公开(公告)号：US20140268614A1

公开(公告)日：2014-09-18

申请号：US13802011

申请日：2013-03-13

申请人： Zhichao ZHANG ,  Zhiguo Qian ,  Tolga Memioglu ,  Kemal Aygun

发明人： Zhichao ZHANG ,  Zhiguo Qian ,  Tolga Memioglu ,  Kemal Aygun

IPC分类号： H05K1/02 ,  H05K1/18 ,  H01L21/768

CPC分类号： H01L21/768 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/16235 ,  H01L2924/15311 ,  H05K1/0228 ,  H05K1/0251 ,  H05K1/0298

摘要： Capacitively coupled vertical transitions may be configured with a desired amount of mutual capacitance to at least partially cancel crosstalk for an overall channel crosstalk (e.g., FEXT) reduction. In embodiments, capacitive coupling of adjacent vertical transitions is achieved with overlapping metal surfaces within the vertical transitions. In embodiments, one or more of the overlapping metal surfaces are vias, via pads, or metal stub features extending off a vertical transition. In embodiments, signal paths with overlapped vertical transitions are utilized to achieve crosstalk reduction of more than one victim-aggressor pair and/or to achieve crosstalk reduction of more than two aggressors. In embodiments, capacitively coupled vertical transitions are implemented in a package substrate, an interposer, or a printed circuit board.

摘要翻译： 电容耦合的垂直转换可以配置有期望量的互电容，以至少部分地消除整个信道串扰（例如，FEXT）减少的串扰。 在实施例中，相邻垂直转变的电容耦合是通过垂直转换内的重叠金属表面实现的。 在实施例中，一个或多个重叠金属表面是从垂直过渡延伸的通孔，通孔焊盘或金属短截线特征。 在实施例中，利用具有重叠垂直转换的信号路径来实现多于一个受害者 - 攻击者对的串扰减少和/或实现多于两个侵略者的串扰减少。 在实施例中，在封装衬底，插入器或印刷电路板中实现电容耦合的垂直转变。

公开(公告)号：US20140151875A1

公开(公告)日：2014-06-05

申请号：US14171714

申请日：2014-02-03

申请人： Zhichao ZHANG ,  Tolga Memioglu ,  Tao Wu ,  Kemal Aygun

发明人： Zhichao ZHANG ,  Tolga Memioglu ,  Tao Wu ,  Kemal Aygun

IPC分类号： H01L23/66 ,  H01L21/768 ,  H01L23/522

CPC分类号： H01L23/66 ,  H01L21/76877 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5226 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/18 ,  H01L2223/6627 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/01029 ,  H01L2924/1426 ,  H01L2924/143 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01P3/081 ,  H05K1/0216 ,  H05K1/0222 ,  H05K1/0228 ,  H01L2924/014 ,  H01L2924/00014

摘要： Transmission lines with a first dielectric material separating signal traces and a second dielectric material separating the signal traces from a ground plane. In embodiments, mutual capacitance is tuned relative to self-capacitance to reverse polarity of far end crosstalk between a victim and aggressor channel relative to that induced by other interconnect portions along the length of the channels, such as inductively coupled portions. In embodiments, a transmission line for a single-ended channel includes a material of a higher dielectric constant within the same routing plane as a microstrip or stripline conductor, and a material of a lower dielectric constant between the conductor and the ground plane(s). In embodiments, a transmission line for a differential pair includes a material of a lower dielectric constant within the same routing plane as a microstrip or stripline conductors, and a material of a higher dielectric constant between the conductors and the ground plane(s).

摘要翻译： 具有分离信号迹线的第一介电材料的传输线和将信号迹线与接地平面分开的第二介电材料。 在实施例中，互电容相对于自电容被调谐，以相对于沿着诸如电感耦合部分的通道的长度的其它互连部分感应到的远端串扰的极性反转。 在实施例中，用于单端通道的传输线包括在与微带线或带状线导体相同的布线平面内具有较高介电常数的材料，以及在导体和接地平面之间具有较低介电常数的材料， 。 在实施例中，用于差分对的传输线包括在与微带线或带状线导体相同的布线平面内具有较低介电常数的材料，以及在导体和接地平面之间具有较高介电常数的材料。

公开(公告)号：US08643184B1

公开(公告)日：2014-02-04

申请号：US13665741

申请日：2012-10-31

申请人： Zhichao Zhang ,  Tolga Memioglu ,  Tao Wu ,  Kemal Aygun

发明人： Zhichao Zhang ,  Tolga Memioglu ,  Tao Wu ,  Kemal Aygun

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/04

CPC分类号： H01L23/66 ,  H01L21/76877 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5226 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/18 ,  H01L2223/6627 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/01029 ,  H01L2924/1426 ,  H01L2924/143 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01P3/081 ,  H05K1/0216 ,  H05K1/0222 ,  H05K1/0228 ,  H01L2924/014 ,  H01L2924/00014

摘要： Transmission lines with a first dielectric material separating signal traces and a second dielectric material separating the signal traces from a ground plane. In embodiments, mutual capacitance is tuned relative to self-capacitance to reverse polarity of far end crosstalk between a victim and aggressor channel relative to that induced by other interconnect portions along the length of the channels, such as inductively coupled portions. In embodiments, a transmission line for a single-ended channel includes a material of a higher dielectric constant within the same routing plane as a microstrip or stripline conductor, and a material of a lower dielectric constant between the conductor and the ground plane(s). In embodiments, a transmission line for a differential pair includes a material of a lower dielectric constant within the same routing plane as a microstrip or stripline conductors, and a material of a higher dielectric constant between the conductors and the ground plane(s).

摘要翻译： 具有分离信号迹线的第一介电材料的传输线和将信号迹线与接地平面分开的第二介电材料。 在实施例中，互电容相对于自电容被调谐，以相对于沿着诸如电感耦合部分的通道的长度的其它互连部分感应到的远端串扰的极性反转。 在实施例中，用于单端通道的传输线包括在与微带线或带状线导体相同的布线平面内具有较高介电常数的材料，以及在导体和接地平面之间具有较低介电常数的材料， 。 在实施例中，用于差分对的传输线包括在与微带线或带状线导体相同的布线平面内具有较低介电常数的材料，以及在导体和接地平面之间具有较高介电常数的材料。

公开(公告)号：US20080079147A1

公开(公告)日：2008-04-03

申请号：US11542008

申请日：2006-09-29

申请人： Michael J. Hill ,  Anne E. Augustine ,  Tolga Memioglu

发明人： Michael J. Hill ,  Anne E. Augustine ,  Tolga Memioglu

IPC分类号： H01L23/34

CPC分类号： H01G4/30 ,  H01G4/232 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0231 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2224/0401

摘要： In some embodiments, an embedded array capacitor with side terminals is presented. In this regard, an integrated circuit package is introduced having a plurality of micro-vias, a plurality of dielectric layers, and an array capacitor with side terminals coupled with the micro-vias and embedded in the dielectric layers. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，呈现具有侧面端子的嵌入式阵列电容器。 在这方面，引入了具有多个微通孔，多个电介质层和具有与微通孔耦合并嵌入电介质层中的侧端子的阵列电容器的集成电路封装。 还公开并要求保护其他实施例。