公开(公告)号：US20140151875A1

公开(公告)日：2014-06-05

申请号：US14171714

申请日：2014-02-03

申请人： Zhichao ZHANG ,  Tolga Memioglu ,  Tao Wu ,  Kemal Aygun

发明人： Zhichao ZHANG ,  Tolga Memioglu ,  Tao Wu ,  Kemal Aygun

IPC分类号： H01L23/66 ,  H01L21/768 ,  H01L23/522

CPC分类号： H01L23/66 ,  H01L21/76877 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5226 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/18 ,  H01L2223/6627 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/01029 ,  H01L2924/1426 ,  H01L2924/143 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01P3/081 ,  H05K1/0216 ,  H05K1/0222 ,  H05K1/0228 ,  H01L2924/014 ,  H01L2924/00014

摘要： Transmission lines with a first dielectric material separating signal traces and a second dielectric material separating the signal traces from a ground plane. In embodiments, mutual capacitance is tuned relative to self-capacitance to reverse polarity of far end crosstalk between a victim and aggressor channel relative to that induced by other interconnect portions along the length of the channels, such as inductively coupled portions. In embodiments, a transmission line for a single-ended channel includes a material of a higher dielectric constant within the same routing plane as a microstrip or stripline conductor, and a material of a lower dielectric constant between the conductor and the ground plane(s). In embodiments, a transmission line for a differential pair includes a material of a lower dielectric constant within the same routing plane as a microstrip or stripline conductors, and a material of a higher dielectric constant between the conductors and the ground plane(s).

摘要翻译： 具有分离信号迹线的第一介电材料的传输线和将信号迹线与接地平面分开的第二介电材料。 在实施例中，互电容相对于自电容被调谐，以相对于沿着诸如电感耦合部分的通道的长度的其它互连部分感应到的远端串扰的极性反转。 在实施例中，用于单端通道的传输线包括在与微带线或带状线导体相同的布线平面内具有较高介电常数的材料，以及在导体和接地平面之间具有较低介电常数的材料， 。 在实施例中，用于差分对的传输线包括在与微带线或带状线导体相同的布线平面内具有较低介电常数的材料，以及在导体和接地平面之间具有较高介电常数的材料。

公开(公告)号：US08643184B1

公开(公告)日：2014-02-04

申请号：US13665741

申请日：2012-10-31

申请人： Zhichao Zhang ,  Tolga Memioglu ,  Tao Wu ,  Kemal Aygun

发明人： Zhichao Zhang ,  Tolga Memioglu ,  Tao Wu ,  Kemal Aygun

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/04

CPC分类号： H01L23/66 ,  H01L21/76877 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5226 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/18 ,  H01L2223/6627 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/01029 ,  H01L2924/1426 ,  H01L2924/143 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01P3/081 ,  H05K1/0216 ,  H05K1/0222 ,  H05K1/0228 ,  H01L2924/014 ,  H01L2924/00014

摘要： Transmission lines with a first dielectric material separating signal traces and a second dielectric material separating the signal traces from a ground plane. In embodiments, mutual capacitance is tuned relative to self-capacitance to reverse polarity of far end crosstalk between a victim and aggressor channel relative to that induced by other interconnect portions along the length of the channels, such as inductively coupled portions. In embodiments, a transmission line for a single-ended channel includes a material of a higher dielectric constant within the same routing plane as a microstrip or stripline conductor, and a material of a lower dielectric constant between the conductor and the ground plane(s). In embodiments, a transmission line for a differential pair includes a material of a lower dielectric constant within the same routing plane as a microstrip or stripline conductors, and a material of a higher dielectric constant between the conductors and the ground plane(s).

摘要翻译： 具有分离信号迹线的第一介电材料的传输线和将信号迹线与接地平面分开的第二介电材料。 在实施例中，互电容相对于自电容被调谐，以相对于沿着诸如电感耦合部分的通道的长度的其它互连部分感应到的远端串扰的极性反转。 在实施例中，用于单端通道的传输线包括在与微带线或带状线导体相同的布线平面内具有较高介电常数的材料，以及在导体和接地平面之间具有较低介电常数的材料， 。 在实施例中，用于差分对的传输线包括在与微带线或带状线导体相同的布线平面内具有较低介电常数的材料，以及在导体和接地平面之间具有较高介电常数的材料。

公开(公告)号：US20140160707A1

公开(公告)日：2014-06-12

申请号：US13707113

申请日：2012-12-06

申请人： Zhichao Zhang ,  Tao Wu ,  Zhiguo Qian ,  Kemal Aygun

发明人： Zhichao Zhang ,  Tao Wu ,  Zhiguo Qian ,  Kemal Aygun

IPC分类号： H05K1/18 ,  H05K3/10 ,  H05K1/02

CPC分类号： H05K1/0298 ,  H01L21/4846 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K2201/0191 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y10T29/49155 ,  H01L2924/00

摘要： Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having pads to be coupled to a semiconductor die, with a first trace coupled to a first pad among the pads, and a second trace coupled to a second pad among the pads. The first and second traces may have different thicknesses. Other embodiments including additional apparatuses and methods are described.

摘要翻译： 本文描述的一些实施例包括形成这种装置的装置和方法。 一个这样的实施例可以包括具有要耦合到半导体管芯的焊盘的布线布置，其中第一迹线耦合到焊盘之间的第一焊盘，以及耦合到焊盘之间的第二焊盘的第二迹线。 第一和第二迹线可以具有不同的厚度。 描述包括附加装置和方法的其他实施例。

公开(公告)号：US20140174808A1

公开(公告)日：2014-06-26

申请号：US13727439

申请日：2012-12-26

申请人： Zhichao Zhang ,  Tao Wu ,  Gaurav Chawla ,  Jeffrey Lee

发明人： Zhichao Zhang ,  Tao Wu ,  Gaurav Chawla ,  Jeffrey Lee

IPC分类号： H05K1/11 ,  H05K13/00

CPC分类号： H05K1/113 ,  H05K1/0243 ,  H05K1/025 ,  H05K3/3452 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09881 ,  H05K2201/10719

摘要： A land grid array (LGA) land pad having reduced capacitance is disclosed. The conductive portion of a land pad that overlaps a parallel ground plane within the substrate is reduced by one or more non-conductive voids though the thickness of the conductive portion of the land pad. The voids may allow the contact area of the land pad, as defined by the perimeter of the land pad, to remain the same while reducing the conductive portion that overlaps the parallel ground plane. Capacitance between the land pad and the parallel ground plane is reduced by an amount proportional to the reduction in overlapping conductive area.

摘要翻译： 公开了一种具有减小的电容的平面栅格阵列（LGA）焊盘。 通过衬垫的导电部分的厚度，通过一个或多个不导电的空隙来减小与衬底内的平行接地面重叠的焊盘的导电部分。 空隙可以允许由焊盘的周边限定的焊盘的接触面积保持相同，同时减少与平行接地平面重叠的导电部分。 焊盘和平行接地面之间的电容减少了与重叠导电面积减小成正比的量。

公开(公告)号：US20180342807A1

公开(公告)日：2018-11-29

申请号：US15607595

申请日：2017-05-29

申请人： Paul Robert Watson ,  Halim Boutayeb ,  Teyan Chen ,  Jingjing Huang ,  Tao Wu

发明人： Paul Robert Watson ,  Halim Boutayeb ,  Teyan Chen ,  Jingjing Huang ,  Tao Wu

IPC分类号： H01Q9/04 ,  H01Q21/06 ,  H01Q19/10 ,  H01Q1/38 ,  H01Q3/24

摘要： A radio frequency (RF) antenna unit that includes a first antenna and a second antenna. The first antenna is positioned on a reflector element, and includes at least three inverted-F antenna (IFAs) elements that are electrically connected to a first RF signal port and that each have an associated tunable element that controls excitation of the IFA element, the tunable elements being operative to control a polarization direction of the first antenna. The second antenna is co-located on the reflector element with the first antenna, and includes a plurality of antenna elements.

公开(公告)号：US09469645B2

公开(公告)日：2016-10-18

申请号：US13912898

申请日：2013-06-07

申请人： Arnab K. Chatterjee ,  Advait S. Nagle ,  Tao Wu ,  David C. Tully ,  Kelli L. Kuhen

发明人： Arnab K. Chatterjee ,  Advait S. Nagle ,  Tao Wu ,  David C. Tully ,  Kelli L. Kuhen

IPC分类号： A61K31/397 ,  C07D487/04 ,  C07D487/14 ,  C07D519/00 ,  A61K31/4985 ,  A61K31/506 ,  A61K31/513 ,  A61K31/5377 ,  A61K31/541 ,  A61K31/69 ,  A61K45/06 ,  C07D495/04 ,  C07F5/02

CPC分类号： C07D487/04 ,  A61K31/4985 ,  A61K31/506 ,  A61K31/513 ,  A61K31/5377 ,  A61K31/541 ,  A61K31/69 ,  A61K45/06 ,  C07D487/14 ,  C07D495/04 ,  C07D519/00 ,  C07F5/022 ,  Y02A50/409 ,  Y02A50/411 ,  Y02A50/414

摘要： The invention provides a class of compounds, pharmaceutical compositions comprising such compounds and methods of using such compounds to treat or prevent malaria.

摘要翻译： 本发明提供一类化合物，包含这些化合物的药物组合物和使用这些化合物治疗或预防疟疾的方法。

公开(公告)号：US09356688B2

公开(公告)日：2016-05-31

申请号：US12475241

申请日：2009-05-29

申请人： Tao Wu ,  Young Hoon Kwon ,  Yang Tang

发明人： Tao Wu ,  Young Hoon Kwon ,  Yang Tang

IPC分类号： H04B7/26 ,  H04B7/155 ,  H04B7/02

CPC分类号： H04B7/2606 ,  H04B7/026 ,  H04B7/15507 ,  H04B7/15592

摘要： Embodiments of the present invention are systems and methods for wireless communication. According to one embodiment, a system for wireless communication comprises a first relay station, second relay station, and a base station. The first relay station and the second relay station are operable to receive and transmit wireless signals. The base station is operable to transmit the wireless signals to the first relay station and the second relay station in an interchanging pattern during successive time frames so that the first relay station and the second relay station forward the wireless signals to a mobile station.

摘要翻译： 本发明的实施例是用于无线通信的系统和方法。 根据一个实施例，一种用于无线通信的系统包括第一中继站，第二中继站和基站。 第一中继站和第二中继站可操作以接收和发送无线信号。 基站可操作以在连续的时间帧期间以相互交换的模式将无线信号发送到第一中继站和第二中继站，使得第一中继站和第二中继站将无线信号转发到移动站。

公开(公告)号：US20160056102A1

公开(公告)日：2016-02-25

申请号：US14463285

申请日：2014-08-19

申请人： Manohar S. Konchady ,  Tao Wu ,  Mihir K. Roy ,  Wei-Lun K. Jen ,  Yi Li

发明人： Manohar S. Konchady ,  Tao Wu ,  Mihir K. Roy ,  Wei-Lun K. Jen ,  Yi Li

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/535

CPC分类号： H01L21/6835 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5389 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19106

摘要： A coreless package substrate with dual side solder resist layers is disclosed. The coreless package substrate has a top side and a bottom side opposite of the top side and includes a single build-up structure formed of at least one insulating layer, at least one via, and at least one conductive layer. The coreless package substrate also includes a bottom plurality of contact pads on the bottom side, and a top plurality of contact pads on the top side. A bottom solder resist layer is on the bottom side, and a top solder resist layer is on the top side. The concept of dual side solder resist is extended to packages with interconnect bridge with C4 interconnection pitch over a wide range.

摘要翻译： 公开了一种具有双面阻焊层的无芯封装基板。 无芯封装衬底具有与顶侧相反的顶侧和底侧，并且包括由至少一个绝缘层，至少一个通孔和至少一个导电层形成的单个堆积结构。 无芯封装基板还包括底侧的底部多个接触焊盘和顶侧上的顶部多个接触焊盘。 底部阻焊层位于底侧，顶部阻焊层在顶侧。 双面阻焊剂的概念扩展到具有C4互连间距的互连桥的封装。

公开(公告)号：US08927732B2

公开(公告)日：2015-01-06

申请号：US13435142

申请日：2012-03-30

申请人： Randall Lee Carter ,  Bruce Fletcher Johnson ,  Anup Sood ,  Michael James Rishel ,  John Fitzmaurice Valliant ,  Karin Ann Stephenson ,  Tao Wu ,  Yang Yang

发明人： Randall Lee Carter ,  Bruce Fletcher Johnson ,  Anup Sood ,  Michael James Rishel ,  John Fitzmaurice Valliant ,  Karin Ann Stephenson ,  Tao Wu ,  Yang Yang

IPC分类号： C07F7/22 ,  C07B59/00

CPC分类号： C07F7/2296 ,  C07B59/00 ,  C07F7/2208

摘要： The present teachings provide methods that enable the preparation and purification of radioiodinated vectors without the need for HPLC purification, as well as novel precursors which include biotin-like substituents useful in such methods.

摘要翻译： 本教导提供了能够制备和纯化放射性碘化载体而不需要HPLC纯化的方法，以及包括在这些方法中有用的生物素样取代基的新型前体。

公开(公告)号：US08871634B2

公开(公告)日：2014-10-28

申请号：US13599411

申请日：2012-08-30

申请人： Tao Wu ,  Islam A. Salama

发明人： Tao Wu ,  Islam A. Salama

IPC分类号： H01L21/4763 ,  H01L21/768 ,  H01L23/48

CPC分类号： H01L23/5226 ,  H01L21/768 ,  H01L21/76877 ,  H01L21/76883 ,  H01L23/48 ,  H01L23/525 ,  H01L23/53228 ,  H01L2924/0002 ,  H01L2924/00

摘要： This disclosure relates generally to an electronic device and method having can include a method of making a chip package. An insulator layer comprising an insulator material, the insulator layer positioned with respect to a first conductive line, forming a second conductive line with respect to the insulator layer, wherein the insulator layer is positioned between the first conductive line and the second conductive line, forming a opening in the insulator layer between the first conductive line and the second conductive line, at least some of the insulator material within the opening being exposed, and chemically bonding a conductor to the at least some of the insulator material within the opening, wherein the conductor electrically couples the first conductive line to the second conductive line.

摘要翻译： 本公开一般涉及可以包括制造芯片封装的方法的电子设备和方法。 1.一种绝缘体层，包括绝缘体材料，所述绝缘体层相对于第一导电线定位，相对于所述绝缘体层形成第二导电线，其中所述绝缘体层位于所述第一导电线和所述第二导电线之间，形成 所述绝缘体层在所述第一导电线和所述第二导电线之间的开口，所述开口内的所述绝缘体材料中的至少一些被暴露，以及将导体化学键合到所述开口内的所述至少一些所述绝缘体材料，其中， 导体将第一导线电耦合到第二导线。