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    Finishing element using finishing aids
    2.
    发明授权
    Finishing element using finishing aids 有权
    整理元件采用精整助剂

    公开(公告)号：US06634927B1

    公开(公告)日：2003-10-21

    申请号：US09840423

    申请日：2001-04-23

    申请人： Charles J Molnar

    发明人： Charles J Molnar

    IPC分类号： B24B100

    CPC分类号： B24B37/12 ,  B24B37/042 ,  B24D3/346 ,  B65H2701/3772

    摘要： A method of using a finishing element having film forming lubricants for finishing semiconductor wafers is described. The lubricants in the finishing element are transferred to operative finishing interface can form lubricating boundary layer. The lubricating boundary layer thickness can be controlled to improve finishing and reduce unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential and/or localized finishing are also discussed.

    摘要翻译： 描述了使用具有成膜润滑剂的精加工元件来完成半导体晶片的方法。 精加工元件中的润滑剂转移到有效的精加工界面，可形成润滑边界层。 可以控制润滑边界层厚度，以改善整理并减少不必要的表面缺陷。 差示润滑边界层方法被描述为差别地完成半导体晶片。 还可以使用微分和/或局部精加工来改进平面化和局部精加工。

    Finishing semiconductor wafers with a fixed abrasive finishing element
    4.
    发明授权
    Finishing semiconductor wafers with a fixed abrasive finishing element 有权
    用固定的研磨整理元件完成半导体晶圆

    公开(公告)号：US06390890B1

    公开(公告)日：2002-05-21

    申请号：US09498265

    申请日：2000-02-03

    申请人： Charles J Molnar

    发明人： Charles J Molnar

    IPC分类号： B24B100

    CPC分类号： B24B37/245 ,  B24B37/042 ,  B24D3/346 ,  B65H2701/3772 ,  Y10S451/921

    摘要： A fixed abrasive finishing element having a continuous phase of synthetic resin and discrete synthetic resin particles dispersed in the continuous phase of synthetic resin is described. The synthetic resin particles have abrasive particles dispersed therein. A compatibilizing agent can be used to enhance their finishing properties. The finishing elements are useful for polishing semiconductor wafers. Planarization and localized finishing can be improved using these finishing elements. Unwanted surface defects can be reduced. Methods to finish a semiconductor wafer using these finishing elements are described.

    摘要翻译： 描述了具有分散在合成树脂的连续相中的合成树脂和离散合成树脂颗粒的连续相的固定的研磨整理元件。 合成树脂颗粒中分散有磨粒。 相容剂可用于增强其整理性能。 精加工元件对于抛光半导体晶片是有用的。 使用这些加工元件可以提高平整度和局部精加工。 可以减少不需要的表面缺陷。 描述使用这些精加工元件完成半导体晶片的方法。

    Method for producing an adhesive tape with a protruding liner
    7.
    发明授权
    Method for producing an adhesive tape with a protruding liner 有权
    用于制造具有突出衬垫的胶带的方法

    公开(公告)号：US09328263B2

    公开(公告)日：2016-05-03

    申请号：US14234810

    申请日：2012-08-02

    申请人： Michael Tach ,  Gabriel Markus ,  Bruce Dirk Ehlers

    发明人： Michael Tach ,  Gabriel Markus ,  Bruce Dirk Ehlers

    IPC分类号： B65H18/26 ,  C09J7/02 ,  C09J7/00 ,  B65H54/52

    CPC分类号： C09J7/02 ,  B65H54/52 ,  B65H2701/377 ,  B65H2701/3772 ,  B65H2701/3916 ,  C09J7/00 ,  C09J7/10 ,  C09J7/20

    摘要： A process for production of a crosswound long roll of an at least single-side-adhesive adhesive tape in which at least one adhesive side of the adhesive tape has been covered with a liner, in the form of an Archimedean spiral. The process releasably fixes a core on an axle, wherein the adhesive tape covered with the liner is wound on to the core, contacts a pressure roll with a curved surface of the core or with the adhesive tape which has been covered with the liner and already wound on the core, in such a way as to give a nip between pressure roll and curved surface of the core or adhesive tape covered with the liner, where core and pressure roll rotate in opposite directions. Further, the process unwinding the liner from a liner roll, places the liner on to the at least one open adhesive side of the adhesive tape which is guided on the pressure roll in the direction of the nip, and guides a laminate made of adhesive tape and liner on the pressure roll into the nip.

    摘要翻译： 一种用于制造至少单面粘合剂胶带的横向卷绕长卷的方法，其中粘合带的至少一个粘合剂侧已经以阿基米德螺旋形式的衬垫覆盖。 该过程将芯部可释放地固定在轴上，其中用衬垫覆盖的胶带被卷绕到芯上，与芯的弯曲表面或与已经被衬垫覆盖的胶带接触压辊 以这样的方式缠绕在压力辊和芯的弯曲表面之间的辊隙或用衬垫覆盖的胶带之间，其中芯部和压力辊沿相反方向旋转。 此外，将衬垫从衬里辊退卷的过程将衬垫放置在粘合带的至少一个打开的粘合剂侧上，该粘合剂带在压辊上在辊隙的方向上被引导，并引导由胶带 并将衬垫压在压辊上。

    Device for dispensing two sided adhesive tape pieces and a refill roll for the device
    8.
    发明申请
    Device for dispensing two sided adhesive tape pieces and a refill roll for the device 失效
    用于分配双面胶带的装置和装置的再填充辊

    公开(公告)号：US20030131944A1

    公开(公告)日：2003-07-17

    申请号：US10146908

    申请日：2002-05-17

    申请人： 3L - LUDVIGSEN A/S

    发明人： Frits Ludvigsen

    IPC分类号： B32B035/00

    CPC分类号： B65H37/005 ,  B65H2701/1722 ,  B65H2701/1726 ,  B65H2701/194 ,  B65H2701/3772 ,  Y10T156/1348 ,  Y10T156/1795 ,  Y10T156/18

    摘要： The device has a roll (1) of a carrier strip (2) holding pieces (3) of two sided adhesive tape and wound on a hub (5) with an outer radius and provided with a circular cogging (6), a support (7) for the roll (1) comprising a stub shaft (9) with a direction of axis around which the roll rotates when dispensing tape pieces (3), a brake pawl (23) for engagement with the circular cogging (6), a pressure base (15) being in connection with the brake pawl (23) such that the engagement of the brake pawl (23) with the cogging (6) is released by pressure on the pressure base (15), a peripheral wall (10) extending along a part of the periphery of the roll (1), and a path for the carrier strip (2) extending past the pressure base (15) and along a part of the outside of the peripheral wall (11), the pressure base (15) comprising an outer sliding surface (16, 17) defining a part of the path for the carrier strip (2) with the two sided adhesive tape where the path at the pressure base (15) comprises a portion with a relative sharp curve (18) with a radius of curvature being essentially smaller than the outer radius of the hub. The two sided adhesive tape (3) is of a relatively rigid material, the two sided adhesive tape (3) being separated from the carrier strip (2) when the latter passes said relatively sharp curve (18) during advance.

    摘要翻译： 该装置具有承载带（2）的辊（1），其保持双面胶带的片（3）并且缠绕在具有外半径的轮毂（5）上并且设置有圆形齿槽（6），支撑件 （3），用于与圆形齿槽（6）接合的制动棘爪（23）的辊（1）包括具有轴线周围的轴线的短轴（9）的辊（1） 压力基座（15）与制动棘爪（23）连接，使得制动棘爪（23）与齿槽（6）的接合通过压力释放在压力基座（15）上，周壁（10） 沿着所述辊（1）的周边的一部分延伸，以及延伸穿过所述压力基座（15）并沿着所述周壁（11）的外部的一部分的所述承载带（2）的路径，所述压力基座 （15）包括外部滑动表面（16,17），所述外部滑动表面（16,17）通过所述双面粘合带限定所述载体条（2）的路径的一部分，其中所述压力基座（15）处的路径包括 具有曲率半径相对较大的曲线（18）的部分基本上小于轮毂的外半径。 双面胶带（3）是相对刚性的材料，当双面胶带（3）在提前通过所述相对锋利的曲线（18）时，双面胶带（3）与载体带（2）分离。

    Finishing element with finishing aids
    9.
    发明授权
    Finishing element with finishing aids 失效
    精加工辅料

    公开(公告)号：US6428388B2

    公开(公告)日：2002-08-06

    申请号：US91642801

    申请日：2001-07-26

    申请人： BEAVER CREEK CONCEPTS INC

    发明人： MOLNAR CHARLES J

    IPC分类号： B24B37/04 ,  B24B49/16 ,  B24D3/34 ,  B24D13/14 ,  H01L21/3105 ,  B24B29/02

    CPC分类号： B24B37/245 ,  B24B37/013 ,  B24B37/042 ,  B24B37/20 ,  B24B49/16 ,  B24D3/346 ,  B65H2701/3772 ,  H01L21/31053

    摘要： A method of using a finishing element and using organic lubricating films for finishing semiconductor wafers is described. The lubricants in the finishing element can be transferred to operative finishing interface forming lubricating film. The organic lubricating film thickness can be controlled to improve finishing and reduce unwanted surface defects. Differential organic lubricating film methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer and organic lubricating film methods of finishing.

    摘要翻译： 描述了使用精加工元件并使用有机润滑膜来完成半导体晶片的方法。 精加工元件中的润滑剂可以转移到形成润滑膜的操作整理界面。 可以控制有机润滑膜厚度以改善整理并减少不希望的表面缺陷。 描述差示有机润滑膜方法来差别地完成半导体晶片。 使用差速润滑边界层和有机润滑膜整理方法可以提高平面化和局部精加工。