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1.发明申请MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANCAL COMPONENT HAVING A THIN-LAYER CAP 审中-公开微生物组分和生产具有薄层的微量组分的方法公开(公告)号：US20140327154A1
公开(公告)日：2014-11-06
申请号：US14332751
申请日：2014-07-16
Applicant: Volker SCHMITZ , Axel GROSSE
Inventor： Volker SCHMITZ , Axel GROSSE
IPC: B81B7/00
CPC classification number: B81B7/0006 , B81B7/0032 , B81B7/007 , B81B2203/01 , B81B2203/03 , B81B2207/07 , B81C2203/0136
Abstract: A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided.
Abstract translation: 提供了具有衬底，位于衬底上方的微机械功能层和位于功能层上方的封装层的微机械部件以及用于制造微机械部件的方法，所述封装层具有至少一个沟槽，以及桥接 通过至少一个电绝缘连接链路提供沟槽。
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Patent Agency Ranking
2.发明申请公开(公告)号：US20110006444A1
公开(公告)日：2011-01-13
申请号：US12451327
申请日：2008-05-19
Applicant: Volker Schmitz , Axel Grosse
Inventor： Volker Schmitz , Axel Grosse
CPC classification number: B81B7/0006 , B81B7/0032 , B81B7/007 , B81B2203/01 , B81B2203/03 , B81B2207/07 , B81C2203/0136
Abstract: A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided.
Abstract translation: 提供了具有衬底，位于衬底上方的微机械功能层和位于功能层上方的封装层的微机械部件以及用于制造微机械部件的方法，所述封装层具有至少一个沟槽，以及桥接 通过至少一个电绝缘连接链路提供沟槽。
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公开(公告)号：US20240351864A1
公开(公告)日：2024-10-24
申请号：US18136556
申请日：2023-04-19
Applicant: InvenSense, Inc.
Inventor： Roberto Martini , Matthew Julian Thompson , Giacomo Gafforelli , Luca Coronato , Luigi Esposito
CPC classification number: B81C1/00349 , B81B3/0018 , B81B2201/0235 , B81B2203/0109 , B81B2203/03 , B81B2203/04 , B81C2201/0109 , B81C2201/0132 , B81C2201/0147
Abstract: An actuator layer of a MEMS sensor is be fabricated to include multi-level features, such as additional sense electrodes, vertical bump stops, or weighted proof masses. A sacrificial layer is deposited on the actuator layer such that locations are provided for the multi-level features to extend vertically from the actuator layer. After the multi-layer features are fabricated on the actuator layer the sacrificial layer is removed. Additional processing such as patterning of the actuator layer may be performed to provide desired functionality and electrical signals to portions of the actuator layer, including to the multi-level features.
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4.发明授权Micromechanical component and method for producing a micromechanical component having a thin-layer cap 有权微机械部件和用于制造具有薄层盖的微机械部件的方法公开(公告)号：US08809095B2
公开(公告)日：2014-08-19
申请号：US12451327
申请日：2008-05-19
Applicant: Volker Schmitz , Axel Grosse
Inventor： Volker Schmitz , Axel Grosse
IPC: H01L27/14
CPC classification number: B81B7/0006 , B81B7/0032 , B81B7/007 , B81B2203/01 , B81B2203/03 , B81B2207/07 , B81C2203/0136
Abstract: A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided.
Abstract translation: 提供了具有衬底，位于衬底上方的微机械功能层和位于功能层上方的封装层的微机械部件以及用于制造微机械部件的方法，所述封装层具有至少一个沟槽，以及桥接 通过至少一个电绝缘连接链路提供沟槽。
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公开(公告)号：US20230399223A1
公开(公告)日：2023-12-14
申请号：US17806345
申请日：2022-06-10
Applicant: InfineonTechnologies AG
Inventor： Wilfried Florian , Niccoló De Milleri , Richard Gaggl , Philipp Greiner , Andreas Wiesbauer
CPC classification number: B81B3/0021 , H02J3/01 , B81B2201/0257 , B81B2203/0127 , B81B2207/01 , B81B2203/03
Abstract: A microphone includes a microelectromechanical system (MEMS) device responsive to sound waves or vibrations having an output coupled to a first node; a programmable gain amplifier or source follower having an input coupled to a second node, and an output for generating an analog signal, wherein the MEMS device output and the programmable gain amplifier or source follower input comprise a first nonlinear equivalent capacitance having a first capacitance-to-voltage (CV) profile; and a nonlinear capacitance component coupled to the first node, the second node, and at least one reference voltage node, wherein the nonlinear capacitance component comprises a second nonlinear equivalent capacitance having a second CV profile.
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6.发明授权Micromechanical component and method for producing a micromechanical component having a thin-layer cap 有权微机械部件和用于制造具有薄层盖的微机械部件的方法公开(公告)号：US09114975B2
公开(公告)日：2015-08-25
申请号：US14332751
申请日：2014-07-16
Applicant: Volker Schmitz , Axel Grosse
Inventor： Volker Schmitz , Axel Grosse
CPC classification number: B81B7/0006 , B81B7/0032 , B81B7/007 , B81B2203/01 , B81B2203/03 , B81B2207/07 , B81C2203/0136
Abstract: A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided.
Abstract translation: 提供了具有衬底，位于衬底上方的微机械功能层和位于功能层上方的封装层的微机械部件以及用于制造微机械部件的方法，所述封装层具有至少一个沟槽，以及桥接 通过至少一个电绝缘连接链路提供沟槽。
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