摘要:
In an embodiment, a thermal interface material (TIM) is provided. The TIM includes first and a second layers of a first transition metal, and a third layer including a plurality of carbon nanotubes supported in a flexible polymer matrix and a second transition metal coupled to sidewalls of carbon nanotubes. The first and second metal layers are in contact with first and second ends of carbon nanotube. The TIM further includes fourth and fifth layers of an alloy material coupled to the first and second metal layers, respectively. The carbon nanotube based TIM including the layers with transition metal allow improved heat transfer from an integrated circuit die to a heat spreader.
摘要:
An integrated transformer includes a primary winding and a secondary winding each having a spiral planar arrangement coils. A dielectric portion of dielectric material is interposed between the primary winding and the secondary winding. A field plate winding is electrically coupled with the primary winding. The field plate winding includes at least one field plate coil having a first lateral extension greater than a second lateral extension of a primary outer coil of the primary winding. The field plate coil is superimposed in plan view to the primary outer coil of the primary winding.
摘要:
In an embodiment, a thermal interface material (TIM) is provided. The TIM comprises first and a second layers of a first transition metal, and a third layer including a plurality of carbon nanotubes supported in a flexible polymer matrix and a second transition metal coupled to sidewalls of carbon nanotubes. The first and second metal layers are in contact with first and second ends of carbon nanotube. The TIM further comprises fourth and fifth layers of an alloy material coupled to the first and second metal layers, respectively. The carbon nanotube based TIM including the layers with transition metal allow improved heat transfer from an integrated circuit die to a heat spreader.
摘要:
A semiconductor device comprising a substrate and a substantially spiral-shaped conductor is provided. The substantially spiral-shaped conductor extends substantially into the substrate and has a spiral axis substantially perpendicular to a surface of the substrate. The substantially spiral-shaped conductor can be configured to be wirelessly coupled to another substantially spiral-shaped conductor in another semiconductor device.
摘要:
An integrated transformer includes a primary winding and a secondary winding each having a spiral planar arrangement coils. A dielectric portion of dielectric material is interposed between the primary winding and the secondary winding. A field plate winding is electrically coupled with the primary winding. The field plate winding includes at least one field plate coil having a first lateral extension greater than a second lateral extension of a primary outer coil of the primary winding. The field plate coil is superimposed in plan view to the primary outer coil of the primary winding.
摘要:
In an embodiment, a thermal interface material (TIM) is provided. The TIM includes first and a second layers of a first transition metal, and a third layer including a plurality of carbon nanotubes supported in a flexible polymer matrix and a second transition metal coupled to sidewalls of carbon nanotubes. The first and second metal layers are in contact with first and second ends of carbon nanotube. The TIM further includes fourth and fifth layers of an alloy material coupled to the first and second metal layers, respectively. The carbon nanotube based TIM including the layers with transition metal allow improved heat transfer from an integrated circuit die to a heat spreader.