公开(公告)号：US20130168068A1

公开(公告)日：2013-07-04

申请号：US13339514

申请日：2011-12-29

申请人： Zhen Huang ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Chunjian Ni ,  Mark E. Steinke ,  Jamil A. Wakil

发明人： Zhen Huang ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Chunjian Ni ,  Mark E. Steinke ,  Jamil A. Wakil

IPC分类号： F28F3/12

CPC分类号： F28F7/02 ,  F28D15/0233 ,  F28F3/12 ,  F28F2013/001 ,  H01L23/36 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cold plate comprises a cold plate body having a base for thermally engaging a heat-generating device, a plurality of internal channels extending through the cold plate body for the passage of a liquid coolant, a first region between the base and the plurality of internal channels, and a second region between the plurality of internal channels and a top that is generally opposite the base from the plurality of internal channels. The cold plate body is made from a first thermally conductive material. The cold plate also comprises at least one thermally conductive member extending around the plurality of channels from the first region below the plurality of channels to the second region above the plurality of channels. The at least one thermally conductive member has a greater thermal conductivity than the first thermally conductive material to move heat from the first region to the second region.

摘要翻译： 冷板包括具有用于热接合发热装置的基座的冷板主体，延伸穿过冷板主体以用于液体冷却剂通过的多个内部通道，在基部和多个内部之间的第一区域 通道，以及多个内部通道之间的第二区域和与多个内部通道大致相对的基座的顶部。 冷板体由第一导热材料制成。 冷板还包括至少一个导热构件，其围绕多个通道从多个通道下方的第一区域延伸到多个通道上方的第二区域。 至少一个导热构件具有比第一导热材料更大的热导率，以将热量从第一区域移动到第二区域。

公开(公告)号：US20110286175A1

公开(公告)日：2011-11-24

申请号：US12785779

申请日：2010-05-24

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Mark E. Steinke ,  Aparna Vallury

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Mark E. Steinke ,  Aparna Vallury

IPC分类号： G06F1/20

CPC分类号： G06F1/20 ,  G06F2200/201

摘要： An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.

摘要翻译： 用于冷却安装在计算机系统中的存储器模块的装置包括液体冷却剂导管，该液体冷却剂导管连接到导管支撑结构，导管支撑结构具有选择性地固定在计算机系统的第一预配置存储器模块插槽内的形状因子，以便定位液体冷却剂导管 在第一个插槽之上。 热管提供液体导管与散热器组件之间的直接热接触，与存储器模块的表面直接热接触。 该装置可以包括用于类似地冷却第二存储器模块的第二热管和第二散热器组件。 在替代配置中，设备可以冷却导管的相对侧上的存储器模块或存储器模块，这些存储器模块都在导管的同一侧。

公开(公告)号：US20110232889A1

公开(公告)日：2011-09-29

申请号：US12729859

申请日：2010-03-23

申请人： Eric A. Eckberg ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  William M. Megarity ,  Mark E. Steinke

发明人： Eric A. Eckberg ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  William M. Megarity ,  Mark E. Steinke

IPC分类号： F28F27/00 ,  F28D15/00

CPC分类号： F28D1/0435 ,  F28D1/0477 ,  H05K7/2079

摘要： Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.

摘要翻译： 本发明的实施例包括冷却系统和方法，用于通过在独立控制的流量和温度条件下将液体冷却剂循环通过架式热交换器的不同部分来冷却计算机机架。 在根据一个实施例的方法中，第一液体冷却剂被供应到空气对液体热交换器的第一部分。 第二液体冷却剂以与第一液体冷却剂不同的温度供应到空气至液体热交换器的第二部分。 气流通过机架安装的计算机部件产生到空气 - 液体热交换器的第一和第二部分。 独立地控制第一和第二液体冷却剂的流量，以实施目标冷却参数。 第一和第二翅片管部分的独立操作允许增加使用未冷却的水而不牺牲散热目的。

公开(公告)号：US20140060799A1

公开(公告)日：2014-03-06

申请号：US13605429

申请日：2012-09-06

申请人： Eric A. Eckberg ,  Howard V. Mahaney, JR. ,  Michael S. Miller ,  Tejas Shah

发明人： Eric A. Eckberg ,  Howard V. Mahaney, JR. ,  Michael S. Miller ,  Tejas Shah

IPC分类号： F28F27/00 ,  G05D23/00

CPC分类号： G05D23/1932 ,  H05K7/2079

摘要： Configuring a liquid cooling system according to a particular embodiment of the present invention include a valve controller determining a temperature of liquid within a particular portion of the liquid cooling system; determining whether the temperature of the liquid within the particular portion of the liquid cooling system exceeds a predetermined threshold; if predetermined threshold is not exceeded, configuring, one or more valves such that liquid directly exiting a first liquid cooling apparatus of a first electrical component rack is used in a second liquid cooling apparatus to cool a second electrical component rack; and if the predetermined threshold is exceeded, configuring the one or more valves such that liquid directly exiting a main supply line of the liquid cooling system is used in the second liquid cooling apparatus to cool the second electrical component rack.

摘要翻译： 根据本发明的特定实施例的液体冷却系统的配置包括：阀控制器，其确定液体冷却系统的特定部分内的液体的温度; 确定液体冷却系统的特定部分内的液体的温度是否超过预定的阈值; 如果不超过预定阈值，则配置一个或多个阀，使得直接离开第一电气部件齿条的第一液体冷却装置的液体被用于第二液体冷却装置中以冷却第二电气部件齿条; 并且如果超过预定阈值，则构造一个或多个阀，使得在第二液体冷却装置中使用直接离开液体冷却系统的主供应管线的液体来冷却第二电气部件架。

公开(公告)号：US20140060798A1

公开(公告)日：2014-03-06

申请号：US13600695

申请日：2012-08-31

申请人： Eric A. Eckberg ,  Howard V. Mahaney, JR. ,  Michael S. Miller ,  Tejas Shah

发明人： Eric A. Eckberg ,  Howard V. Mahaney, JR. ,  Michael S. Miller ,  Tejas Shah

IPC分类号： F28D15/00 ,  G05D23/00

CPC分类号： G05D23/1932 ,  H05K7/2079

摘要： Apparatuses and computer program products for configuring a liquid cooling system are provided. Embodiments include a valve controller determining a temperature of liquid within a particular portion of the liquid cooling system; determining whether the temperature of the liquid within the particular portion of the liquid cooling system exceeds a predetermined threshold; if predetermined threshold is not exceeded, configuring, one or more valves such that liquid directly exiting a first liquid cooling apparatus of a first electrical component rack is used in a second liquid cooling apparatus to cool a second electrical component rack; and if the predetermined threshold is exceeded, configuring the one or more valves such that liquid directly exiting a main supply line of the liquid cooling system is used in the second liquid cooling apparatus to cool the second electrical component rack.

摘要翻译： 提供了用于配置液体冷却系统的装置和计算机程序产品。 实施例包括阀控制器，其确定液体冷却系统的特定部分内的液体的温度; 确定液体冷却系统的特定部分内的液体的温度是否超过预定的阈值; 如果不超过预定阈值，则配置一个或多个阀，使得直接离开第一电气部件齿条的第一液体冷却装置的液体被用于第二液体冷却装置中以冷却第二电气部件齿条; 并且如果超过预定阈值，则构造一个或多个阀，使得在第二液体冷却装置中使用直接离开液体冷却系统的主供应管线的液体来冷却第二电气部件架。