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    Customized polishing pads for CMP and methods of fabrication and use thereof
    4.
    发明授权
    Customized polishing pads for CMP and methods of fabrication and use thereof 有权
    定制的CMP抛光垫及其制造方法和使用方法

    公开(公告)号：US08864859B2

    公开(公告)日：2014-10-21

    申请号：US11998319

    申请日：2007-11-28

    申请人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

    发明人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

    IPC分类号： B24D3/00 ,  B24D11/00 ,  B24D18/00 ,  C09K3/14 ,  B24B1/00 ,  B24B37/26 ,  B24D7/14

    CPC分类号： B24B37/26 ,  B24D7/14 ,  B24D11/04

    摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

    摘要翻译： 本申请涉及用于基板的化学机械平面化（CMP）的抛光垫及其制造和使用方法。 本发明中描述的焊盘定制为抛光规格，其中规格包括（但不限于）被抛光材料，芯片设计和结构，芯片密度和图案密度，设备平台和使用的浆料类型。 这些垫可以设计成具有长或短范围顺序的专门的聚合物纳米结构，其允许分子水平调节实现优异的热机械特性。 更具体地，可以设计和制造焊盘，使得焊盘内的化学和物理性质均匀和不均匀的空间分布。 此外，这些垫可以被设计成通过表面工程，通过添加固体润滑剂来调节摩擦系数，并且产生具有形成与抛光表面平行的界面的多层聚合材料的低剪切整体垫。 焊盘还可以具有受控的孔隙率，嵌入式研磨剂，抛光表面上的新型凹槽，用于原位生产的浆料输送，以及用于端点检测的透明区域。

    Customized polishing pads for CMP and methods of fabrication and use thereof
    8.
    发明授权
    Customized polishing pads for CMP and methods of fabrication and use thereof 有权

    公开(公告)号：US09278424B2

    公开(公告)日：2016-03-08

    申请号：US14489177

    申请日：2014-09-17

    申请人： NexPlanar Corporation

    发明人： Pradip K Roy ,  Manish Deopura ,  Sudhanshu Misra

    IPC分类号： B24D3/02 ,  B24D3/00 ,  B24D11/00 ,  B24D18/00 ,  C09K3/14 ,  B24B37/26 ,  B24D7/14 ,  B24D11/04

    CPC分类号： B24B37/26 ,  B24D7/14 ,  B24D11/04

    摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior themo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

    Grooved CMP pad
    9.
    发明授权
    Grooved CMP pad 有权

    公开(公告)号：US09180570B2

    公开(公告)日：2015-11-10

    申请号：US12381709

    申请日：2009-03-16

    申请人： Robert Kerprich ,  Karey Holland ,  Diane Scott ,  Sudhanshu Misra

    发明人： Robert Kerprich ,  Karey Holland ,  Diane Scott ,  Sudhanshu Misra

    IPC分类号： B24B37/00 ,  B24B37/26

    CPC分类号： B24B37/26

    摘要： CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.