Panel edge enclosures
    2.
    发明授权

    公开(公告)号:US10442965B2

    公开(公告)日:2019-10-15

    申请号:US15789102

    申请日:2017-10-20

    Applicant: Zephyros, Inc.

    Abstract: The present invention contemplates a method for enclosing a panel edge comprising forming a panel structure having at least one edge, applying a reformable epoxy resin material onto the at least one edge, and contacting the reformable epoxy resin material within about 10 minutes, or even about 5 minutes of applying the reformable epoxy resin material such that the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact.

    PANEL EDGE ENCLOSURES
    6.
    发明申请
    PANEL EDGE ENCLOSURES 有权
    面板边缘

    公开(公告)号:US20160039192A1

    公开(公告)日:2016-02-11

    申请号:US14823258

    申请日:2015-08-11

    Applicant: Zephyros, Inc.

    Abstract: The present invention contemplates a method for enclosing a panel edge comprising forming a panel structure having at least one edge, applying a reformable epoxy resin material onto the at least one edge, and contacting the reformable epoxy resin material within about 10 minutes, or even about 5 minutes of applying the reformable epoxy resin material such that the reformable epoxy resin material is below its glass transition temperature and dry to the touch upon contact.

    Abstract translation: 本发明考虑了一种用于封闭面板边缘的方法,包括形成具有至少一个边缘的面板结构,将可重整环氧树脂材料施加到所述至少一个边缘上,并使所述可重整环氧树脂材料在约10分钟或甚至约 施加可重整环氧树脂材料5分钟使得可重整环氧树脂材料低于其玻璃化转变温度,并在接触时干燥至触感。

    APPLICATION OF ADHESIVES
    8.
    发明申请

    公开(公告)号:US20230082593A1

    公开(公告)日:2023-03-16

    申请号:US17950344

    申请日:2022-09-22

    Applicant: Zephyros, Inc.

    Abstract: Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250%.

    HOT MELT APPLICABLE STRUCTURAL ADHESIVES
    10.
    发明申请

    公开(公告)号:US20190292427A1

    公开(公告)日:2019-09-26

    申请号:US16302898

    申请日:2017-05-16

    Applicant: Zephyros, Inc.

    Abstract: The invention relates to a structural adhesive formulation, which is heat activatable at a heat activation temperature; meltable without heat activation at an application temperature above its melting point and below the heat activation temperature; and solid at ambient temperature; wherein upon heat activation the structural adhesive formulation is capable of expansion with a volumetric expansion of up to about 250 vol.-%; wherein the heat activatable structural adhesive formulation comprises (a) an epoxy resin component; (b) an adhesion promoter component; (c) a cross-linking component; (d) a blowing component; (e) optionally, an impact modifier component; (f) optionally, a thixotropic filler component; and (g) optionally, a non-thixotropic filler component. The structural adhesive formulation is particularly useful for application by means of a hot melt applicator, preferably a hand held hot melt gun.

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