公开(公告)号：US10566468B2

公开(公告)日：2020-02-18

申请号：US16086868

申请日：2017-03-23

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Martin Lukas Balimann ,  Matthias Gloor ,  Philippe Bouchilloux ,  Jukka Alasirniö ,  Hartmut Rudmann ,  Nicola Spring

IPC: H01L31/02 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/0232 ,  H05K1/02 ,  H01L31/024 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L51/52 ,  H01S5/022 ,  H01S5/024 ,  H01L31/18

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

公开(公告)号：US10651624B2

公开(公告)日：2020-05-12

申请号：US16069251

申请日：2016-12-23

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Matthias Gloor ,  Yit Chee Chiang

IPC: H01L21/66 ,  H01S5/022 ,  H01S5/00 ,  H01S5/42 ,  H01L27/146 ,  H01L27/14 ,  H01L31/0232 ,  H01K1/08 ,  G02B7/02 ,  H01L31/0203 ,  H01K1/20 ,  H01L31/00 ,  G02B5/00 ,  H01L51/52 ,  G02B6/42 ,  H01L23/544 ,  H01S5/024

Abstract: This disclosure describes an optoelectronic to provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The module includes spacers to establish precise separation distances between various parts of the module. One of the spacers serves as a support or mount for an optical element that comprises a mask.

公开(公告)号：US10509147B2

公开(公告)日：2019-12-17

申请号：US15546298

申请日：2016-01-26

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Markus Rossi ,  Hans Peter Herzig ,  Philipp Mueller ,  Ali Naqavi ,  Daniel Infante Gomez ,  Moshe Doron ,  Matthias Gloor ,  Alireza Yasan ,  Hartmut Rudmann ,  Martin Lukas Balimann ,  Mai-Lan Elodie Boytard ,  Bassam Hallal ,  Daniel Pérez Calero ,  Julien Boucart ,  Hendrik Volkerink

IPC: G02B19/00 ,  G02B3/00 ,  G02B3/04 ,  G02B5/04 ,  G02B27/09 ,  G02B27/48 ,  F21Y105/16 ,  F21Y115/30

Abstract: An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P2=2LD/N, wherein N is an integer with N≥1. High-contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.

公开(公告)号：US11114573B2

公开(公告)日：2021-09-07

申请号：US16719194

申请日：2019-12-18

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Martin Lukas Balimann ,  Matthias Gloor ,  Philippe Bouchilloux ,  Jukka Alasirnio ,  Hartmut Rudmann ,  Nicola Spring

IPC: H01L31/02 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/0232 ,  H05K1/02 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02253 ,  H01L31/024 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L51/52 ,  H01S5/02208 ,  H01S5/024 ,  H01L31/18

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

公开(公告)号：US10761192B2

公开(公告)日：2020-09-01

申请号：US15755269

申请日：2016-08-25

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Dmitry Bakin ,  Moshe Doron ,  Matthias Gloor ,  Markus Rossi

IPC: G01C3/08 ,  G01S7/481 ,  G02B19/00 ,  G01S17/32 ,  H01S5/00 ,  H01S5/022 ,  H01L33/60 ,  H01L33/58 ,  G02B3/00 ,  H01S5/42

Abstract: This disclosure relates to illumination modules operable to increase the area over which an illumination source, such as a vertical-cavity surface-emitting laser or light-emitting diode, illuminates. Such illumination modules include a substrate having electrical contacts, an illumination source electrically connected to the substrate, a collimation assembly operable to collimate the light generated from the illumination source, a translation assembly operable to translate light over an area, and a mask assembly. In various implementations the illumination source may be rather small in area, thereby reducing the cost of the illumination module. Some implementations of the illumination module can be used for the acquisition of three-dimensional data in some cases, while in other cases some implementations of the illumination module can be used for other applications requiring projected light.

公开(公告)号：US10466501B2

公开(公告)日：2019-11-05

申请号：US15604794

申请日：2017-05-25

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Dmitry Bakin ,  Matthias Gloor

IPC: G02B27/62 ,  G02B27/00 ,  G02B27/09 ,  H04N5/225 ,  H01S5/022 ,  H01S5/183

Abstract: The present disclosure describes optoelectronic modules that include an optical system tilted with respect to a focal plane. For example, an optoelectronic module can includes an optical system including a vertical alignment feature. An optoelectronic sub-assembly includes an active optoelectronic device, wherein the vertical alignment rests on a surface of the optoelectronic sub-assembly and wherein an optical axis of the optical system is tilted with respect to a focal plane in the sub-assembly.