公开(公告)号：US10734534B2

公开(公告)日：2020-08-04

申请号：US15746342

申请日：2016-07-22

Applicant: ams AG

Inventor： Harald Etschmaier ,  Gregor Toschkoff ,  Thomas Bodner ,  Franz Schrank

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/173 ,  G01J1/02 ,  G01J5/04 ,  H01L23/00 ,  H01L31/02 ,  H01L31/153

Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure.

公开(公告)号：US10943936B2

公开(公告)日：2021-03-09

申请号：US16316724

申请日：2017-08-08

Applicant: ams AG

Inventor： Gregor Toschkoff ,  Thomas Bodner ,  Franz Schrank

IPC: H01L27/146 ,  H01L31/0203

Abstract: A method is proposed to produce an optical sensor at wafer-level, the methods comprises the following steps. A wafer is provided and has a main top surface and a main back surface. At or near the top surface of the wafer at least one integrated circuit is arranged having a light sensitive component. A first mold tool is placed over the at least one integrated circuit such that at least one channel remains between the first mold tool and the top surface to enter a first mold material. A first mold structure is formed by wafer-level molding the first mold material via the at least one channel. The first mold material creates at least one runner structure. A second mold tool is placed over the first mold structure and a second mold structure is formed by wafer-level molding a second mold material by means of the second mold tool. A light path blocking structure is arranged on the top surface to block light from entering via the at least one runner structure.

公开(公告)号：US20190237500A1

公开(公告)日：2019-08-01

申请号：US16312145

申请日：2017-06-02

Applicant: ams AG

Inventor： Hubert Enichlmair ,  Martin SCHREMS ,  Gregor Toschkoff ,  Thomas Bodner ,  Mario Manninger

IPC: H01L27/146

CPC classification number: H01L27/14621 ,  H01L27/14623 ,  H01L27/14636 ,  H01L27/14685

Abstract: A 3D-Integrated optical sensor comprises a semiconductor substrate, an integrated circuit, a wiring, a filter layer, a transparent spacer layer, and an on-chip diffuser. The semiconductor substrate has a main surface. The integrated circuit comprises at least one light sensitive area and is arranged in the substrate at or near the main surface. The wiring provides an electrical connection to the integrated circuit and is connected to the integrated circuit. The wiring is arranged on or in the semiconductor substrate. The filter layer has a direction dependent transmission characteristic and is arranged on the integrated circuit. In fact, the filter layer at least covers the light sensitive area. The transparent spacer layer is arranged on the main surface and, at least partly, encloses the filter layer. A spacer thickness is arranged to limit a spectral shift of the filter layer. The on-chip diffuser is arranged on the transparent spacer layer.

公开(公告)号：US11271134B2

公开(公告)日：2022-03-08

申请号：US16756025

申请日：2018-10-15

Applicant: ams AG

Inventor： Gregor Toschkoff ,  Thomas Bodner ,  Franz Schrank ,  Miklos Labodi ,  Joerg Siegert ,  Martin Schrems

IPC: H01L31/18 ,  H01L27/146 ,  G01J1/02 ,  G01J1/04 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0216

Abstract: A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided.

公开(公告)号：US20190165020A1

公开(公告)日：2019-05-30

申请号：US16316724

申请日：2017-08-08

Applicant: ams AG

Inventor： Gregor Toschkoff ,  Thomas Bodner ,  Franz Schrank

IPC: H01L27/146

Abstract: A method is proposed to produce an optical sensor at wafer-level, the methods comprises the following steps. A wafer is provided and has a main top surface and a main back surface. At or near the top surface of the wafer at least one integrated circuit is arranged having a light sensitive component. A first mold tool is placed over the at least one integrated circuit such that at least one channel remains between the first mold tool and the top surface to enter a first mold material. A first mold structure is formed by wafer-level molding the first mold material via the at least one channel. The first mold material creates at least one runner structure. A second mold tool is placed over the first mold structure and a second mold structure is formed by wafer-level molding a second mold material by means of the second mold tool. A light path blocking structure is arranged on the top surface to block light from entering via the at least one runner structure.