SOI device with metal source/drain and method of fabrication
    2.
    发明授权
    SOI device with metal source/drain and method of fabrication 有权
    具有金属源/漏极的SOI器件及其制造方法

    公开(公告)号:US06555879B1

    公开(公告)日:2003-04-29

    申请号:US10044247

    申请日:2002-01-11

    IPC分类号: H01L2976

    摘要: A MOSFET and method of fabrication. The MOSFET includes a metal containing source and a metal containing drain; a semiconductor body having a thickness of less than about 15 nm disposed between the source and the drain and on top of an insulating layer, the insulating layer formed on a substrate; a gate electrode disposed over the body and defining a channel interposed between the source and the drain; and a gate dielectric made from a high-K material and separating the gate electrode and the body.

    摘要翻译: 一种MOSFET及其制造方法。 MOSFET包括含金属源和含金属的漏极; 设置在源极和漏极之间并且在绝缘层的顶部上具有小于约15nm的厚度的半导体本体,所述绝缘层形成在基板上; 栅电极,其设置在所述主体上并且限定插入在所述源极和所述漏极之间的沟道; 以及由高K材料制成并分离栅电极和主体的栅极电介质。