公开(公告)号：US07911042B2

公开(公告)日：2011-03-22

申请号：US12000105

申请日：2007-12-07

申请人： Yuya Yoshino ,  Akinobu Inoue ,  Atsunori Kajiki ,  Sadakazu Akaike ,  Norio Yamanishi ,  Takashi Tsubota

发明人： Yuya Yoshino ,  Akinobu Inoue ,  Atsunori Kajiki ,  Sadakazu Akaike ,  Norio Yamanishi ,  Takashi Tsubota

IPC分类号： H01L23/02

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

摘要翻译： 包装体包括：包括基板的封装主体，安装在基板的第一表面上的电子部件和用于密封电子部件的密封树脂层; 以及用于覆盖所述密封树脂层的屏蔽壳体，所述屏蔽壳体由金属制成并且在横截面视图中具有倒U形，其中所述屏蔽壳体的弯曲部分形成为至少一个 屏蔽壳的端部的一部分朝向与第一表面相反的第二表面弯曲，并且弯曲部分抵靠在第二表面上，使得屏蔽壳附接到基板。

公开(公告)号：US20080165513A1

公开(公告)日：2008-07-10

申请号：US12000731

申请日：2007-12-17

申请人： Akinobu Inoue ,  Sadakazu Akaike ,  Atsunori Kajiki ,  Yuya Yoshino ,  Takashi Tsubota ,  Norio Yamanishi

发明人： Akinobu Inoue ,  Sadakazu Akaike ,  Atsunori Kajiki ,  Yuya Yoshino ,  Takashi Tsubota ,  Norio Yamanishi

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/186 ,  H01L23/3128 ,  H01L24/14 ,  H01L24/17 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/13147 ,  H01L2224/134 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K1/145 ,  H05K3/4614 ,  H05K2201/10234 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/049 ,  Y10T29/49146 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least one of the board 10. Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30, which faces the other board 20.

摘要翻译： 它是如下配置的电子部件内置基板100。 也就是说，电子部件30设置在至少两个板10和20之间。 电子部件30的电极34电连接到板10中的至少一个。 而且，板10和20彼此电连接。 另外，用树脂密封板10和20之间的间隙。 电子部件内置基板100的特征在于，在与另一基板20相对的电子部件30的表面上设置有用于将基板10,20彼此电连接的焊球40。

公开(公告)号：US20080157296A1

公开(公告)日：2008-07-03

申请号：US12000105

申请日：2007-12-07

申请人： Yuya Yoshino ,  Akinobu Inoue ,  Atsunori Kajiki ,  Sadakazu Akaike ,  Norio Yamanishi ,  Takashi Tsubota

发明人： Yuya Yoshino ,  Akinobu Inoue ,  Atsunori Kajiki ,  Sadakazu Akaike ,  Norio Yamanishi ,  Takashi Tsubota

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

摘要翻译： 包装体包括：包括基板的封装主体，安装在基板的第一表面上的电子部件和用于密封电子部件的密封树脂层; 以及用于覆盖所述密封树脂层的屏蔽壳体，所述屏蔽壳体由金属制成并且在横截面视图中具有倒U形，其中所述屏蔽壳体的弯曲部分形成为至少一个 屏蔽壳的端部的一部分朝向与第一表面相反的第二表面弯曲，并且弯曲部分抵靠在第二表面上，使得屏蔽壳附接到基板。