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公开(公告)号：US11777269B2
公开(公告)日：2023-10-03
申请号：US16419778
申请日：2019-05-22
申请人： RIKEN
发明人： Xinzhe Jin , Yoshinori Yanagisawa , Renzhong Piao , Yu Suetomi
CPC分类号： H01R43/02 , H01R4/68 , H10N60/0661 , H10N60/0801 , H10N60/857
摘要： Provided is a connection body of high-temperature superconducting wire materials including a first oxide high-temperature superconducting wire material and a second oxide high-temperature superconducting wire material, characterized in that a first superconducting layer of the first oxide high-temperature superconducting wire material and a second superconducting layer of the second oxide high-temperature superconducting wire material are bonded together via a junction including M-Cu—O (wherein M is a single metal element or a plurality of metal elements included in the first superconducting layer or the second superconducting layer). The connection body may be, for example, a connection body of Bi2223 wire materials, and the junction may include CaCuO2.
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公开(公告)号：US11895931B2
公开(公告)日：2024-02-06
申请号：US15824492
申请日：2017-11-28
CPC分类号： H10N60/0884 , G06N10/00 , H10N60/0661 , H10N60/0912 , H10N60/12 , H10N60/805
摘要： The invention includes methods, and the structures formed, for multi-qubit chips. The methods may include annealing a Josephson junction of a qubit to either increase or decrease the frequency of the qubit. The conditions of the anneal may be based on historical conditions, and may be chosen to tune each qubit to a desired frequency.
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公开(公告)号：US20240180046A1
公开(公告)日：2024-05-30
申请号：US18431342
申请日：2024-02-02
CPC分类号： H10N60/0884 , G06N10/00 , H10N60/0661 , H10N60/0912 , H10N60/12 , H10N60/805
摘要： The invention includes methods, and the structures formed, for multi-qubit chips. The methods may include annealing a Josephson junction of a qubit to either increase or decrease the frequency of the qubit. The conditions of the anneal may be based on historical conditions, and may be chosen to tune each qubit to a desired frequency.
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公开(公告)号：US20240062933A1
公开(公告)日：2024-02-22
申请号：US17945351
申请日：2022-09-15
申请人： Ambature, Inc.
CPC分类号： H01B12/06 , H01B1/08 , H01C7/00 , H10N60/01 , H10N60/85 , H10N60/0268 , H10N60/855 , H10N60/0856 , H10N60/857 , B05D1/36 , H01B12/14 , Y10T428/31678 , H10N60/0661
摘要： Operational characteristics of an extremely low resistance (“ELR”) film comprised of an ELR material may be improved by depositing a modifying material onto appropriate surfaces of the ELR film to create a modified ELR film. In some implementations of the invention, the ELR film may be in the form of a “c-film.” In some implementations of the invention, the ELR film may be in the form of an “a-b film,” an “a-film” or a “b-film.” The modified ELR film has improved operational characteristics over the ELR film alone or without the modifying material. Such operational characteristics may include operating in an ELR state at increased temperatures, carrying additional electrical charge, operating with improved magnetic properties, operating with improved mechanic properties or other improved operational characteristics. In some implementations of the invention, the ELR material is a mixed-valence copper-oxide perovskite, such as, but not limited to YBCO. In some implementations of the invention, the modifying material is a conductive material that bonds easily to oxygen, such as, but not limited to, chromium.
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公开(公告)号：US20230301203A1
公开(公告)日：2023-09-21
申请号：US18017075
申请日：2021-07-20
申请人： University of Rochester , THE BOARD OF REGENTS OF THE NEVADA SYSTEM OF HIGHER EDUCATION ON BEHALF OF THE UNIVERSITY OF NEVADA
CPC分类号： H10N60/85 , H10N60/0661 , H10N60/0772 , H10N60/0884
摘要： Compositions of matter and methods of identifying and making compositions of matter are disclosed. Some embodiments disclose making and chemically and/or compositionally tuning superconducting hydride materials. Some embodiments disclose an apparatus for making and compositionally tuning superconducting materials. Some embodiments disclose a composition of matter including a solid hydride exhibiting superconductivity at a temperature of at least 150 kelvin at an ambient pressure below 180 gigapascals, or at a temperature of at least 261 kelvin. In one or more embodiments, the superconductor includes a covalent metal hydride having at least three different chemical elements wherein an inter-atomic distance between the hydrogen in the covalent metal hydride is in a range of 1.1-2 angstroms. In yet further examples, the superconductor is formed using molecular exchange and compression of a Van der Waals solid. In yet further examples, the superconductor comprises molecular hydrogen disposed in 1-dimensional channels. These and other embodiments are disclosed herein.
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公开(公告)号：US20240292760A1
公开(公告)日：2024-08-29
申请号：US18411951
申请日：2024-01-12
发明人： Venkat Selvamanickam
CPC分类号： H10N60/0801 , H10N60/0632 , H10N60/0661 , H10N60/203 , H10N60/857
摘要： An ultra-thin film superconducting tape and method for fabricating same is disclosed. Embodiments are directed to a superconducting tape being fabricated by processes which include removing a portion of the superconducting tape's substrate subsequent the substrate's initial formation, whereby a thickness of the superconducting tape is reduced to 15-80 μm.
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公开(公告)号：US20240188452A1
公开(公告)日：2024-06-06
申请号：US18286134
申请日：2022-01-06
发明人： Kotaro OHKI , Tatsuoki NAGAISHI
CPC分类号： H10N60/0941 , H10N60/0661 , H10N60/124 , H10N60/0464 , H10N60/857
摘要： A joined body includes: a first superconducting layer, a barrier layer arranged on the first superconducting layer, and a second superconducting layer arranged on the barrier layer. The first superconducting layer, the barrier layer, and the second superconducting layer are formed of a REBCO. A leak current from one of the first superconducting layer and the second superconducting layer to the other of the first superconducting layer and the second superconducting layer is blocked by the barrier layer.
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公开(公告)号：US11910727B2
公开(公告)日：2024-02-20
申请号：US17723281
申请日：2022-04-18
发明人： Venkat Selvamanickam
CPC分类号： H10N60/0801 , H10N60/0632 , H10N60/0661 , H10N60/203 , H10N60/857
摘要： An ultra-thin film superconducting tape and method for fabricating same is disclosed. Embodiments are directed to a superconducting tape being fabricated by processes which include removing a portion of the superconducting tape's substrate subsequent the substrate's initial formation, whereby a thickness of the superconducting tape is reduced to 15-80 μm.
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