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公开(公告)号:US20150243631A1
公开(公告)日:2015-08-27
申请号:US14679735
申请日:2015-04-06
申请人: Tessera, Inc.
发明人: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
IPC分类号: H01L25/065 , H01L23/04 , H01L23/31 , H01L23/00 , H01L23/482
CPC分类号: H01L25/0652 , H01L23/04 , H01L23/3107 , H01L23/3128 , H01L23/4822 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/0401 , H01L2224/06155 , H01L2224/06156 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/48265 , H01L2224/49109 , H01L2224/49175 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19107 , H01L2924/3011 , H01L2924/386 , H01L2924/00 , H01L2224/7826 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.
摘要翻译: 微电子封装包括包括第一基板和第一和第二微电子元件的子组件,所述第一和第二微电子元件具有面向第一基板的相对面向的第一和第二表面的接触轴承面,并且每个具有与第一基板电连接的触点。 第一和第二微电子元件的接触面至少部分地彼此覆盖。 引线将子组件与第二衬底电连接,引线的至少部分与第二衬底中的孔对齐。 引线可以包括延伸穿过第一基板中的孔并且连接到与第一基板孔对准的第一微电子元件的触点的引线键合。 在一个示例中,子组件可以使用导电间隔元件与第二衬底电连接。
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公开(公告)号:US09466587B2
公开(公告)日:2016-10-11
申请号:US14679735
申请日:2015-04-06
申请人: Tessera, Inc.
发明人: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
IPC分类号: H01L25/065 , H01L23/04 , H01L23/31 , H01L23/00 , H01L23/482 , H01L23/495
CPC分类号: H01L25/0652 , H01L23/04 , H01L23/3107 , H01L23/3128 , H01L23/4822 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/0401 , H01L2224/06155 , H01L2224/06156 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/48265 , H01L2224/49109 , H01L2224/49175 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19107 , H01L2924/3011 , H01L2924/386 , H01L2924/00 , H01L2224/7826 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.
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公开(公告)号:US20130043582A1
公开(公告)日:2013-02-21
申请号:US13209596
申请日:2011-08-15
申请人: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
发明人: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
IPC分类号: H01L23/482
CPC分类号: H01L25/0652 , H01L23/04 , H01L23/3107 , H01L23/3128 , H01L23/4822 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/0401 , H01L2224/06155 , H01L2224/06156 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/48265 , H01L2224/49109 , H01L2224/49175 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19107 , H01L2924/3011 , H01L2924/386 , H01L2924/00 , H01L2224/7826 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.
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公开(公告)号:US09000583B2
公开(公告)日:2015-04-07
申请号:US14040948
申请日:2013-09-30
申请人: Tessera, Inc.
发明人: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
IPC分类号: H01L23/482 , H01L23/495 , H01L25/065 , H01L23/31
CPC分类号: H01L25/0652 , H01L23/04 , H01L23/3107 , H01L23/3128 , H01L23/4822 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/0401 , H01L2224/06155 , H01L2224/06156 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/48265 , H01L2224/49109 , H01L2224/49175 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19107 , H01L2924/3011 , H01L2924/386 , H01L2924/00 , H01L2224/7826 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.
摘要翻译: 微电子封装包括包括第一基板和第一和第二微电子元件的子组件,所述第一和第二微电子元件具有面向第一基板的相对面向的第一和第二表面的接触轴承面,并且每个具有与第一基板电连接的触点。 第一和第二微电子元件的接触面至少部分地彼此覆盖。 引线将子组件与第二衬底电连接,引线的至少部分与第二衬底中的孔对齐。 引线可以包括延伸穿过第一基板中的孔并且连接到与第一基板孔对准的第一微电子元件的触点的引线键合。 在一个示例中,子组件可以使用导电间隔元件与第二衬底电连接。
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公开(公告)号:US20140117516A1
公开(公告)日:2014-05-01
申请号:US14040948
申请日:2013-09-30
申请人: TESSERA, INC.
发明人: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
IPC分类号: H01L23/495
CPC分类号: H01L25/0652 , H01L23/04 , H01L23/3107 , H01L23/3128 , H01L23/4822 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/0401 , H01L2224/06155 , H01L2224/06156 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/48265 , H01L2224/49109 , H01L2224/49175 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19107 , H01L2924/3011 , H01L2924/386 , H01L2924/00 , H01L2224/7826 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.
摘要翻译: 微电子封装包括包括第一基板和第一和第二微电子元件的子组件,所述第一和第二微电子元件具有面向第一基板的相对面向的第一和第二表面的接触轴承面,并且每个具有与第一基板电连接的触点。 第一和第二微电子元件的接触面至少部分地彼此覆盖。 引线将子组件与第二衬底电连接,引线的至少部分与第二衬底中的孔对齐。 引线可以包括延伸穿过第一基板中的孔并且连接到与第一基板孔对准的第一微电子元件的触点的引线键合。 在一个示例中,子组件可以使用导电间隔元件与第二衬底电连接。
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公开(公告)号:US08569884B2
公开(公告)日:2013-10-29
申请号:US13209596
申请日:2011-08-15
申请人: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
发明人: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
IPC分类号: H01L23/482
CPC分类号: H01L25/0652 , H01L23/04 , H01L23/3107 , H01L23/3128 , H01L23/4822 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/0401 , H01L2224/06155 , H01L2224/06156 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/48265 , H01L2224/49109 , H01L2224/49175 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19107 , H01L2924/3011 , H01L2924/386 , H01L2924/00 , H01L2224/7826 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.
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