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公开(公告)号：US08968058B2
公开(公告)日：2015-03-03
申请号：US13101826
申请日：2011-05-05
申请人： Robert Kerprich , William C. Allison , Diane Scott
发明人： Robert Kerprich , William C. Allison , Diane Scott
CPC分类号： C08J9/228 , B24B37/005 , B24B37/205 , B24B37/26 , B24D18/0009 , C08J2201/022
摘要： Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.
摘要翻译： 描述了具有对准标记的抛光垫。 还描述了制造具有对准标记的抛光垫的方法。
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公开(公告)号：US20160221145A1
公开(公告)日：2016-08-04
申请号：US14611064
申请日：2015-01-30
申请人： Ping Huang , William C. Allison , Richard Frentzel , Paul Andre Lefevre , Robert Kerprich , Diane Scott
发明人： Ping Huang , William C. Allison , Richard Frentzel , Paul Andre Lefevre , Robert Kerprich , Diane Scott
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , C08J9/0061 , C08J9/228 , C08J2333/00 , C08J2375/04 , C08J2433/00 , C08J2475/04
摘要： Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.
摘要翻译： 描述低密度抛光垫和制造低密度抛光垫的方法。 在一个实例中，用于抛光衬底的抛光垫包括密度大约在0.4-0.55g / cc范围内的抛光体。 抛光体包括热固性聚氨酯材料和分散在热固性聚氨酯材料中的多个闭孔。 多个闭孔细孔中的每一个具有由丙烯酸共聚物构成的壳。
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公开(公告)号：US09249273B2
公开(公告)日：2016-02-02
申请号：US14610991
申请日：2015-01-30
申请人： Robert Kerprich , William C. Allison , Diane Scott
发明人： Robert Kerprich , William C. Allison , Diane Scott
IPC分类号： B24B37/26 , C08J9/228 , B24B37/005 , B24B37/20 , B24D18/00
CPC分类号： C08J9/228 , B24B37/005 , B24B37/205 , B24B37/26 , B24D18/0009 , C08J2201/022
摘要： Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.
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公开(公告)号：US20150056900A1
公开(公告)日：2015-02-26
申请号：US14530534
申请日：2014-10-31
申请人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
发明人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
CPC分类号： B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0009 , B29C39/123 , B29K2075/00 , B29L2009/00 , B29L2031/736
摘要： Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.
摘要翻译： 描述具有其上具有离散突起的均匀体的抛光垫。 在一个实例中，用于抛光衬底的抛光垫包括具有抛光侧和背面的均匀体。 均质体由具有第一硬度的材料构成。 多个分立的突起设置在同质体的抛光侧上并与之共同地结合。 多个离散突起由具有与第一硬度不同的第二硬度的材料构成。 还描述了制造具有其上具有离散突起的均匀体的抛光垫的方法。
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公开(公告)号：US20120282849A1
公开(公告)日：2012-11-08
申请号：US13101826
申请日：2011-05-05
申请人： Robert Kerprich , William C. Allison , Diane Scott
发明人： Robert Kerprich , William C. Allison , Diane Scott
CPC分类号： C08J9/228 , B24B37/005 , B24B37/205 , B24B37/26 , B24D18/0009 , C08J2201/022
摘要： Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.
摘要翻译： 描述了具有对准标记的抛光垫。 还描述了制造具有对准标记的抛光垫的方法。
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6.发明授权公开(公告)号：US09296085B2
公开(公告)日：2016-03-29
申请号：US14530534
申请日：2014-10-31
申请人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
发明人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
IPC分类号： B24B37/26 , B24B37/20 , B24B37/22 , B24B37/24 , B24D18/00 , B29C39/12 , B29K75/00 , B29L9/00 , B29L31/00
CPC分类号： B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0009 , B29C39/123 , B29K2075/00 , B29L2009/00 , B29L2031/736
摘要： Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.
摘要翻译： 描述具有其上具有离散突起的均匀体的抛光垫。 在一个实例中，用于抛光衬底的抛光垫包括具有抛光侧和背面的均匀体。 均质体由具有第一硬度的材料构成。 多个分立的突起设置在同质体的抛光侧上并与之共同地结合。 多个离散突起由具有与第一硬度不同的第二硬度的材料构成。 还描述了制造具有其上具有离散突起的均匀体的抛光垫的方法。
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公开(公告)号：US20150343595A1
公开(公告)日：2015-12-03
申请号：US14823956
申请日：2015-08-11
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , B24D11/003 , B32B3/30 , B32B5/142 , B32B5/18 , B32B7/06 , B32B7/12 , B32B25/045 , B32B25/08 , B32B27/065 , B32B27/08 , B32B27/308 , B32B27/36 , B32B2266/0278 , B32B2266/08 , B32B2307/40 , B32B2307/41 , B32B2307/412 , B32B2307/536 , B32B2307/72 , B32B2307/732 , B32B2457/00 , C08G18/3206 , C08G18/7621
摘要： Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
摘要翻译： 描述了用于抛光半导体衬底的软抛光垫。 软抛光垫包括具有大约在20肖氏D至45肖氏硬度范围内的硬度的热固性闭孔聚氨酯材料的模制均匀抛光体。
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公开(公告)号：US20150152236A1
公开(公告)日：2015-06-04
申请号：US14610991
申请日：2015-01-30
申请人： Robert Kerprich , William C. Allison , Diane Scott
发明人： Robert Kerprich , William C. Allison , Diane Scott
IPC分类号： C08J9/228
CPC分类号： C08J9/228 , B24B37/005 , B24B37/205 , B24B37/26 , B24D18/0009 , C08J2201/022
摘要： Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.
摘要翻译： 描述了具有对准标记的抛光垫。 还描述了制造具有对准标记的抛光垫的方法。
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9.发明申请公开(公告)号：US20120302148A1
公开(公告)日：2012-11-29
申请号：US13113655
申请日：2011-05-23
申请人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
发明人： Rajeev Bajaj , Ping Huang , Robert Kerprich , William C. Allison , Richard Frentzel , Diane Scott
CPC分类号： B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0009 , B29C39/123 , B29K2075/00 , B29L2009/00 , B29L2031/736
摘要： Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.
摘要翻译： 描述具有其上具有离散突起的均匀体的抛光垫。 在一个实例中，用于抛光衬底的抛光垫包括具有抛光侧和背面的均匀体。 均质体由具有第一硬度的材料构成。 多个分立的突起设置在同质体的抛光侧上并与之共同地结合。 多个离散突起由具有与第一硬度不同的第二硬度的材料构成。 还描述了制造具有其上具有离散突起的均匀体的抛光垫的方法。
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公开(公告)号：US20120009855A1
公开(公告)日：2012-01-12
申请号：US12832908
申请日：2010-07-08
申请人： William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
发明人： William Allison , Diane Scott , Robert Kerprich , Ping Huang , Richard Frentzel
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , B24D11/003 , B32B3/30 , B32B5/142 , B32B5/18 , B32B7/06 , B32B7/12 , B32B25/045 , B32B25/08 , B32B27/065 , B32B27/08 , B32B27/308 , B32B27/36 , B32B2266/0278 , B32B2266/08 , B32B2307/40 , B32B2307/41 , B32B2307/412 , B32B2307/536 , B32B2307/72 , B32B2307/732 , B32B2457/00 , C08G18/3206 , C08G18/7621
摘要： Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
摘要翻译： 描述了用于抛光半导体衬底的软抛光垫。 软抛光垫包括具有大约在20肖氏D至45肖氏硬度范围内的硬度的热固性闭孔聚氨酯材料的模制均匀抛光体。
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