公开(公告)号：US11921154B2

公开(公告)日：2024-03-05

申请号：US17745054

申请日：2022-05-16

申请人： TeraView Limited

发明人： Bryan Edward Cole ,  Darius Sullivan ,  Simon Chandler

IPC分类号： G01R1/067 ,  G01R31/28 ,  G01R31/308 ,  G01R35/00

CPC分类号： G01R31/2887 ,  G01R31/308 ,  G01R35/005

摘要： A test system for testing a device having a plurality of electrical contacts. The test system comprising: a device table operable to hold at least one device under test, a probe comprising at least one probe end for contacting electrical contacts of a device under test, a movement mechanism operable to move one or both of the device table and the probe so as to bring the at least one probe end into contact with at least one electrical contact of a device under test, and a profile determining system configured to determine a profile of the electrical contacts of a device under test.

公开(公告)号：US11726136B2

公开(公告)日：2023-08-15

申请号：US17495399

申请日：2021-10-06

申请人： TeraView Limited

发明人： Bryan Edward Cole

IPC分类号： G01R31/11 ,  G01R31/28 ,  G01R31/308

CPC分类号： G01R31/28 ,  G01R31/11 ,  G01R31/2822 ,  G01R31/308

摘要： A reflectometer for allowing a test of a device, the reflectometer comprising: a source of pulsed radiation; a first photoconductive element configured to output a pulse in response to irradiation from the pulsed source; a second photoconductive element configured to receive a pulse; and a transmission line arrangement configured to direct the pulse from the first photoconductive element to the device under test and to direct the pulse reflected from the device under test to the second photoconductive element. At least one of the first and second photoconductive elements is provided on a different substrate to that of the transmission line arrangement.

公开(公告)号：US11693042B2

公开(公告)日：2023-07-04

申请号：US17472746

申请日：2021-09-13

申请人： King Yuan Electronics Co., Ltd.

发明人： Pin-Yan Tsai ,  Kuang-Che Cheng

IPC分类号： G01R31/26 ,  G01R31/28 ,  G01R31/308

CPC分类号： G01R31/26 ,  G01R31/2886 ,  G01R31/308

摘要： An image test system includes a test assembly and an image capture card. The test assembly is provided for obtaining a test signal from a test object, and includes an interface conversion circuit for converting signal transmission form of the test signal. The image capture card is provided for obtaining the test signal from the test assembly, and obtaining an image data from the test signal. The image test system further includes a test signal clock generation circuit for obtaining a test signal clock from the test signal, or the image capture card further includes a pair of clock input pins for obtaining the test signal clock directly from the test object.

公开(公告)号：US11668747B2

公开(公告)日：2023-06-06

申请号：US17443359

申请日：2021-07-26

申请人： Tokyo Electron Limited

发明人： Naoki Akiyama ,  Hiroyuki Nakayama

IPC分类号： G01R1/04 ,  G01R31/308 ,  G01R1/073 ,  G01R1/02

CPC分类号： G01R31/308 ,  G01R1/07307 ,  G01R1/025 ,  G01R1/04

摘要： A control method of an inspection apparatus including a mounting stage on which a substrate having a plurality of inspection objects is mounted, a plurality of sections being formed with respect to the mounting stage and a heater controllable to heat for each of the sections includes when inspecting a first inspection object to be inspected among the plurality of inspection objects, causing the heater to heat a section corresponding to the first inspection object and a section corresponding to a second inspection object to be inspected next.

公开(公告)号：US11573249B2

公开(公告)日：2023-02-07

申请号：US16724470

申请日：2019-12-23

申请人： Keysight Technologies, Inc.

发明人： Ryan Scott ,  Bogdan Szafraniec ,  Mike T. Mctigue ,  Howard Lankford

IPC分类号： G01R31/00 ,  G01R31/308 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R13/02 ,  G02F1/21

摘要： An apparatus for providing a test signal from a device under test (DUT) to a measurement instrument is disclosed. The apparatus includes a probe head configured to receive an electrical signal from the DUT. The probe head includes an electro-optic modulator. The apparatus also includes a control box, which includes an optical source. The optical source is configured to provide an input optical signal to the electro-optic modulator, which is configured to provide an output optical signal based on the electrical signal from the DUT. The control box also includes an optical bias control circuit. Only a bias control signal is provided to the electro-optic modulator.

公开(公告)号：US11356056B1

公开(公告)日：2022-06-07

申请号：US17132386

申请日：2020-12-23

申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： Si-Xian Li ,  Teng-Chun Wu ,  Cho-Fan Hsieh ,  Chin Lien

IPC分类号： H01L31/18 ,  H02S50/15 ,  G01R31/308 ,  G01R31/26 ,  B60P3/14

摘要： The disclosed embodiments relate to a photovoltaic mobile lab configured for performing on-site test in a photovoltaic module. The photovoltaic mobile lab includes a transport vehicle, a first container, a second container, and a light source. The first container is fixed on the transport vehicle. The second container is slidably sleeved on the first container. The second container and the first container together form a testing chamber. The light source is configured for providing illumination to the photovoltaic module. The light source and the photovoltaic module are respectively accommodated in the first container and the second container and are respectively located at two opposite ends of the testing chamber so that a distance between the light source and the photovoltaic module is changeable while the second container is sliding with respect to the first container.

公开(公告)号：US11313936B2

公开(公告)日：2022-04-26

申请号：US17028102

申请日：2020-09-22

申请人： FormFactor, Inc.

发明人： Joseph George Frankel ,  Kazuki Negishi

IPC分类号： G01R35/00 ,  G01R31/308 ,  G01R1/067 ,  G01R31/28

摘要： Probe systems and methods of characterizing optical coupling between an optical probe of a probe system and a calibration structure. The probe systems include a probe assembly that includes an optical probe, a support surface configured to support a substrate, and a signal generation and analysis assembly configured to generate an optical signal and to provide the optical signal to the optical device via the optical probe. The probe systems also include an electrically actuated positioning assembly, a calibration structure configured to receive the optical signal, and an optical detector configured to detect a signal intensity of the optical signal. The probe systems further include a controller programmed to control the probe system to generate a representation of signal intensity as a function of the relative orientation between the optical probe and the calibration structure. The methods include methods of operating the probe systems.

公开(公告)号：US11092644B2

公开(公告)日：2021-08-17

申请号：US16087056

申请日：2017-03-14

申请人： UNITY SEMICONDUCTOR

发明人： Philippe Gastaldo ,  Mayeul Durand De Gevigney ,  Tristan Combier

IPC分类号： G01R31/308 ,  G01R31/28

摘要： A method for inspecting a wafer including: rotating the wafer about an axis of symmetry (X) perpendicular to a main wafer surface (S); emitting, from a light source coupled with an interferometric device, two incident light beams, to form, at the intersection between the two beams, a measurement volume (V) containing interference fringes so that a region of the main surface (S) of the wafer passes through a fringe, the dimension (Dy) of the measurement volume in a radial direction of the wafer being between 5 and 100 μm; collecting a portion of the light scattered by the wafer region; acquiring the collected light and emitting a signal representing the variation in the collected light intensity as a function of time; and detecting, a frequency component in the collected light, the frequency being the time signature of a defect passage through the measurement volume.

公开(公告)号：US20200300782A1

公开(公告)日：2020-09-24

申请号：US16822097

申请日：2020-03-18

申请人： Seiko Epson Corporation

发明人： Noriaki KOTANI

IPC分类号： G01N21/956 ,  G01R31/308 ,  G01R31/28

摘要： A handler that transports an electronic component (IC device) to a test unit includes a holding member (shuttle plate) including a recess having a colored bottom portion and housing the electronic component in the recess, an imaging unit (imaging device) that images the recess, and a control unit that compares a reference area of the bottom portion previously calculated from a plan view area of the electronic component and a plan view area of the bottom portion with a detection area of the bottom portion detected from an image captured by the imaging unit, and determines presence or absence of the electronic component housed in the recess or whether or not a position of the electronic component housed in the recess is good.

公开(公告)号：US10770362B1

公开(公告)日：2020-09-08

申请号：US16529495

申请日：2019-08-01

申请人： KLA Corporation

发明人： Natalia Malkova ,  Leonid Poslavsky ,  Ming Di ,  Qiang Zhao ,  Dawei Hu

IPC分类号： H01L21/66 ,  G01R31/28 ,  G01N21/27 ,  G01R31/308

摘要： Methods and systems for determining band structure characteristics of high-k dielectric films deposited over a substrate based on spectral response data are presented. High throughput spectrometers are utilized to quickly measure semiconductor wafers early in the manufacturing process. Optical models of semiconductor structures capable of accurate characterization of defects in high-K dielectric layers and embedded nanostructures are presented. In one example, the optical dispersion model includes a continuous Cody-Lorentz model having continuous first derivatives that is sensitive to a band gap of a layer of the unfinished, multi-layer semiconductor wafer. These models quickly and accurately represent experimental results in a physically meaningful manner. The model parameter values can be subsequently used to gain insight and control over a manufacturing process.