公开(公告)号：US08430676B2

公开(公告)日：2013-04-30

申请号：US12538639

申请日：2009-08-10

申请人： Son Dang ,  Rehan Kazmi ,  Gerald Back ,  Bahadir Tunaboylu

发明人： Son Dang ,  Rehan Kazmi ,  Gerald Back ,  Bahadir Tunaboylu

IPC分类号： H01R12/00

CPC分类号： G01R31/2889 ,  Y10T29/4902

摘要： In an embodiment, a modular space transformer for use in a probe card assembly includes a bottom plate, a guide plate, and a top plate. The guide plate is configured for mounting in a cut-out of the bottom plate. The guide plate has a first surface and a second surface and additionally has a first plurality of spaced electrical connections disposed in a plurality of apertures formed through the guide plate for providing electrical connections between a plurality of test probe contacts and a plurality of guide plate contacts. The top plate has a plurality of spaced electrical contacts disposed through the top plate with at least one of the plurality of guide plate contacts electrically connected to at least one of the plurality of spaced electrical contacts.

摘要翻译： 在一个实施例中，用于探针卡组件的模块化空间变换器包括底板，导向板和顶板。 引导板被配置为安装在底板的切口中。 引导板具有第一表面和第二表面，并且另外具有第一多个间隔开的电连接，设置在通过引导板形成的多个孔中，用于提供多个测试探针触点和多个引导板触点之间的电连接 。 顶板具有穿过顶板设置的多个间隔开的电触点，多个引导板触点中的至少一个与多个间隔开的电触点中的至少一个电连接。

公开(公告)号：US07675302B2

公开(公告)日：2010-03-09

申请号：US11839852

申请日：2007-08-16

申请人： Bahadir Tunaboylu ,  Habib Kilicaslan

发明人： Bahadir Tunaboylu ,  Habib Kilicaslan

IPC分类号： G01R31/02

CPC分类号： G01R1/07357

摘要： A probe card assembly is provided. The probe card assembly includes a substrate layer defining a plurality of apertures and a plurality of probes. Each of the probes has a base and a tip. The base of each probe is configured to be at least partially inserted within one of the plurality of apertures.

摘要翻译： 提供探针卡组件。 探针卡组件包括限定多个孔和多个探针的基底层。 每个探针具有基部和尖端。 每个探针的基部被构造成至少部分地插入在多个孔中的一个孔内。

公开(公告)号：US07637009B2

公开(公告)日：2009-12-29

申请号：US11711578

申请日：2007-02-26

申请人： Keith Heinemann ,  Jamin Ling ,  Richard McCullough ,  Brian McHugh ,  Jordan Lane Wahl

发明人： Keith Heinemann ,  Jamin Ling ,  Richard McCullough ,  Brian McHugh ,  Jordan Lane Wahl

IPC分类号： H01R43/16

CPC分类号： G01R31/02 ,  B33Y80/00 ,  C25D1/00 ,  C25D1/003 ,  G01R1/067 ,  G01R3/00 ,  H05K3/205 ,  Y10T29/49128 ,  Y10T29/49204 ,  Y10T29/49222

摘要： An approach is provided for fabricating probe elements for probe card assemblies. Embodiments of the invention include using a reusable substrate, a reusable substrate with layered probe elements and a reusable substrate with a passive layer made of a material that does not adhere well to probe elements formed thereon. Examples of probe elements include, without limitation, a cantilever probe element, a vertically-oriented probe element, and portions of probe elements, e.g., a beam element of a cantilever probe element. Probe elements, or portions of probe elements, may be formed using any of a number of electroforming or plating processes such as, for example, plating using masking techniques, e.g., using lithographic techniques such as photolithography, stereolithography, X-ray lithography, etc.

摘要翻译： 提供了一种用于制造用于探针卡组件的探针元件的方法。 本发明的实施例包括使用可重复使用的基板，具有分层探针元件的可重复使用的基板和具有由不能很好地粘附到其上形成的探针元件的材料制成的钝化层的可重复使用的基板。 探针元件的实例包括但不限于悬臂探针元件，垂直取向的探针元件和探针元件的部分，例如悬臂探针元件的束元件。 探针元件或探针元件的部分可以使用许多电铸或电镀工艺中的任何一种来形成，例如使用掩模技术的电镀，例如使用光刻技术例如光刻，立体光刻，X射线光刻等 。

公开(公告)号：US07432728B2

公开(公告)日：2008-10-07

申请号：US11711319

申请日：2007-02-26

申请人： Habib Kilicaslan ,  David F. McDevitt ,  Bahadir Tunaboylu ,  David T. Beatson

发明人： Habib Kilicaslan ,  David F. McDevitt ,  Bahadir Tunaboylu ,  David T. Beatson

IPC分类号： G01R31/02

CPC分类号： G01R1/07342 ,  G01R1/06772

摘要： A blade probe card includes a plurality of blades that each includes a first end connected to a printed circuit board and a second end. A probe member is attached to the second end of each blade and extends outward to make contact with a device under test. A ground member is attached to the second end of each blade. The blade probe card also includes a common ground member that is separate from the printed circuit board and coupled to the ground member of each blade. Each blade may also include a first conductive signal trace and two or more conductive ground traces formed on a surface of each blade. The first conductive signal trace electrically connects the probe member to a contact on the printed circuit board. The two or more conductive ground traces are adjacent to the conductive signal trace and reduce crosstalk between the blades.

摘要翻译： 刀片探针卡包括多个叶片，每个叶片包括连接到印刷电路板的第一端和第二端。 探针构件附接到每个叶片的第二端并向外延伸以与待测试的装置接触。 接地构件附接到每个叶片的第二端。 刀片探针卡还包括与印刷电路板分离并联接到每个叶片的接地构件的公共接地构件。 每个叶片还可以包括形成在每个叶片的表面上的第一导电信号迹线和两个或更多个导电接地迹线。 第一导电信号迹线将探针构件电连接到印刷电路板上的触点。 两个或多个导电接地迹线与导电信号迹线相邻并且减小了叶片之间的串扰。

公开(公告)号：US07182672B2

公开(公告)日：2007-02-27

申请号：US11139460

申请日：2005-05-27

申请人： Bahadir Tunaboylu ,  Jeff Hicklin ,  Ivan Pipps ,  Son Dang ,  Gerry Back

发明人： Bahadir Tunaboylu ,  Jeff Hicklin ,  Ivan Pipps ,  Son Dang ,  Gerry Back

IPC分类号： B25B1/00 ,  B24D11/04 ,  H01L21/66

CPC分类号： B24B19/16 ,  B24B29/08 ,  B24D3/28 ,  B24D13/142 ,  B24D18/0045 ,  B24D18/0072

摘要： Methods are provided for shaping, maintaining the shape of, and cleaning a probe tip using a pad such as a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad may be formed from layers of adhesive material having abrasive particles in-between each layer. Using the pad, probe tips may be shaped as desired from an unfinished probe stock, substantially limiting the use of relatively expensive conventional machining operations. Further, the pad may also be used to maintain probe tips in a desired operating shape. Still further, the pad may be used to clean accumulated debris from the probe tip. Preferably, the maintenance and cleaning operations are performed on-line, with the probes operatively installed in connection with testing machinery.

摘要翻译： 提供了使用诸如多层粘合剂和研磨垫的垫来成形，保持探针尖端的形状和清洁探针尖端的方法。 多层粘合剂和研磨垫可以由在各层之间具有磨料颗粒的粘合剂材料层形成。 使用垫，探针尖端可以根据需要从未完成的探针坯料成型，从而基本上限制了相对昂贵的常规加工操作的使用。 此外，垫也可以用于将探针尖端保持在期望的操作形状。 此外，垫可以用于清洁来自探针尖端的积聚的碎屑。 优选地，维护和清洁操作在线执行，探头可操作地安装在与测试机器相连接上。

公开(公告)号：US08299394B2

公开(公告)日：2012-10-30

申请号：US11818851

申请日：2007-06-15

申请人： Senthil Theppakuttai ,  Peter J. Klaerner ,  Jason Bradach ,  Mark Cunningham ,  Bahadir Tunaboylu

发明人： Senthil Theppakuttai ,  Peter J. Klaerner ,  Jason Bradach ,  Mark Cunningham ,  Bahadir Tunaboylu

IPC分类号： B23K26/00

CPC分类号： G01R3/00 ,  G01R1/07342 ,  H05K3/328

摘要： An approach for assembling and repairing probe assemblies using laser welding includes aligning a beam element to a post element on a probe substrate. The beam element is positioned in contact with the post element on the probe substrate. The beam element is then attached to the post element on the probe substrate by laser welding the beam element to the post element on the probe substrate. The approach may include the use of a vacuum capillary pickup tool to align and position the beam element. The vacuum capillary pickup tool may also operate in conjunction with a laser beam delivery system for guiding the laser beam to the correct location for welding and also to assist in removing gases and debris attributable to the laser welding process. The approach allows probe elements to be connected directly to a probe substrate without requiring an intermediate layer.

摘要翻译： 使用激光焊接组装和修复探针组件的方法包括将束元件对准探针衬底上的柱元件。 梁元件定位成与探针基板上的柱元件接触。 然后通过将束元件通过激光焊接到探针基板上的柱元件将束元件附接到探针基板上的柱元件。 该方法可以包括使用真空毛细管拾取工具来对准和定位束元件。 真空毛细管拾取工具还可以与用于将激光束引导到用于焊接的正确位置的激光束传送系统一起操作，并且还帮助去除归因于激光焊接过程的气体和碎屑。 该方法允许探针元件直接连接到探针衬底而不需要中间层。

公开(公告)号：US08222912B2

公开(公告)日：2012-07-17

申请号：US12403264

申请日：2009-03-12

申请人： Son N. Dang ,  Gerald W. Back ,  Rehan Kazmi

发明人： Son N. Dang ,  Gerald W. Back ,  Rehan Kazmi

IPC分类号： G01R1/067

CPC分类号： G01R1/0675 ,  G01R1/07357

摘要： A probe head assembly for testing a device under test includes a plurality of test probes and a probe head structure. The probe head structure includes a guide plate and a template and supports a plurality of test probes that each includes a tip portion with a tip end for making electrical contact with a device under test, a curved compliant body portion and a tail portion with a tail end for making electrical contact with the space transformer. Embodiments of the invention include offsetting the position of the tail portions of the test probes with respect to the tip portions of the test probes so that the tip portions of the test probes are biased within the apertures of the guide plate, using hard stop features to help maintain the position of the test probes with respect to the guide plate and probe ramp features to improve scrubbing behavior.

摘要翻译： 用于测试待测器件的探头组件包括多个测试探头和探头头结构。 探针头结构包括引导板和模板，并且支撑多个测试探针，每个测试探针包括具有尖端的尖端部分，该尖端部分具有与被测器件电接触的尖端，弯曲的柔顺体部分和具有尾部的尾部 结束与空间变压器的电气接触。 本发明的实施例包括相对于测试探针的末端部分抵消测试探针的尾部的位置，使得测试探针的末端部分被偏压在导板的孔内，使用硬停止特征 有助于保持测试探针相对于导板和探针斜坡特征的位置，以改善擦洗行为。

公开(公告)号：US08004299B2

公开(公告)日：2011-08-23

申请号：US13038140

申请日：2011-03-01

申请人： Scott R. Williams ,  Edward Laurent ,  David T. Beatson ,  Bahadir Tunaboylu ,  Edward L. Malantonio

发明人： Scott R. Williams ,  Edward Laurent ,  David T. Beatson ,  Bahadir Tunaboylu ,  Edward L. Malantonio

IPC分类号： G01R1/067 ,  G01R31/00

CPC分类号： G01R1/06727

摘要： A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.

摘要翻译： 用于探针卡组件的探针包括光束和支点元件。 支点元件位于梁的基端部分和梁的顶端部分之间，并且适于与梁接触，使得梁被支点悬臂。

公开(公告)号：US07721430B2

公开(公告)日：2010-05-25

申请号：US11709547

申请日：2007-02-21

申请人： Dov Chartarifsky ,  Edward T. Laurent ,  Edward L. Malantonio ,  Richard D. Sadler ,  Bahadir Tunaboylu

发明人： Dov Chartarifsky ,  Edward T. Laurent ,  Edward L. Malantonio ,  Richard D. Sadler ,  Bahadir Tunaboylu

IPC分类号： H01R43/00

CPC分类号： G01R3/00 ,  B33Y80/00 ,  G01R1/06727 ,  G01R1/07342 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222

摘要： An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments of the invention include attaching the cantilever probe to a carrier structure by clamping the cantilever probe to the carrier structure, bonding the cantilever probe to the carrier structure via a post feature on the cantilever probe, or applying a material on the carrier structure and substantially around and in contact with the cantilever probe to affix the cantilever probe to the carrier structure. A probe tip can then be formed on the cantilever probe while the cantilever probe is attached or affixed to the carrier structure. The cantilever probe can then be removed and bonded to a probe substrate.

摘要翻译： 提供了一种用于制造悬臂探针的方法。 该方法通常包括使用各种技术来以允许在悬臂探头上形成尖端的方式来固定悬臂探针。 例如，本发明的实施例包括通过将悬臂式探头夹持在载体结构上来将悬臂式探针附接到载体结构上，通过悬臂式探针上的柱特征将悬臂式探针结合到载体结构上，或将载体施加在载体上 结构并且基本上围绕并与悬臂探针接触以将悬臂探针固定到载体结构。 然后可以在悬臂探头上形成探针尖端，同时将悬臂探头附接或固定到载体结构上。 然后可以将悬臂探针去除并结合到探针基底上。

公开(公告)号：US07679383B2

公开(公告)日：2010-03-16

申请号：US11712733

申请日：2007-02-28

申请人： Lich Thanh Tran ,  Son N. Dang ,  Gerald W. Back ,  Reynaldo M. Rincon

发明人： Lich Thanh Tran ,  Son N. Dang ,  Gerald W. Back ,  Reynaldo M. Rincon

IPC分类号： G01R31/02

CPC分类号： G01R1/07342 ,  G01R1/06727 ,  G01R3/00 ,  H01R11/18 ,  H01R2201/20 ,  Y10T29/49117

摘要： A method and apparatus for a flattened probe element wire is provided. A probe element wire includes a beam portion and a tip portion. At least a part of the tip portion is flattened. Flattened probe element wires may have greater z-direction height strength, thereby increasing maximum probe element wire z-direction vertical force. Flattened probe element wires may also have decreased variability in the flattened probe element wire tips. A probe card assembly may includes a substrate and a plurality of at least partially flattened probe element wires supported by the substrate. Such probe card assemblies may have an extended life and maintained within design parameters for a longer period of use.

摘要翻译： 提供了一种用于扁平的探针元件线的方法和装置。 探针元件线包括梁部分和尖端部分。 顶端部分的至少一部分变平。 扁平的探针元件线可能具有较大的z方向高度强度，从而增加最大探针元件线z向垂直力。 扁平化的探针元件线在平坦的探针元件导线尖端中也可能具有降低的变化。 探针卡组件可以包括衬底和由衬底支撑的多个至少部分平坦的探针元件线。 这种探针卡组件可以具有延长的使用寿命并且保持在设计参数中以供更长的使用期限。