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    Potting Paste for Honeycomb Reinforcement
    2.
    发明申请
    Potting Paste for Honeycomb Reinforcement 有权

    公开(公告)号：US20220396719A1

    公开(公告)日：2022-12-15

    申请号：US17770168

    申请日：2020-11-10

    Applicant: Zephyros, Inc.

    Inventor： Vincent Duclos ,  Eric Elkaim ,  Estelle Huther Ebersohl ,  Michel Awkal

    IPC: C09J11/06 ,  C09J11/04 ,  C08K3/016 ,  C09J163/00

    Abstract: The invention relates to a potting paste composition for honeycomb reinforcement having improved fire retardancy characteristics. The potting paste composition comprises (a) a curable polymer; (b) a curing agent for the curable polymer; (c) a fire retardant comprising an ammonium polyphosphate in combination with an ingredient selected from the group consisting of metal hydroxides, expandable graphites, liquid phosphate esters, phosphorous organic compounds or salts thereof, and zeolites; and(d) a filler selected from the group consisting of polymeric microspheres, hollow glass microspheres, and thixotropic fillers; wherein the potting paste has an uncured density determined by the method according to EN ISO 1183 of not more than 0.7100 g/cm3, preferably of at most 0.680 g/cm3, more preferably of at most 0.673 g/cm3, still more preferably of at most 0.660 g/cm3, even more preferably of at most 0.658 g/cm3, yet more preferably of at most 0.653 g/cm3 and in particular of at most 0.620 g/cm3; and wherein the total content of the fire retardant is at least 5.0 wt.-%, preferably at least 10 wt.-%, more preferably at least 15 wt.-%, relative to the total weight of the potting paste composition.

    Low Density Flame Retardant Two-Component Composition for Structural Void Filling
    6.
    发明申请
    Low Density Flame Retardant Two-Component Composition for Structural Void Filling 有权

    公开(公告)号：US20230092362A1

    公开(公告)日：2023-03-23

    申请号：US17800557

    申请日：2021-02-17

    Applicant: Zephyros, Inc.

    Inventor： Olivier Lemoine ,  Morgane Winkler ,  Nathalie Parent ,  Michel Awkal

    IPC: C08G59/54 ,  C08L63/04 ,  C08K3/32

    Abstract: The invention relates to a low density two-component structural void filling composition that is preferably based on epoxy chemistry. It is designed for use on interior honeycomb sandwich structures as edge close-out and corner reinforcement, as well as local reinforcement for mechanical fixation or complex gap filling. The composition is compatible with metal and non-metal constructions that are typically found in aircraft interiors. The cured material has excellent fire, smoke and toxicity properties. Further, the composition has excellent processing attributes due to easy storage, handling, extrudability, filling, grinding, and painting abilities.

    Thermosetting adhesive films including a fibrous carrier
    8.
    发明授权
    Thermosetting adhesive films including a fibrous carrier 有权

    公开(公告)号：US10577522B2

    公开(公告)日：2020-03-03

    申请号：US14907160

    申请日：2014-07-25

    Applicant: Zephyros, Inc.

    Inventor： Michel Awkal ,  Morgan Chene

    IPC: C09J7/00 ,  C09J163/00 ,  C09J171/00 ,  C09J5/00 ,  C08J5/12

    Abstract: Flexible films comprise an adhesive layer and a fibrous supporting layer and the thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates where they can reduce the formation of galvanic corrosion.

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