公开(公告)号：US11805707B2

公开(公告)日：2023-10-31

申请号：US17450769

申请日：2021-10-13

Applicant: International Business Machines Corporation

Inventor： Richard Alan Haight ,  Vivekananda P. Adiga ,  Martin O. Sandberg ,  Hanhee Paik

IPC: H10N60/01 ,  H10N60/12 ,  H10N60/85

CPC classification number: H10N60/0912 ,  H10N60/12 ,  H10N60/85

Abstract: Techniques regarding encapsulating one or more superconducting devices of a quantum processor are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing a metal fluoride layer onto a superconducting resonator and a silicon substrate that can be comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the metal fluoride layer can coat the superconducting resonator.

公开(公告)号：US20230333138A1

公开(公告)日：2023-10-19

申请号：US18339705

申请日：2023-06-22

Applicant: International Business Machines Corporation

Inventor： Martin O. Sandberg ,  Vivekananda P. Adiga ,  Hanhee Paik ,  Jared Barney Hertzberg

IPC: G06N10/00 ,  G01Q60/00

CPC classification number: G01Q60/00 ,  G06N10/00

Abstract: Systems, devices, computer-implemented methods, and computer program products to facilitate contactless screening of a qubit are provided. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a scanner component that establishes a direct microwave coupling of a scanning probe device to a qubit of a quantum device. The computer executable components can further comprise a parameter extraction component that determines qubit frequency of the qubit based on the direct microwave coupling.

公开(公告)号：US11726109B2

公开(公告)日：2023-08-15

申请号：US17137009

申请日：2020-12-29

Applicant: International Business Machines Corporation

Inventor： Martin O. Sandberg ,  Vivekananda P. Adiga ,  Hanhee Paik ,  Jared Barney Hertzberg

IPC: G01Q60/00 ,  G06N10/00

CPC classification number: G01Q60/00 ,  G06N10/00

Abstract: Systems, devices, computer-implemented methods, and computer program products to facilitate contactless screening of a qubit are provided. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a scanner component that establishes a direct microwave coupling of a scanning probe device to a qubit of a quantum device. The computer executable components can further comprise a parameter extraction component that determines qubit frequency of the qubit based on the direct microwave coupling.

公开(公告)号：US20220149263A1

公开(公告)日：2022-05-12

申请号：US17450769

申请日：2021-10-13

Applicant: International Business Machines Corporation

Inventor： Richard Alan Haight ,  Vivekananda P. Adiga ,  Martin O. Sandberg ,  Hanhee Paik

IPC: H01L39/24 ,  H01L39/12 ,  H01L39/22

Abstract: Techniques regarding encapsulating one or more superconducting devices of a quantum processor are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing a metal fluoride layer onto a superconducting resonator and a silicon substrate that can be comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the metal fluoride layer can coat the superconducting resonator.

公开(公告)号：US20210399192A1

公开(公告)日：2021-12-23

申请号：US16908704

申请日：2020-06-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Douglas Max Gill ,  Martin O. Sandberg ,  Vivekananda P. Adiga ,  Yves Martin ,  Hanhee Paik

IPC: H01L39/02 ,  H01L39/22 ,  H01L39/24 ,  H01L27/18

Abstract: A method for improving lifetime and coherence time of a qubit in a quantum mechanical device is provided. The method includes providing a substrate having a frontside and a backside, the frontside having at least one qubit formed thereon, the at least one qubit having capacitor pads. The method further includes at least one of removing an amount of substrate material from the backside of the substrate at an area opposite the at least one qubit or depositing a superconducting metal layer at the backside of the substrate at the area opposite the at least one qubit to reduce radiofrequency electrical current loss due to at least one of silicon-air (SA) interface, metal-air (MA) interface or silicon-metal (SM) interface so as to enhance a lifetime (T1) and a coherence time (T2) in the at least one qubit.

公开(公告)号：US20210234085A1

公开(公告)日：2021-07-29

申请号：US16752146

申请日：2020-01-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Douglas M. Gill ,  Martin O. Sandberg ,  Vivekananda P. Adiga ,  Jason S. Orcutt ,  Jerry M. CHOW

IPC: H01L39/02 ,  G06N10/00 ,  H01L39/22 ,  B82Y10/00

Abstract: A method for adjusting a resonance frequency of a qubit in a quantum mechanical device includes providing a substrate having a frontside and a backside, the frontside having at least one qubit formed thereon, the at least one qubit comprising capacitor pads; and removing substrate material from the backside of the substrate at an area opposite the at least one qubit to alter a capacitance around the at least one qubit so as to adjust a resonance frequency of the at least one qubit.

公开(公告)号：US20210183793A1

公开(公告)日：2021-06-17

申请号：US16711064

申请日：2019-12-11

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Dongbing Shao ,  Markus Brink ,  Martin O. Sandberg ,  Vivekananda P. Adiga

IPC: H01L23/64 ,  H01L27/18 ,  H01L23/498 ,  G06N10/00

Abstract: According to an embodiment of the present invention, a quantum processor includes a qubit chip. The qubit chip includes a substrate, and a plurality of qubits formed on a first surface of the substrate. The plurality of qubits are arranged in a pattern, wherein nearest-neighbor qubits in the pattern are connected. The quantum processor also includes a long-range connector configured to connect a first qubit of the plurality of qubits to a second qubit of the plurality of qubits, wherein the first and second qubits are separated by at least a third qubit in the pattern.

公开(公告)号：US20210151659A1

公开(公告)日：2021-05-20

申请号：US16684404

申请日：2019-11-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Vivekananda Adiga ,  David L. Rath ,  Martin O. Sandberg

IPC: H01L39/24 ,  H01L39/12 ,  H01L39/02 ,  H01L39/22

Abstract: A method of making a Josephson junction in a superconducting qubit includes providing a substrate having a convex structure with a first face and a second face meeting at an edge; depositing a first layer of superconducting material on the first face; oxidizing the first layer to form a layer of oxide material on a surface of the first layer; and depositing a second layer of the superconducting material on the second face. A portion of the second layer is in contact with a portion of the layer of oxide material at or in the vicinity of the edge such that the portion of the layer of oxide material is sandwiched between a portion of the first layer and the portion of the second layer to define a Josephson junction at or in the vicinity of the edge.

公开(公告)号：US20210119104A1

公开(公告)日：2021-04-22

申请号：US17135584

申请日：2020-12-28

Applicant: International Business Machines Corporation

Inventor： Vivekananda P. Adiga ,  Martin O. Sandberg ,  Jerry M. Chow

IPC: H01L39/24 ,  G06N10/00 ,  B82Y10/00 ,  H01L39/22

Abstract: Techniques for forming quantum circuits, including connections between components of quantum circuits, are presented. A trench can be formed in a dielectric material, by removing a portion of the dielectric material and a portion of conductive material layered on top of the dielectric material, to enable creation of circuit components of a circuit. The trench can define a regular nub or compensated nub to facilitate creating electrical leads connected to the circuit components on a nub. The compensated nub can comprise recessed regions to facilitate depositing material during evaporation to form the leads. For compensated nub implementation, material can be evaporated in two directions, with oxidation performed in between such evaporations, to contact leads and form a Josephson junction. For regular nub implementation, material can be evaporated in four directions, with oxidation performed in between the third and fourth evaporations, to contact leads and form a Josephson junction.

公开(公告)号：US10916690B2

公开(公告)日：2021-02-09

申请号：US16202828

申请日：2018-11-28

Applicant: International Business Machines Corporation

Inventor： Vivekananda P. Adiga ,  Martin O. Sandberg ,  Jerry M. Chow

IPC: G06N10/00 ,  B82Y10/00 ,  H01L39/24 ,  H01L39/22

Abstract: Techniques for forming quantum circuits, including connections between components of quantum circuits, are presented. A trench can be formed in a dielectric material, by removing a portion of the dielectric material and a portion of conductive material layered on top of the dielectric material, to enable creation of circuit components of a circuit. The trench can define a regular nub or compensated nub to facilitate creating electrical leads connected to the circuit components on a nub. The compensated nub can comprise recessed regions to facilitate depositing material during evaporation to form the leads. For compensated nub implementation, material can be evaporated in two directions, with oxidation performed in between such evaporations, to contact leads and form a Josephson junction. For regular nub implementation, material can be evaporated in four directions, with oxidation performed in between the third and fourth evaporations, to contact leads and form a Josephson junction.