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公开(公告)号：US20240141165A1
公开(公告)日：2024-05-02
申请号：US18547338
申请日：2022-03-16
Applicant: MITSUI CHEMICALS, INC.
Inventor： Haruka DOI , Wataru MAKIGUCHI , Kohei NISHINO , Isao WASHIO
CPC classification number: C08L77/06 , B29C45/0001 , C08G69/04 , C08G69/265 , C08K3/38 , C08K5/5313 , B29K2077/00 , C08K2003/387 , C08L2201/02 , C08L2205/03
Abstract: Provided is a polyamide resin composition that has a high electrical resistance in a high temperature region (around 130° C.) while having a high heat resistance. This polyamide resin composition comprises polyamide resin that contains a component unit (a) deriving from an aromatic dicarboxylic acid or alicyclic dicarboxylic acid and a component unit (b2) deriving from 1,3-bis(aminomethyl)cyclohexane. The polyamide resin composition further comprises at least one flame retardant (X) selected from the group consisting of polybrominated styrenes, brominated polystyrenes, and brominated polyphenylenes, or a flame retardant (Y) comprising a prescribed phosphinate salt compound or bisphosphinate salt compound or a polymer thereof.
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2.发明申请SEMIAROMATIC POLYAMIDE, SEMIAROMATIC POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE 有权半自聚酰胺，半乳聚酰胺树脂组合物和成型品公开(公告)号：US20150329670A1
公开(公告)日：2015-11-19
申请号：US14441954
申请日：2013-11-12
Applicant: MITSUI CHEMICALS, INC.
Inventor： Isao WASHIO , Hiroki EBATA , Fumio KAGEYAMA , Toshitaka KOSAKA , Hideto OGASAWARA , Akinori AMANO , Nobuhiro TAKIZAWA
CPC classification number: C08G69/26 , C08F255/00 , C08G69/265 , C08G69/28 , C08K3/16 , C08K5/005 , C08K7/14 , C08L23/0815 , C08L33/14 , C08L51/06 , C08L77/06 , C08F222/06
Abstract: To provide: a semiaromatic polyamide which has excellent moldability, heat resistance, chemical resistance and mechanical characteristics; and a molded article of this semiaromatic polyamide. A semiaromatic polyamide (I) of the present invention contains 35-50% by mole of a structural unit derived from terephthalic acid [A], 25-40% by mole of a structural unit derived from isophthalic acid [B], 15-35% by mole of a structural unit derived from an aliphatic dicarboxylic acid [C] (provided that the total of [A], [B] and [C] is 100% by mole), and a structural unit derived from an aliphatic diamine [D] having 4-12 carbon atoms. The molar ratio ([A]/[B]) is from 65/35 to 50/50, and the molar ratio ([C]/[B]) is from 30/70 to 50/50. The melting enthalpy ([increment]H) of the semiaromatic polyamide (I) as determined by differential scanning calorimetry (DSC) is 20-40 mJ/mg, and the intrinsic viscosity of the semiaromatic polyamide (I) is 0.7-1.6 dl/g.
Abstract translation: 提供：具有优异的成型性，耐热性，耐化学性和机械特性的半芳族聚酰胺; 和该半芳族聚酰胺的模塑制品。 本发明的半芳族聚酰胺（I）含有35-50摩尔％的由对苯二甲酸[A]衍生的结构单元，25-40摩尔％来自间苯二甲酸[B]的结构单元，15-35摩尔％ 衍生自脂族二羧酸[C]的结构单元的摩尔％（[A]，[B]和[C]的总和为100摩尔％），衍生自脂肪族二胺的结构单元[ D]具有4-12个碳原子。 摩尔比（[A] / [B]）为65/35〜50/50，摩尔比（[C] / [B]）为30/70〜50/50。 通过差示扫描量热法（DSC）测定的半芳族聚酰胺（I）的熔融焓（[增量] H）为20-40mJ / mg，半芳族聚酰胺（I）的特性粘度为0.7-1.6dl / G。
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公开(公告)号：US20250092220A1
公开(公告)日：2025-03-20
申请号：US18727913
申请日：2023-01-06
Applicant: MITSUI CHEMICALS, INC.
Inventor： Kosuke UEDA , Wataru MAKIGUCHI , Haruka DOI , Kohei NISHINO , Isao WASHIO , Takahiro KONDO
Abstract: This polyamide resin composition includes a polyamide resin and a copper-based heat-resistant stabilizing agent. The copper content in the copper-based stabilizing agent is 0.001-0.050 parts by mass with respect to 100 parts by mass of the polyamide resin. The polyamide resin includes a dicarboxylic acid-derived component unit (a) and a diamine-derived component unit (b). The dicarboxylic acid-derived component unit (a) includes an aromatic dicarboxylic acid-derived component unit or an alicyclic dicarboxylic acid-derived component unit. The diamine-derived component unit (b) includes a diamine-derived component unit (b2) represented by formula (1) in an amount of 10 mol % or more but less than 50 mol % with respect to the total number of moles of the diamine-derived component unit (b).
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公开(公告)号：US20240228740A9
公开(公告)日：2024-07-11
申请号：US18547555
申请日：2022-03-16
Applicant: Mitsui Chemicals, Inc.
Inventor： Haruka DOI , Wataru MAKIGUCHI , Kohei NISHINO , Isao WASHIO
CPC classification number: C08K3/105 , C08G69/265
Abstract: Provided is a polyamide resin composition that, at high temperatures, suppresses reductions in tensile strength due to the addition of a copper-based heat-resistance stabilizer, and maintains a tensile strength over longer periods of time in a hot environment. The composition includes a polyamide resin and a copper-based heat-resistance stabilizer. The polyamide resin includes: a component unit (a) derived from dicarboxylic acid which is derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid; and greater than or equal to 10 mol % and less than 50 mol % of a component unit (b2), which is derived from 1,3-bis(aminomethyl)cyclohexane, with respect to the total number of moles of a component unit (b) derived from diamine. The content of copper included in the copper-based heat-resistance stabilizer is 0.001 parts by mass to 0.050 parts by mass, inclusive, with respect to 100 total parts by mass of the polyamide resin.
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5.发明申请公开(公告)号：US20210101347A1
公开(公告)日：2021-04-08
申请号：US16970011
申请日：2019-02-15
Applicant: MITSUI CHEMICALS, INC.
Inventor： Kohei NISHINO , Yohei HOTANI , Isao WASHIO
Abstract: This polyamide resin composition contains: 30-89.9 parts by mass of a polyamide resin (A) having a melting point of at least 300° C.; 0-45 parts by mass of a polyamide resin (B) having substantially no melting point; 0.1-5 parts by mass of a light-transmitting pigment (C); and 10-55 parts by mass of a fibrous filler (D) (the total amount of (A), (B), (C), and (D) is 100 parts by mass). The polyamide resin (A) contains at least a terephthalic acid-derived component unit. In a molded body of the polyamide resin composition, the corrected heat of fusion (ΔHR) is 10-70 J/g, and the transmittance of laser light having a wavelength of 940 nm is at least 15% at a thickness of 1.6 mm.
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Patent Agency Ranking
公开(公告)号：US20240132695A1
公开(公告)日：2024-04-25
申请号：US18547555
申请日：2022-03-15
Applicant: Mitsui Chemicals, Inc.
Inventor： Haruka DOI , Wataru MAKIGUCHI , Kohei NISHINO , Isao WASHIO
CPC classification number: C08K3/105 , C08G69/265
Abstract: Provided is a polyamide resin composition that, at high temperatures, suppresses reductions in tensile strength due to the addition of a copper-based heat-resistance stabilizer, and maintains a tensile strength over longer periods of time in a hot environment. The composition includes a polyamide resin and a copper-based heat-resistance stabilizer. The polyamide resin includes: a component unit (a) derived from dicarboxylic acid which is derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid; and greater than or equal to 10 mol % and less than 50 mol % of a component unit (b2), which is derived from 1,3-bis(aminomethyl)cyclohexane, with respect to the total number of moles of a component unit (b) derived from diamine. The content of copper included in the copper-based heat-resistance stabilizer is 0.001 parts by mass to 0.050 parts by mass, inclusive, with respect to 100 total parts by mass of the polyamide resin.
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公开(公告)号：US20230203247A1
公开(公告)日：2023-06-29
申请号：US18000195
申请日：2021-07-05
Applicant: MITSUI CHEMICALS, INC.
Inventor： Kohei NISHINO , Toshitaka KOSAKA , Isao WASHIO
CPC classification number: C08G69/265 , B29C48/022 , B29C48/40 , B29K2077/00
Abstract: Provided is a crystalline polyamide resin that can exhibit a high mechanical strength and electrical resistance in high temperature regions (in the neighborhood of 150° C.). This polyamide resin has the following: a dicarboxylic acid-derived component unit (a) that includes a component unit (a1) derived from terephthalic acid, naphthalenedicarboxylic acid, or cyclohexanedicarboxylic acid, at more than 20 mol % and up to and including 100 mol % with reference to the total number of moles of the dicarboxylic acid-derived component unit (a); and a diamine-derived component unit (b) that contains a component unit (b1) deriving from alkylenediamine having 4-18 carbon atoms and a component unit (b2) deriving from diamine given by formula (1).
(in formula (1), n and the two m's are each independently 0 or 1, and —X— is a single bond or a divalent group selected from the group consisting of —O—, —S—, —SO2—, —CO—, and —CH2—)-
公开(公告)号：US20170283556A1
公开(公告)日：2017-10-05
申请号：US15101808
申请日：2014-12-05
Applicant: Mitsui Chemicals, Inc.
Inventor： Hiroki EBATA , Tatsuya ENOMOTO , Isao WASHIO , Fumio KAGEYAMA , Atsushi TAKEISHI , Yuji ISHII , Akinori AMANO
CPC classification number: C08G69/26 , C07C63/24 , C07C63/26 , C08J3/246 , C08J2323/08 , C08J2377/00 , C08J2423/08 , C08J2477/00 , C08L77/06 , C08L2312/04 , F16L11/04 , G01N25/20 , C08L23/16 , C08L61/06 , C08L23/26
Abstract: The present invention relates to a polyamide-based thermoplastic elastomer composition [Y] in which a rubber composition [X] and a phenol resin-based crosslinking agent [IV] are dynamically crosslinked, the rubber composition [X] comprising a polyamide [I] including 30 to 100% by mole of a terephthalic acid structural unit and having a melting point of 220 to 290° C.; an ethylene-α-olefin-unconjugated polyene copolymer rubber [II] including structural units of ethylene, an α-olefin having 3 to 20 carbon atoms and an unconjugated polyene, respectively; and an olefin-based polymer [III] including 0.3 to 5.0% by mass of a functional group structural unit, (the total of [I] to [IV]: 100% by mass).
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9.发明申请公开(公告)号：US20160168381A1
公开(公告)日：2016-06-16
申请号：US14906990
申请日：2014-07-25
Applicant: MITSUI CHEMICALS, INC.
Inventor： Isao WASHIO , Hiroki EBATA , Hideto OGASAWARA , Nobuhiro TAKIZAWA , Fumio KAGEYAMA , Akinori AMANO
CPC classification number: C08L77/06 , C08G69/265 , C08K7/06 , C08K7/14 , C08L23/26 , C08L51/06 , H01B1/24
Abstract: The present invention provides a semi-aromatic polyamide resin composition having exceptional impact resistance, fuel barrier properties, and injection moldability, as well as a molded article containing the same, through a semi-aromatic polyamide resin composition containing specific proportions of (A) a semi-aromatic polyamide comprising a dicarboxylic acid component comprising terephthalic acid and adipic acid and a diamine component having a linear aliphatic diamine having 4-10 carbon atoms, (B) a semi-aromatic polyamide comprising a dicarboxylic acid component having isophthalic acid and a diamine component having an aliphatic diamine having 4-15 carbon atoms, (C) an olefin polymer containing a specific amount of functional group structural units, and (D) a fibrous filler.
Abstract translation: 本发明提供了具有优异的耐冲击性，燃料阻隔性和注模成型性的半芳族聚酰胺树脂组合物，以及含有该半芳香族聚酰胺树脂组合物的成型品，通过含有特定比例的（A） 包含包含对苯二甲酸和己二酸的二羧酸组分的半芳族聚酰胺和具有4-10个碳原子的直链脂族二胺的二胺组分，（B）包含具有间苯二甲酸的二羧酸组分和二胺的半芳族聚酰胺 具有4-15个碳原子的脂族二胺的组分，（C）含有特定官能团结构单元的烯烃聚合物，和（D）纤维填料。
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公开(公告)号：US20240158633A1
公开(公告)日：2024-05-16
申请号：US18548245
申请日：2022-03-18
Applicant: MITSUI CHEMICALS, INC.
Inventor： Wataru MAKIGUCHI , Haruka DOI , Kohei NISHINO , Isao WASHIO
CPC classification number: C08G69/265 , C08G69/28 , C08K5/02 , C08K5/5313 , C08L25/18 , C08L77/06 , H01B3/305 , C08L2201/02 , C08L2203/20 , C08L2203/30
Abstract: Provided is a polyamide resin composition that has high electrical resistance in a high temperature range (around 130° C.) and high heat resistance. The polyamide resin composition includes: a polyamide resin that includes a component unit (a) derived from an aromatic dicarboxylic acid or an alicyclic dicarboxylic acid and a component unit (b2) derived from a diamine represented by formula (1); and at least one flame retardant (X) selected from the group consisting of polybrominated styrenes, brominated polystyrenes, and brominated polyphenylenes, or a flame retardant (Y) containing a specific phosphinate compound, a specific bisphosphinate compound, or a polymer of these compounds. In formula (1), n and the two instances of m are each independently 0 or 1, and —X— is a single bond or a divalent group selected from the group consisting of —O—, —S—, —SO2—, —CO—, and —CH2—.
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