Methods for attaching structures using heat activated thermoset film and induction heating
    6.
    发明授权
    Methods for attaching structures using heat activated thermoset film and induction heating 有权
    使用热活化热固性薄膜和感应加热连接结构的方法

    公开(公告)号:US09492967B2

    公开(公告)日:2016-11-15

    申请号:US14254431

    申请日:2014-04-16

    申请人: Apple Inc.

    摘要: An electronic device assembly may have electronic components enclosed within plastic and/or metal housing structures. The assembly may include first and second housing structures that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip or pattern of metal that is placed along or near a joint between the first and second housing structures. The temperature of the metal and associated layers of the thermoset polymer film may be raised by heating the metal using external equipment such as an induction heater. The metal layer that is heated using electromagnetic induction may be formed on the heat activated thermoset film or may be formed in or on one of the housing structures adjacent to the heat activated thermoset polymer film.

    摘要翻译: 电子设备组件可以具有封装在塑料和/或金属外壳结构内的电子部件。 组件可以包括使用热活化的热固性聚合物膜连接的第一和第二壳体结构。 热活化的热固性聚合物膜可以使用诸如沿着或靠近第一和第二壳体结构之间的接头放置的金属条或金属图案的金属结构来加热。 可以通过使用诸如感应加热器的外部设备加热金属来提高热固性聚合物膜的金属和相关层的温度。 使用电磁感应加热的金属层可以形成在热活化的热固性膜上,或者可以形成在与热活化的热固性聚合物膜相邻的外壳结构中的一个中。

    Methods for Attaching Structures Using Heat Activated Thermoset Film and Induction Heating
    7.
    发明申请
    Methods for Attaching Structures Using Heat Activated Thermoset Film and Induction Heating 有权
    使用热活性热固性薄膜和感应加热连接结构的方法

    公开(公告)号:US20150298392A1

    公开(公告)日:2015-10-22

    申请号:US14254431

    申请日:2014-04-16

    申请人: Apple Inc.

    IPC分类号: B29C65/32 B29C65/48

    摘要: An electronic device assembly may have electronic components enclosed within plastic and/or metal housing structures. The assembly may include first and second housing structures that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip or pattern of metal that is placed along or near a joint between the first and second housing structures. The temperature of the metal and associated layers of the thermoset polymer film may be raised by heating the metal using external equipment such as an induction heater. The metal layer that is heated using electromagnetic induction may be formed on the heat activated thermoset film or may be formed in or on one of the housing structures adjacent to the heat activated thermoset polymer film.

    摘要翻译: 电子设备组件可以具有封装在塑料和/或金属外壳结构内的电子部件。 组件可以包括使用热活化的热固性聚合物膜连接的第一和第二壳体结构。 热活化的热固性聚合物膜可以使用诸如沿着或靠近第一和第二壳体结构之间的接头放置的金属条或金属图案的金属结构来加热。 可以通过使用诸如感应加热器的外部设备加热金属来提高热固性聚合物膜的金属和相关层的温度。 使用电磁感应加热的金属层可以形成在热活化的热固性膜上,或者可以形成在与热活化的热固性聚合物膜相邻的外壳结构中的一个中。