公开(公告)号：WO03103893A2

公开(公告)日：2003-12-18

申请号：PCT/BE0300104

申请日：2003-06-10

Applicant: LEUVEN K U RES & DEV ,  AL-BENDER FARID ,  GREGOIR CHRISTOPHE

Inventor： AL-BENDER FARID ,  GREGOIR CHRISTOPHE

IPC: B23D45/26 ,  B23Q1/38 ,  B24B41/04 ,  B27B5/30 ,  B28D5/02 ,  F16C32/06 ,  B24B

CPC classification number: F16C32/0696 ,  B23D45/26 ,  B23Q1/38 ,  B24B41/04 ,  B27B5/30 ,  B28D5/022 ,  F16C2322/39

Abstract: A solution is presented for high speed rotating devices, in particular cutting tools, whereby the said rotating device (1) is made monolithic with its shaft and the bearing system, needed to support it during rotation, uses the surfaces of the rotating device (1) as bearing surfaces. In the preferred embodiment, the fluid film bearing system includes two journal bearings (2,4) on both sides of the cutting tool and two thrust bearings (2,3), which use the faces of the cutting tool (1) as bearing surfaces

Abstract translation: 提出了用于高速旋转装置，特别是切割工具的解决方案，由此所述旋转装置（1）在其旋转时需要其轴和轴承系统制成单片，使用旋转装置（1）的表面 ）作为轴承表面。 在优选实施例中，流体膜轴承系统在切削工具的两侧包括两个轴颈轴承（2,4）和两个推力轴承（2,3），其使用切削工具（1）的表面作为轴承表面

公开(公告)号：WO02024410A1

公开(公告)日：2002-03-28

申请号：PCT/US2001/029799

申请日：2001-09-21

Applicant: LAM RESEARCH CORPORATION

Inventor： WILLIAMS, Damon, Vincent

IPC: B24B37/04

CPC classification number: B24B53/017 ,  B24B37/04 ,  B24B41/04 ,  B24B41/061 ,  H01L21/30625

Abstract: A CMP system make repeatable measurements of eccentric forces applied to carriers for wafer or conditioning pucks. Force applied to the carrier may be accurately measured even though such force is eccentrically applied to such carrier. An initial coaxial relationship between an axis of rotation and a carrier axis (212) is maintained during application of the eccentric force (FP-W), such that a sensor (263) is enabled to make repeatable measurements, of the eccentric forces, and the carrier (208) may be a wafer or a puck carrier. Such initial coaxial relationship is maintained by alinear bearing assembly (232) mounted between the carrier (208) and thsensor (263). The linear bearing assembly is provided as an array of separate linear bearing assemblies, wherein each separate linear bearing assembly is dimensioned independently of the diameter, of a wafer or puck carried by the carrier. The linear bearing assembly may be assembled with a retainer ring (282).

Abstract translation: CMP系统可以重复测量施加到晶片或调节盘的载体上的偏心力。 即使这样的力偏心地施加到这样的载体，也可以精确地测量施加到载体上的力。 在施加偏心力（FP-W）期间，保持旋转轴线和承载轴线（212）之间的初始同轴关系，使得传感器（263）能够对偏心力进行可重复的测量，以及 载体（208）可以是晶片或圆顶载体。 这种初始同轴关系由安装在载体（208）和传感器（263）之间的Alinear轴承组件（232）保持。 线性轴承组件被提供为单独的直线轴承组件的阵列，其中每个单独的直线轴承组件的尺寸独立于载体承载的晶片或圆盘的直径。 线性轴承组件可以与保持环（282）组装。

公开(公告)号：WO01098026A1

公开(公告)日：2001-12-27

申请号：PCT/GB2001/002736

申请日：2001-06-21

IPC: B24B19/08 ,  B24B19/12 ,  B24B41/00 ,  B24B41/04

CPC classification number: B24B41/04 ,  B24B19/08 ,  B24B19/12 ,  B24B41/002

Abstract: A grinding machine uses a conical grinding wheel (10) to create a non-circularly symmetric surface (defining, for example, a re-entrant cam) on a workpiece. The machine is operable to rotate such a workpiece about a first axis (5) and the machine has drive means for rotating the conical wheel about a second axis (14). A feeding mechanism brings the wheel into contact with the workpiece to define a line of grinding where the wheel contacts the workpiece (i.e. a cutting line). In use, a rocking movement is imparted to the wheel and spindle relative to the workpiece as the latter rotates so as to maintain the orientation of the cutting line relative to the first axis and of the second axis relative to the cutting line.

Abstract translation: 研磨机使用锥形磨轮（10）在工件上产生非圆形对称表面（例如限定凸轮）。 机器可操作以围绕第一轴线（5）旋转这样的工件，并且机器具有用于围绕第二轴线（14）旋转锥形轮的驱动装置。 进给机构使车轮与工件接触以限定一轮研磨，其中车轮接触工件（即切割线）。 在使用中，随着后轮旋转，相对于工件使车轮和心轴产生摇摆运动，以便相对于切割线保持切割线相对于第一轴线和第二轴线的取向。

公开(公告)号：WO00024548A1

公开(公告)日：2000-05-04

申请号：PCT/JP1998/004881

申请日：1998-10-28

IPC: B24B37/04 ,  B24B41/04 ,  B24B53/007 ,  B24B53/02 ,  B24B53/12 ,  B24B37/00 ,  H01L21/304

CPC classification number: B24B53/017 ,  B24B37/042 ,  B24B41/04 ,  B24B53/02 ,  B24B53/12

Abstract: The surface of a grindstone is dressed by constant cutting depth processing, preventing the surface of the grindstone from cracking, which might cause scratches, and dressing the dresser. The planarity of the surface of the dresser can be assured. Even if a grindstone as thick as several centimeters is used, the planarity can be maintained throughout the dressing and it is possible to dress a grindstone with small in-plane variation at all times. This can prolong the service life of the dresser significantly. By performing such constant cutting depth dressing while machining a wafer, the machining rate can be maintained and at the same time the throughput of the apparatus can be improved. The apparatus and the method are effective in planarizing an uneven surface of a wafer of any of various types.

Abstract translation: 砂轮的表面通过恒定的切削深度加工而被磨损，防止磨石的表面破裂，这可能造成划伤，并且修整修整器。 可以确保修整器表面的平面度。 即使使用厚度为几厘米的磨石，整个敷料也可以保持平整度，并且可以随时对具有小的平面内变化的磨石进行打磨。 这可以显着延长梳妆台的使用寿命。 通过在加工晶片时进行这种恒定的切割深度修整，可以保持加工速度，并且同时可以提高装置的生产量。 该装置和方法对于各种类型的任何一种的晶片的不平坦表面的平坦化是有效的。

公开(公告)号：WO99038650A1

公开(公告)日：1999-08-05

申请号：PCT/CA1999/000066

申请日：1999-01-28

IPC: B24B13/01 ,  B24B13/02 ,  B24B37/00 ,  B24B41/04 ,  B24B13/00

CPC classification number: B24B13/00 ,  B24B13/02 ,  B24B37/00 ,  B24B41/04

Abstract: The invention pertains to an improved method, a lapping tool head (82) and a lens polishing apparatus for carrying out the method, for polishing ophthalmic lenses (26). The apparatus has a lapping tool head (82), a flexible membrane (134) covering a lapping portion of the tool head (82), and pump and nozzle for pumping abrasive slurry over the lapping tool head. The new method comprises the conventional step of imparting an oscillatory movement to the lapping tool head (82) and contacting the lens surface with the lapping portion of the lapping tool head while an abrasive slurry is pumped over the lapping tool head (82). The improvement comprises the additional step of periodically undulating the membrane (134) for imparting a wave in that membrane such that the abrasive slurry can flow between the membrane and the lens surface. The lapping slurry is efficiently moved over the entire surface of the lens for improving the quality of the lenses (26) polished by this process.

Abstract translation: 本发明涉及一种改进的方法，研磨工具头（82）和用于执行该方法的透镜抛光装置，用于抛光眼镜片（26）。 该装置具有研磨工具头（82），覆盖工具头（82）的研磨部分的柔性膜（134）和用于在研磨工具头上泵送磨料浆料的泵和喷嘴。 该新方法包括将研磨浆料泵送到研磨工具头部（82）上的传统步骤，其将研磨工具头部（82）的振荡运动和研磨工具头部的研磨部分接触。 该改进包括周期性地使膜（134）波动的附加步骤，以在该膜中施加波，使得研磨浆料可以在膜和透镜表面之间流动。 研磨浆料有效地在透镜的整个表面上移动，以改善通过该方法抛光的透镜（26）的质量。

公开(公告)号：WO1998019301A1

公开(公告)日：1998-05-07

申请号：PCT/US1997019710

申请日：1997-10-28

Applicant: HMT TECHNOLOGY CORPORATION

Inventor： HMT TECHNOLOGY CORPORATION ,  HOSÉ, John, S.

IPC: G11B05/84

CPC classification number: B24B37/08 ,  B24B7/17 ,  B24B7/22 ,  B24B41/007 ,  B24B41/04 ,  G11B5/8404

Abstract: An apparatus for polishing one or more planar substrates, such as magnetic disks, between rotating polishing plates is described. The apparatus is designed to optimize uniformity and flatness of the substrates by maintaining a substantially constant parallel and coaxial alignment between the rotating polishing plates.

Abstract translation: 描述了用于在旋转的抛光板之间抛光一个或多个平面基板（例如磁盘）的装置。 该设备被设计成通过保持旋转的抛光板之间基本上恒定的平行和同轴对准来优化基板的均匀性和平坦度。

公开(公告)号：WO1997048525A1

公开(公告)日：1997-12-24

申请号：PCT/GB1997001570

申请日：1997-06-11

Applicant: WESTERN ATLAS U.K. LIMITED ,  STOCKER, Mark, Andrew ,  FALKNER, Dermot, Robert ,  MORANTZ, Paul, Mastin, Howard ,  PIERSE, Michael, George

Inventor： WESTERN ATLAS U.K. LIMITED

IPC: B24B41/00

CPC classification number: B24B53/07 ,  B23Q3/186 ,  B23Q17/24 ,  B24B5/04 ,  B24B5/06 ,  B24B5/065 ,  B24B9/065 ,  B24B17/04 ,  B24B17/06 ,  B24B41/02 ,  B24B41/04 ,  B24B49/02 ,  B24B49/12 ,  H01L21/02013 ,  H01L21/02021 ,  H01L21/67242 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A workpiece alignment and shifting system for moving circular workpieces from a first inspection station to a second machining station, comprises workpiece holding means for attachment to the face of a disc workpiece to move the latter from one position to another. Robotic means controls the position of the workpiece holding means and is adapted to move in at least two orthogonal directions, both of which are parallel to the plane of the disc when it occupies the first station. The disc is rotated in the inspection station and in the machining station and inspection means determines the position of the geometric centre of the disc as it is rotated. Computing means calculates from data delivered by the inspection means the two shifts required along the orthogonal directions of movement of the robotic means, to move the geometric centre of the disc to a second desired position whose coordinates are known. The computing means includes memory means for storing the said coordinates. The coordinates are those of the centre of rotation of the workpiece holder or chuck in the said second station. The workpiece holding means is vacuum operated. A three axis robot is employed to pick and place disc-like wafers of semi-conductor material for edge grinding, and movement along two of the robot axes, X and Z, is used to control the centering of the wafer on a vacuum chuck in the second grinding station.

Abstract translation: 用于将圆形工件从第一检查站移动到第二加工站的工件对准和移位系统包括用于附接到盘工件的表面的工件保持装置，以将其从一个位置移动到另一个位置。 机器人装置控制工件保持装置的位置，并且适于在至少两个正交方向上移动，当它们占据第一站时，它们都平行于盘的平面。 光盘在检查站和加工站中旋转，检查装置确定盘旋转时几何中心的位置。 计算装置根据由检查装置传送的数据，根据机器人装置的正交运动方向所需的两次移动，将盘的几何中心移动到其坐标已知的第二所需位置。 计算装置包括用于存储所述坐标的存储装置。 坐标是在所述第二站中的工件保持器或卡盘的旋转中心的坐标。 工件保持装置被真空操作。 采用三轴机器人来拾取和放置用于边缘磨削的半导体材料的盘状晶片，并且使用两个机器人轴X和Z的运动来控制晶片在真空卡盘上的定心 第二磨台。

公开(公告)号：WO1997032689A1

公开(公告)日：1997-09-12

申请号：PCT/EP1997000296

申请日：1997-01-23

Applicant: HÜLLER HILLE GMBH ,  GEIGER, Dietrich

Inventor： HÜLLER HILLE GMBH

IPC: B23Q39/02

CPC classification number: B23Q39/023 ,  B23Q1/70 ,  B23Q3/15786 ,  B23Q2039/002 ,  B24B27/0076 ,  B24B41/04 ,  Y10T408/3811 ,  Y10T408/385 ,  Y10T409/307784 ,  Y10T483/1795

Abstract: The invention relates to a process for machining workpieces with two parallel work spindles fitted on a headstock. According to the invention, the distance between the work spindles is altered with the aid of a driven adjuster. The invention also relates to a machine tool for machining workpieces, especially for numerically controlled machining centres, with two work spindles (1, 2) fitted parallel to each other on a headstock (3), where at least one work spindle (2) can be adjusted perpendicularly to its axis.

Abstract translation: 本发明涉及一种用于具有两个相互平行的主轴，其被布置在主轴箱工件的加工的方法。 根据本发明的工作主轴之间的距离与从动调节装置的帮助下改变。 本发明进一步提供一种机床特别是对于用于在主轴箱加工具有两个平行的工件数控加工中心（3），其设置工作主轴（1，2）在前面，其中，至少一个工作主轴（2）被布置成垂直于旋转可调的其轴线旋转。

公开(公告)号：WO1997000155A1

公开(公告)日：1997-01-03

申请号：PCT/GB1996001459

申请日：1996-06-17

Applicant: OPTICAL GENERICS LIMITED ,  WALKER, David, Douglas ,  BINGHAM, Richard, George ,  KIM, Sug-Whan ,  PUTTICK, Keith, Ernest

Inventor： OPTICAL GENERICS LIMITED

IPC: B24B13/015

CPC classification number: B24D13/147 ,  B24B13/015 ,  B24B41/04

Abstract: A lapping tool for localised optical polishing of a workpiece, the tool having a flexible working surface and being characterised by means for selectively varying the pressure applied, in use, on the workpiece by different regions of the tool working surface whereby to vary the effective area of contact with the workpiece. A method of optical polishing and optical workpiece using a lapping tool whose maximum working surface area is substantially smaller than the workpiece, comprising determining the path to be travelled by the tool across the workpiece, and determining the pressure and effective area of contact of the tool on the workpiece, in order to achieve the next stage of polishing, and then driving the tool over that path while dynamically varying the said applied pressure and effective contact area. Apparatus for guiding a body, such as an optical polishing tool, over a generally flat structure, such as an optical workpiece, comprising a three-dimensional drive mechanism for the controlled movement of the body across the surface of the structure, and a pivoted linkage linking the drive mechansim to the body such as to constrain the body to pivotal motion about a virtual pivot point which is fixed relative to the drive mechanism and is located at the interace between the body and the workpiece.

Abstract translation: 一种用于对工件进行局部光学抛光的研磨工具，该工具具有柔性工作表面，并且其特征在于用于通过工具工作表面的不同区域选择性地改变在使用中施加在工件上的压力的装置，从而改变有效面积 与工件接触。 一种使用研磨工具的光学抛光和光学工件的方法，其最大工作表面积基本上小于工件，包括确定工具在工件上行进的路径，以及确定工具的压力和有效接触面积 在工件上，以便实现下一阶段的抛光，然后在该路径上驱动工具，同时动态地改变所施加的压力和有效的接触面积。 用于将主体（例如光学抛光工具）引导到大致平坦的结构（例如光学工件）上的装置，包括用于主体横过结构表面受控运动的三维驱动机构，以及枢轴连杆 将驱动机构连接到主体，以便围绕相对于驱动机构固定并且位于主体和工件之间的间隔的虚拟枢轴点将本体约束为枢转运动。

公开(公告)号：WO1996015875A1

公开(公告)日：1996-05-30

申请号：PCT/US1995014854

申请日：1995-11-13

Applicant: HEWLETT-PACKARD COMPANY

Inventor： HEWLETT-PACKARD COMPANY ,  OLSON, Allan, G. ,  KELLY, Kieran, B. ,  CASEY, Shannon, D. ,  KENT, Blair, M.

IPC: B24B19/00

CPC classification number: B65H27/00 ,  B24B5/50 ,  B24B19/028 ,  B24B41/04 ,  B24D11/00 ,  B65H2404/133 ,  B65H2404/182

Abstract: A method and apparatus is achieved for creating or restoring a high friction surface to a drive roller (52). Abrasive pads (12) define a scrubbing surface for acting upon a media roller's surface (54-58). As the roller's surface is scrubbed, creping occurs which increases the surface's coefficient of friction between the roller and media sheet ("COF(rm)"). In one embodiment, the creping apparatus is formed by a pair of plates (16, 18) hinged along one edge (30) and open along an opposite edge (28). A spring (19) is positioned between the plates biasing the plates apart at the open end. One or more abrasive pads are attached to the outer surface of one plate (18). To create or restore a high friction surface, the apparatus (10) is positioned adjacent to the roller (52). By approximately defining the force applied between the roller (52) and abrasive pads (12) and by using an abrasive pad of known grit, initially surface contaminants, if any, are scrubbed from the roller surface (54-58).

Abstract translation: 实现了用于将高摩擦表面创建或恢复到驱动辊（52）的方法和装置。 研磨垫（12）限定用于作用在介质辊表面（54-58）上的擦洗表面。 当辊的表面被擦洗时，发生起皱，这增加了辊和介质片之间的表面摩擦系数（“COF（rm）”）。 在一个实施例中，起皱装置由沿着一个边缘（30）铰接并沿着相对边缘（28）敞开的一对板（16,18）形成。 弹簧（19）被定位在板之间，使板在开口端分开。 一个或多个研磨垫附接到一个板（18）的外表面。 为了创建或恢复高摩擦表面，装置（10）被定位成与辊（52）相邻。 通过大致限定施加在辊（52）和研磨垫（12）之间的力并且通过使用已知砂粒的研磨垫，最初的表面污染物（如果有的话）从辊表面（54-58）被擦洗。