利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

16 条记录 (耗时 0.028 秒)

    Integrated circuits with interchangeable connectors
    1.
    发明申请
    Integrated circuits with interchangeable connectors 失效
    具有可互换连接器的集成电路

    公开(公告)号：US20070086254A1

    公开(公告)日：2007-04-19

    申请号：US11252277

    申请日：2005-10-17

    申请人： YunDong Zhang ,  Jun Zhu ,  Guoxin Li ,  Jian-Xun Yao

    发明人： YunDong Zhang ,  Jun Zhu ,  Guoxin Li ,  Jian-Xun Yao

    IPC分类号： G11C29/00 ,  G11C7/00 ,  H03K19/177 ,  H03K17/16

    CPC分类号： H03K19/1732

    摘要： Techniques for interchanging positions of external terminals of an integrated circuit chip are disclosed. According to one aspect of the present invention, a chip comprises at least a pair of external terminals for communicating with other components or circuits, an internal circuit and an interchangeable unit coupled between the external terminals and the internal circuit. The interchangeable unit is configured to interchange the external terminals electronically such that the chip remains compatible in various versions involving an change of the terminals thereof, wherein the an interchangeable unit is controllable externally by a selecting pin applicable to either a high level or a low level to cause the external terminals interchanged.

    摘要翻译： 公开了用于交换集成电路芯片的外部端子的位置的技术。 根据本发明的一个方面，芯片包括至少一对用于与其他部件或电路通信的外部端子，内部电路和耦合在外部端子和内部电路之间的可互换单元。 可互换单元被配置为电子地互换外部端子，使得芯片保持与各种版本的兼容性，包括其端子的变化，其中可互换单元可由外部由可选择高电平或低电平的选择引脚控制 使外部端子互换。

    Integrated circuits with interchangeable connectors
    2.
    发明授权
    Integrated circuits with interchangeable connectors 失效
    具有可互换连接器的集成电路

    公开(公告)号：US07502879B2

    公开(公告)日：2009-03-10

    申请号：US11252277

    申请日：2005-10-17

    申请人： YunDong Zhang ,  Jun Zhu ,  Guoxin Li ,  Jian-Xun Yao

    发明人： YunDong Zhang ,  Jun Zhu ,  Guoxin Li ,  Jian-Xun Yao

    IPC分类号： G06F13/12

    CPC分类号： H03K19/1732

    摘要： Techniques for interchanging positions of external terminals of an integrated circuit chip are disclosed. According to one aspect of the present invention, a chip comprises at least a pair of external terminals for communicating with other components or circuits, an internal circuit and an interchangeable unit coupled between the external terminals and the internal circuit. The interchangeable unit is configured to interchange the external terminals electronically such that the chip remains compatible in various versions involving an change of the terminals thereof, wherein the an interchangeable unit is controllable externally by a selecting pin applicable to either a high level or a low level to cause the external terminals interchanged.

    摘要翻译： 公开了用于交换集成电路芯片的外部端子的位置的技术。 根据本发明的一个方面，芯片包括至少一对用于与其他部件或电路通信的外部端子，内部电路和耦合在外部端子和内部电路之间的可互换单元。 可互换单元被配置为电子地互换外部端子，使得芯片保持与各种版本的兼容性，包括其端子的变化，其中可互换单元可由外部由可选择高电平或低电平的选择引脚控制 使外部端子互换。

    Starch Nanocomposite Materials
    3.
    发明申请
    Starch Nanocomposite Materials 有权
    淀粉纳米复合材料

    公开(公告)号：US20100307951A1

    公开(公告)日：2010-12-09

    申请号：US12602257

    申请日：2008-06-02

    申请人： Kishan Khemani ,  Graeme Moad ,  Edmond Lascaris ,  Guoxin Li ,  George Simon ,  Jana Habsuda ,  Robert Shanks ,  Antonietta Genovese ,  Wasantha Gunaratne ,  Lance Nichols

    发明人： Kishan Khemani ,  Graeme Moad ,  Edmond Lascaris ,  Guoxin Li ,  George Simon ,  Jana Habsuda ,  Robert Shanks ,  Antonietta Genovese ,  Wasantha Gunaratne ,  Lance Nichols

    IPC分类号： B65D65/38 ,  C08K3/34

    CPC分类号： C08L3/02 ,  C08K3/346 ,  C08K9/04 ,  C08L2666/06

    摘要： In one aspect, the invention provides a substantially exfoliated nanocomposite material including starch and hydrophobically modified layered silicate clay. In another aspect, the invention provides packaging made from material including the substantially exfoliated nanocomposite material described above. The nanocomposite material has improved mechanical and rheological properties and reduced sensitivity to moisture in that the rates of moisture update and/or loss are reduced. In another aspect, the invention provides a process for preparing the substantially exfoliated nanocomposite material described above, including a step of mixing the starch in the form of an aqueous gel with the hydrophobic clay in a melt mixing device. In a further aspect, the invention provides a process for preparing the substantially exfoliated nanocomposite material, including the steps of mixing the starch with the hydrophobic clay to form a masterbatch (hereinafter “the masterbatch process”) and mixing the masterbatch with further starch.

    摘要翻译： 一方面，本发明提供了包括淀粉和疏水改性的层状硅酸盐粘土的基本上剥离的纳米复合材料。 另一方面，本发明提供由包括上述基本上剥离的纳米复合材料的材料制成的包装。 纳米复合材料具有改善的机械和流变性能并降低对水分的敏感性，因为减少了水分更新和/或损失的速率。 另一方面，本发明提供了一种制备上述基本上剥离的纳米复合材料的方法，包括在熔融混合装置中将水性凝胶形式的淀粉与疏水性粘土混合的步骤。 在另一方面，本发明提供了制备基本上脱落的纳米复合材料的方法，包括将淀粉与疏水性粘土混合以形成母料（以下称为“母料工艺”）并将母料与另外的淀粉混合的步骤。

    Axial-flow blood pump with magnetically suspended, radially and axially stabilized impeller
    5.
    发明申请
    Axial-flow blood pump with magnetically suspended, radially and axially stabilized impeller 失效
    具有磁悬浮，径向和轴向稳定的叶轮的轴流式血泵

    公开(公告)号：US20050135948A1

    公开(公告)日：2005-06-23

    申请号：US10949884

    申请日：2004-09-24

    申请人： Don Olsen ,  Paul Allaire ,  Houston Wood ,  Ronald Kipp ,  Wei Jiang ,  Zongli Lin ,  Guoxin Li

    发明人： Don Olsen ,  Paul Allaire ,  Houston Wood ,  Ronald Kipp ,  Wei Jiang ,  Zongli Lin ,  Guoxin Li

    IPC分类号： F04B17/00 ,  F04B35/04

    CPC分类号： F16C32/0448 ,  A61M1/101 ,  A61M1/1015 ,  F16C32/0461 ,  F16C2316/18

    摘要： A blood pump has an impeller rotatably disposed and magnetically suspended within a cavity of a stator by a plurality of magnetic bearings including an axial bearing to support the impeller axially in the cavity. The axial bearing includes adjacent impeller magnets and adjacent stator magnets with axially aligned polarities and reverse polarities with respect to adjacent magnets. A motor includes impeller magnets on the impeller and coils and poles associated with the stator. Radial permanent magnet and electromagnetic bearings are also included. The magnetic bearings and the motor have stator magnets or coils and poles disposed radially across the fluid passage from corresponding impeller magnets to define an annular gap positioned radially between the impeller and the stator, and positioned radially between all of the plurality of magnetic bearings, creating a straight through blood path without secondary flow paths.

    摘要翻译： 血泵具有可旋转地设置并通过包括轴向轴承的多个磁性轴承磁性地悬挂在定子的空腔内的叶轮，以便在空腔中轴向地支撑叶轮。 轴向轴承包括相邻的叶轮磁体和相邻的定子磁体，其相对于相邻的磁体具有轴向对准的极性和相反的极性。 电动机包括叶轮上的叶轮磁体和与定子相关联的线圈和极。 还包括径向永磁体和电磁轴承。 磁性轴承和电动机具有定子磁体或线圈和磁极，其径向跨越来自相应的叶轮磁体的流体通道设置，以限定径向位于叶轮和定子之间并且径向位于所有多个磁性轴承之间的环形间隙，从而产生 直通血路，无二次流路。

    EEPROM device having a retrograde program junction region and process for fabricating the device
    8.
    发明授权
    EEPROM device having a retrograde program junction region and process for fabricating the device 有权
    具有逆行程序接合区域的EEPROM器件和用于制造器件的工艺

    公开(公告)号：US06716705B1

    公开(公告)日：2004-04-06

    申请号：US10161283

    申请日：2002-06-03

    申请人： Sunil D. Mehta ,  Guoxin Li

    发明人： Sunil D. Mehta ,  Guoxin Li

    IPC分类号： H01L21336

    CPC分类号： H01L27/11521 ,  G11C16/0433 ,  G11C16/0441 ,  H01L27/11558

    摘要： An EEPROM device and process for fabricating the device having a retrograde program junction region includes providing a semiconductor substrate having a principal surface and forming a program junction region in the semiconductor substrate. The program junction region is characterized by a doping concentration profile in which a maximum doping concentration is displaced away from the principal surface. The doping concentration profile can be obtained by forming a first portion of a tunnel dielectric layer on the principal surface, then introducing doping atoms into the program junction region, followed by forming a second portion of a tunnel dielectric layer. In another embodiment, the doping concentration profile in the program junction region is formed by two consecutive doping processes, in which either the same doping species is introduced at different energies, or a second doping process is carried out with a dopant having a different conductivity type than the first dopant.

    摘要翻译： 用于制造具有逆行程序接合区域的器件的EEPROM器件和工艺包括提供具有主表面并在半导体衬底中形成程序结区域的半导体衬底。 程序结区域的特征在于掺杂浓度分布，其中最大掺杂浓度从主表面移开。 可以通过在主表面上形成隧道电介质层的第一部分，然后将掺杂原子引入程序结区域，随后形成隧道介电层的第二部分来获得掺杂浓度分布。 在另一实施例中，程序结区域中的掺杂浓度分布由两个连续的掺杂工艺形成，其中以不同的能量引入相同的掺杂种类，或者用具有不同导电类型的掺杂剂进行第二掺杂工艺 比第一掺杂剂。