公开(公告)号：US20130168068A1

公开(公告)日：2013-07-04

申请号：US13339514

申请日：2011-12-29

申请人： Zhen Huang ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Chunjian Ni ,  Mark E. Steinke ,  Jamil A. Wakil

发明人： Zhen Huang ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Chunjian Ni ,  Mark E. Steinke ,  Jamil A. Wakil

IPC分类号： F28F3/12

CPC分类号： F28F7/02 ,  F28D15/0233 ,  F28F3/12 ,  F28F2013/001 ,  H01L23/36 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cold plate comprises a cold plate body having a base for thermally engaging a heat-generating device, a plurality of internal channels extending through the cold plate body for the passage of a liquid coolant, a first region between the base and the plurality of internal channels, and a second region between the plurality of internal channels and a top that is generally opposite the base from the plurality of internal channels. The cold plate body is made from a first thermally conductive material. The cold plate also comprises at least one thermally conductive member extending around the plurality of channels from the first region below the plurality of channels to the second region above the plurality of channels. The at least one thermally conductive member has a greater thermal conductivity than the first thermally conductive material to move heat from the first region to the second region.

摘要翻译： 冷板包括具有用于热接合发热装置的基座的冷板主体，延伸穿过冷板主体以用于液体冷却剂通过的多个内部通道，在基部和多个内部之间的第一区域 通道，以及多个内部通道之间的第二区域和与多个内部通道大致相对的基座的顶部。 冷板体由第一导热材料制成。 冷板还包括至少一个导热构件，其围绕多个通道从多个通道下方的第一区域延伸到多个通道上方的第二区域。 至少一个导热构件具有比第一导热材料更大的热导率，以将热量从第一区域移动到第二区域。

公开(公告)号：US20110286175A1

公开(公告)日：2011-11-24

申请号：US12785779

申请日：2010-05-24

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Mark E. Steinke ,  Aparna Vallury

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Mark E. Steinke ,  Aparna Vallury

IPC分类号： G06F1/20

CPC分类号： G06F1/20 ,  G06F2200/201

摘要： An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.

摘要翻译： 用于冷却安装在计算机系统中的存储器模块的装置包括液体冷却剂导管，该液体冷却剂导管连接到导管支撑结构，导管支撑结构具有选择性地固定在计算机系统的第一预配置存储器模块插槽内的形状因子，以便定位液体冷却剂导管 在第一个插槽之上。 热管提供液体导管与散热器组件之间的直接热接触，与存储器模块的表面直接热接触。 该装置可以包括用于类似地冷却第二存储器模块的第二热管和第二散热器组件。 在替代配置中，设备可以冷却导管的相对侧上的存储器模块或存储器模块，这些存储器模块都在导管的同一侧。

公开(公告)号：US07969736B1

公开(公告)日：2011-06-28

申请号：US12701640

申请日：2010-02-08

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  Jason A. Matteson ,  Mark E. Steinke

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  Jason A. Matteson ,  Mark E. Steinke

IPC分类号： H05K7/20

CPC分类号： H01L23/36 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

摘要： DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.

摘要翻译： 通过在相邻DIMM之间定位导热底座来冷却DIMM。 诸如热管或金属杆的导热基座通过导热元件从DIMM接收热量，导热元件被选择性地偏压抵靠所安装的DIMM。 底座将热量传送到沿着DIMM端部延伸的液体导管，其中循环液体带走热量。 导热元件提供可调整的跨度以适应DIMM表面之间的距离的变化。 可以安装本发明的实施例而不延伸到DIMM的高度之上。

公开(公告)号：US08789384B2

公开(公告)日：2014-07-29

申请号：US12729859

申请日：2010-03-23

申请人： Eric A. Eckberg ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  William M. Megarity ,  Mark E. Steinke

发明人： Eric A. Eckberg ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  William M. Megarity ,  Mark E. Steinke

IPC分类号： F25B27/00 ,  F25B7/00 ,  F25D23/12 ,  F28D15/00 ,  H05K7/20

CPC分类号： F28D1/0435 ,  F28D1/0477 ,  H05K7/2079

摘要： Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.

摘要翻译： 本发明的实施例包括冷却系统和方法，用于通过在独立控制的流量和温度条件下将液体冷却剂循环通过架式热交换器的不同部分来冷却计算机机架。 在根据一个实施例的方法中，第一液体冷却剂被供应到空气对液体热交换器的第一部分。 第二液体冷却剂以与第一液体冷却剂不同的温度供应到空气至液体热交换器的第二部分。 气流通过机架安装的计算机部件产生到空气 - 液体热交换器的第一和第二部分。 独立地控制第一和第二液体冷却剂的流量，以实施目标冷却参数。 第一和第二翅片管部分的独立操作允许增加使用未冷却的水而不牺牲散热目的。

公开(公告)号：US08385069B2

公开(公告)日：2013-02-26

申请号：US12785779

申请日：2010-05-24

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  Mark E. Steinke ,  Aparna Vallury

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  Mark E. Steinke ,  Aparna Vallury

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  G06F2200/201

摘要： An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.

摘要翻译： 用于冷却安装在计算机系统中的存储器模块的装置包括液体冷却剂导管，该液体冷却剂导管连接到导管支撑结构，导管支撑结构具有选择性地固定在计算机系统的第一预配置存储器模块插槽内的形状因子，以便定位液体冷却剂导管 在第一个插槽之上。 热管提供液体导管与散热器组件之间的直接热接触，与存储器模块的表面直接热接触。 该装置可以包括用于类似地冷却第二存储器模块的第二热管和第二散热器组件。 在替代配置中，设备可以冷却导管的相对侧上的存储器模块或存储器模块，这些存储器模块都在导管的同一侧。

公开(公告)号：US20110232889A1

公开(公告)日：2011-09-29

申请号：US12729859

申请日：2010-03-23

申请人： Eric A. Eckberg ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  William M. Megarity ,  Mark E. Steinke

发明人： Eric A. Eckberg ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  William M. Megarity ,  Mark E. Steinke

IPC分类号： F28F27/00 ,  F28D15/00

CPC分类号： F28D1/0435 ,  F28D1/0477 ,  H05K7/2079

摘要： Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.

摘要翻译： 本发明的实施例包括冷却系统和方法，用于通过在独立控制的流量和温度条件下将液体冷却剂循环通过架式热交换器的不同部分来冷却计算机机架。 在根据一个实施例的方法中，第一液体冷却剂被供应到空气对液体热交换器的第一部分。 第二液体冷却剂以与第一液体冷却剂不同的温度供应到空气至液体热交换器的第二部分。 气流通过机架安装的计算机部件产生到空气 - 液体热交换器的第一和第二部分。 独立地控制第一和第二液体冷却剂的流量，以实施目标冷却参数。 第一和第二翅片管部分的独立操作允许增加使用未冷却的水而不牺牲散热目的。

公开(公告)号：US20130074339A1

公开(公告)日：2013-03-28

申请号：US13247275

申请日：2011-09-28

申请人： Michael A. Boraas ,  Vinod Kamath ,  Michael S. Miller ,  Mark E. Steinke ,  Jamil A. Wakil

发明人： Michael A. Boraas ,  Vinod Kamath ,  Michael S. Miller ,  Mark E. Steinke ,  Jamil A. Wakil

IPC分类号： B21D53/02 ,  B23P15/26

CPC分类号： B23P15/26 ,  H01L21/565 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/53113 ,  H01L2924/00

摘要： Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.

摘要翻译： 提供了用于形成包覆成型的双列直插存储器模块（DIMM）冷却结构的方法，装置和计算机程序产品。 实施例包括通过标签模块识别指示拍摄照片的情况的上下文信息; 基于上下文信息，由标签模块从与用户的简档相关联的多个朋友简档中选择候选简档; 并且通过标签模块向用户提示所选择的候选简档作为在照片中标记的潜在朋友。

公开(公告)号：US08900503B2

公开(公告)日：2014-12-02

申请号：US13247275

申请日：2011-09-28

申请人： Michael A. Boraas ,  Vinod Kamath ,  Michael S. Miller ,  Mark E. Steinke ,  Jamil A. Wakil

发明人： Michael A. Boraas ,  Vinod Kamath ,  Michael S. Miller ,  Mark E. Steinke ,  Jamil A. Wakil

IPC分类号： B29C45/14

CPC分类号： B23P15/26 ,  H01L21/565 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/53113 ,  H01L2924/00

摘要： Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.

摘要翻译： 提供了用于形成包覆成型的双列直插存储器模块（DIMM）冷却结构的方法，装置和计算机程序产品。 实施例包括通过标签模块识别指示拍摄照片的情况的上下文信息; 基于上下文信息，由标签模块从与用户的简档相关联的多个朋友简档中选择候选简档; 并且通过标签模块向用户提示所选择的候选简档作为在照片中标记的潜在朋友。

公开(公告)号：US08638559B2

公开(公告)日：2014-01-28

申请号：US13293174

申请日：2011-11-10

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： H05K7/20

CPC分类号： F28D15/0275 ,  G06F1/185 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20809 ,  H01L2924/00

摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。

公开(公告)号：US20130135812A1

公开(公告)日：2013-05-30

申请号：US13305092

申请日：2011-11-28

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： H05K7/20 ,  F28F9/02

CPC分类号： H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。