer formed over the substrate, a first silicon oxide layer formed directly on the first silicon nitride layer and having a thickness of about 1000 Å or less, and a hydrogenated polycrystalline silicon layer formed directly on the first silicon oxide layer.

    摘要翻译: 公开了一种半导体器件及其制造方法。 在一个实施例中,半导体器件包括衬底,在衬底上形成的第一氮化硅层,直接形成在第一氮化硅层上并具有约1000或更小的厚度的第一氧化硅层和氢化多晶硅 层直接形成在第一氧化硅层上。