Abstract:
The SiC thyristor has a substrate (11), an anode (12), a drift region (13), a gate (14), and a cathode (15). The substrate (11), the anode (12), the drift region (13), the gate (14), and the cathode (15) are each preferably formed of silicon carbide. The substrate (11) is formed of silicon carbide having a first conductivity type and the anode (12) or the cathode (15), depending on the embodiment, is formed adjacent the substrate and has the same conductivity type as the substrate. A drift region (13) of silicon carbide is formed adjacent the anode or cathode and has a second conductivity type as the anode or cathode. A gate (14) is formed adjacent the drift region (13) or the cathode (15), also depending on the embodiment, and has the first conductivity type. An anode (12) or cathode (15), again depending on the embodiment, is formed adjacent the gate (14) or drift region (13) and has the second conductivity type.
Abstract:
A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.
Abstract:
A high efficiency Group III nitride light emitting diode is disclosed. The diode includes a substrate selected from the group consisting of semiconducting and conducting materials, a Group III nitride-based light emitting region on or above the substrate, and, a lenticular surface containing silicon carbide on or above the light emitting region.
Abstract:
An electronic device includes a conductive n-type substrate (11), a Group III nitride active region (13, 25, 121, 122), an n-type Group III-nitride layer (12, 31, 115, 116) in vertical relationship to the substrate and the active layer, at least one p-type layer (14, 26, 135, 136), and means for providing a non-rectifying conductive path between the p-type layer and the n-type layer or the substrate (15, 27, 145, 155, 146, 156). The non-rectifying conduction means may include a degenerate junction structure (15, 27) or a patterned metal layer (145, 155, 146, 156).
Abstract:
A method of fabricating a gallium nitride-based semiconductor structure on a substrate includes the steps of forming a mask (14) having at least one opening (6) therein directly on the substrate (18), growing a buffer layer (12) through the opening, and growing a layer of gallium nitride (20) upwardly from the buffer layer and laterally across the mask. During growth of the gallium nitride from the mask, the vertical and horizontal growth rates of the gallium nitride layer are maintained at rates sufficient to prevent polycrystalline material (30) nucleating on said mask from interrupting the lateral growth of the gallium nitride layer. In an alternative embodiment, the method includes forming at least one raised portion (15) defining adjacent trenches (18) in the substrate and forming a mask (14) on the substrate (10), the mask having at least one opening (16) over the upper surface of the raised portion. A buffer layer (12) may be grown from the upper surface of the raised portion. The gallium nitride layer (26) is then grown laterally by pendeoepitaxy over the trenches.
Abstract:
The present invention is a semiconductor structure for light emitting devices that can emit in the red to ultraviolet portion of the electromagnetic spectrum. The semiconductor structure includes a Group III nitride active layer (13) positioned between a first n-type Group III nitride cladding layer (11) and a second n-type Group III nitride cladding layer (12), the respective bandgaps of the first and second n-type cladding layers being greater than the bandgap of the active layer. The semiconductor structure further includes a p-type Group III nitride layer (18), which is positioned in the semiconductor structure such that the second n-type cladding layer (12) is between the p-type layer (18) and the active layer (13).
Abstract:
A vertical geometry light emitting diode is disclosed that is capable of emitting light in the red, green, blue, violet and ultraviolet portions of the electromagnetic spectrum. The light emitting diode includes a conductive silicon carbide substrate, an InGaN quantum well, a conductive buffer layer between the substrate and the quantum well, a respective undoped gallium nitride layer on each surface of the quantum well, and ohmic contacts in a vertical geometry orientation.
Abstract:
A method of testing a semiconductor device, having the steps of pulsing the semiconductor device with a predetermined level of current for a duration of time so as to cause inadequate parts to degrade and to cause adequate parts to stabilize, and measuring predetermined electrical or optical performance characteristics for the semiconductor device after the current pulse. A system for testing a semiconductor device on a wafer is also provided having a contact probe for applying current pulses to the semiconductor device on the wafer, measuring means electrically connected to the probe for measuring predetermined electrical or optical performance characteristics of the semiconductor device on the wafer, and optical detection means electrically connected to the measuring means for detecting radiation emitted from the semiconductor device on the wafer.
Abstract:
Light emitting devices, systems, and methods are disclosed. In one embodiment a light emitting device can include an emission area having one or more light emitting diodes (LEDs) mounted over an irregularly shaped mounting area. The light emitting device can further include a retention material disposed about the emission area. The retention material can also be irregularly shaped, and can be dispensed. Light emitting device can include more than one emission area per device.
Abstract:
Light emitting devices, systems, and methods are disclosed. In one embodiment a light emitting device can include an emission area having one or more light emitting diodes (LEDs) mounted over an irregularly shaped mounting area. The light emitting device can further include a retention material disposed about the emission area. The retention material can also be irregularly shaped, and can be dispensed. Light emitting device can include more than one emission area per device.