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公开(公告)号：US11901149B2
公开(公告)日：2024-02-13
申请号：US17637144
申请日：2020-08-03
发明人： Bernd Strütt , Dietmar Birgel , Silke Czaja
IPC分类号： H01H85/046 , H01C1/144 , H01C1/148 , H01H1/58
CPC分类号： H01H85/046 , H01C1/144 , H01C1/148 , H01H1/5805 , H01H2001/5888
摘要： An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.
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公开(公告)号：US20230253174A1
公开(公告)日：2023-08-10
申请号：US17920303
申请日：2021-07-14
发明人： Sang Ok Seon
IPC分类号： H01H85/08 , H01H85/046 , H01H69/02
CPC分类号： H01H85/08 , H01H85/046 , H01H69/022 , H01H85/143
摘要： A flexible printed circuit board (FPCB) including a pattern circuit layer. The pattern circuit layer has a pattern fuse embedded therein, and the pattern fuse includes a first conductive wire made of a metal and having a spiral structure, and a second conductive wire made of a metal and having a spiral structure. The first conductive wire and the second conductive wire have a double helix structure.
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公开(公告)号：US20230028233A1
公开(公告)日：2023-01-26
申请号：US17955796
申请日：2022-09-29
发明人： Chao SHEN , Zhiqiang XIANG , Xiaojing LIAO
IPC分类号： H01H85/046 , H01H85/06 , H05K1/18
摘要： This application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate in this application includes an insulation layer, and an electronic element and a conductive connector that are embedded inside the insulation layer. The conductive connector is electrically connected to the electronic element. The conductive connector includes at least one fuse unit, the fuse unit includes a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a preset current threshold, to disconnect an electrical connection between the electronic element and an external connection end. In this application, maintenance and replacement costs are low during current burning prevention, and a volume is compact.
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公开(公告)号：US20220301802A1
公开(公告)日：2022-09-22
申请号：US17637144
申请日：2020-08-03
发明人： Bernd Strütt , Dietmar Birgel , Silke Czaja
IPC分类号： H01H85/046 , H01H1/58 , H01C1/144 , H01C1/148
摘要： An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.
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公开(公告)号：US11201026B2
公开(公告)日：2021-12-14
申请号：US16844504
申请日：2020-04-09
IPC分类号： H01H85/046 , H01H85/08 , H01H85/06 , H01H85/00 , H01H85/46 , H01H85/055
摘要： A protection device comprises a substrate, a fusible element and a heating element. The substrate comprises a first electrode and a second electrode on its surface. The fusible element is disposed on the substrate and connects to the first electrode and the second electrode at two ends. The fusible element comprises a first metal layer and a second metal layer disposed on the first metal layer. The second metal layer has a lower melting point than that of the first metal layer. The heating element is disposed on the substrate. In the event of over-voltage or over-temperature, the heating element heats up to melt and blow the fusible element. The second metal layer is 40-95% of the fusible element in thickness.
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公开(公告)号：US11120964B2
公开(公告)日：2021-09-14
申请号：US16857116
申请日：2020-04-23
发明人： Faraj Sherrima
IPC分类号： H01R43/00 , H01H69/02 , H01H85/046 , H01H37/76 , H01H85/041 , H01H85/143
摘要： A novel temperature-triggered fuse device is configured to be activated at a designer-specified ambient temperature by utilizing wetting force among a pair of wetting material bays and a solder bridge or a solder ball. The solder bridge or the solder ball is typically positioned on top of the pair of wetting material bays separated by an electrically-insulated gap. Preferably, the wetting material bays are at least partly made of gold, nickel, or other elements suitable for generating an increased wetting force to the solder bridge or the solder ball upon increases in ambient temperature. The novel temperature-triggered fuse device can be integrated into various types of integrated circuits (IC's), or can function as a discrete fuse connected to one or more electronic components for robust protection from power surges and/or thermal runaway-related device malfunctions, meltdowns, or explosions. Various methods of producing the temperature-triggered fuse device are also disclosed herein.
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公开(公告)号：US20210074501A1
公开(公告)日：2021-03-11
申请号：US16590020
申请日：2019-10-01
发明人： Robert S. Douglass , John Trublowski , Rajen Modi , Nilay Mehta
IPC分类号： H01H85/046 , H01H69/02 , H01H85/08 , H01H85/06
摘要： A power fuse for protecting an electrical load subject to transient load current cycling events in a direct current electrical power system is provided. The power fuse includes at least one fuse element assembly that includes an elongated planar substrate, a plurality of fusible weak spots, and a conductor. The weak spots are formed on the substrate and are longitudinally spaced from one another on the substrate. The conductor is separately provided from the substrate and the weak spots. The conductor includes a solid elongated strip of metal having no stamped weak spot openings therein and therefore avoiding thermal-mechanical fatigue strain in the conductor when subjected to the transient load current cycling events. The solid elongated strip of metal includes coplanar connector sections that are mounted to respective ones of the weak spots and obliquely extending sections bent out of plane of the connector sections to extend above the substrate.
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公开(公告)号：US20200258709A1
公开(公告)日：2020-08-13
申请号：US16857116
申请日：2020-04-23
发明人： Faraj Sherrima
IPC分类号： H01H69/02 , H01H85/046 , H01H37/76
摘要： A novel temperature-triggered fuse device is configured to be activated at a designer-specified ambient temperature by utilizing wetting force among a pair of wetting material bays and a solder bridge or a solder ball. The solder bridge or the solder ball is typically positioned on top of the pair of wetting material bays separated by an electrically-insulated gap. Preferably, the wetting material bays are at least partly made of gold, nickel, or other elements suitable for generating an increased wetting force to the solder bridge or the solder ball upon increases in ambient temperature. The novel temperature-triggered fuse device can be integrated into various types of integrated circuits (IC's), or can function as a discrete fuse connected to one or more electronic components for robust protection from power surges and/or thermal runaway-related device malfunctions, meltdowns, or explosions. Various methods of producing the temperature-triggered fuse device are also disclosed herein.
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公开(公告)号：US10707043B2
公开(公告)日：2020-07-07
申请号：US15514616
申请日：2015-09-24
发明人： Yoshihiro Yoneda
IPC分类号： H01H85/08 , H01H85/06 , H01H85/143 , H01H85/12 , H01H85/11 , H01H85/10 , H01H85/046
摘要： A fuse device and a fuse element having excellent rapid blowout properties and excellent insulation properties after blowout even in a size-reduced fuse device are provided. A fuse element constitutes a current path of a fuse device and blows out due to self-generated heat when a rating-exceeding current flows, a length W in a width direction perpendicular to a conduction direction being greater than a total length L in the conduction direction in the fuse element. In particular, the fuse element includes a low melting point metal layer and a high melting point metal layer, the low melting point metal layer eroding the high melting point metal layer when current flows to cause blowout.
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公开(公告)号：US10653007B2
公开(公告)日：2020-05-12
申请号：US15738301
申请日：2016-06-22
申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , AutoNetworks Technologies, Ltd. , Sumitomo Electric Industries, Ltd. , Sumitomo Wiring Systems, Ltd.
IPC分类号： H05K1/02 , H05K1/03 , H01H85/046 , H01H85/02 , H01H69/02 , H05K3/06 , H05K3/00 , H01H85/10 , H05K3/02
摘要： A flexible printed circuit board according to an aspect of the present invention includes a base film having insulating properties and a conductive pattern laminated to one surface side of the base film. The conductive pattern forms part of a circuit and includes at least one fuse portion having a cross section smaller than the other part. The flexible printed circuit board includes at least one opening passing through front and rear surfaces on at least one of the right and left sides of the fuse portion in a two-dimensional view.
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