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    PROCESS FOR THE DIRECT METAL-PLATING OF A PLASTIC SUBSTRATE
    81.
    发明申请
    PROCESS FOR THE DIRECT METAL-PLATING OF A PLASTIC SUBSTRATE 审中-公开
    塑料基材的直接金属镀层工艺

    公开(公告)号：WO01077419A2

    公开(公告)日：2001-10-18

    申请号：PCT/CA2001/000463

    申请日：2001-04-05

    IPC: C23C18/16 ,  C25D5/56

    CPC classification number: C25D5/56 ,  C23C18/2006 ,  C23C18/2033 ,  C23C18/208 ,  C23C18/24 ,  C23C18/285 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38

    Abstract: A process for direct metal-plating of a plastic substrate (14). The process comprises the steps of: (i) activating a surface of modified polyolefin substrate to produce an active surface (16), the active surface (16) having at least about 7 % of carbon atoms in the form of carbonyl; (ii) electrochemically depositing metal layer (18) on the active surface (16).

    Abstract translation: 一种用于塑料基板（14）的直接金属镀覆的方法。 该方法包括以下步骤：（i）活化改性聚烯烃基材的表面以产生活性表面（16），所述活性表面（16）具有羰基形式的至少约7％的碳原子; （ii）在活性表面（16）上电化学沉积金属层（18）。

    MEMBER HAVING METALLIC LAYER, ITS MANUFACTURING METHOD, AND ITS APPLICATION
    82.
    发明申请
    MEMBER HAVING METALLIC LAYER, ITS MANUFACTURING METHOD, AND ITS APPLICATION 审中-公开
    具有金属层的成员，其制造方法及其应用

    公开(公告)号：WO01038086A1

    公开(公告)日：2001-05-31

    申请号：PCT/JP1999/006597

    申请日：1999-11-26

    IPC: B32B15/08 ,  C23C18/16 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46

    CPC classification number: B32B15/08 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/1696 ,  C23C18/2086 ,  C23C18/285 ,  C23C18/30 ,  H05K1/0346 ,  H05K1/036 ,  H05K3/181 ,  H05K3/184 ,  H05K3/38 ,  H05K3/387 ,  H05K3/4661 ,  H05K2203/0315 ,  H05K2203/1105 ,  Y10T428/24917 ,  Y10T428/31725 ,  Y10T428/31765

    Abstract: A member having a metallic layer which exhibits an enhanced adhesion between a resin base and a precipitated metal because of chemical interaction without roughening the surface of the resin base, a method for manufacturing the same, a build-up multilayer wiring board using the member, a flexible wiring board, and a wiring board for multi-chip modules all those board being excellent and using the member are disclosed. The member is characterized by comprising a resin base of a resin composition containing an aromatic amide site in its chemical structure, a metallic fine particle layer formed on the resin base, a metal oxide layer formed on the metallic fine particle layer, and a metallic layer formed on the metal oxide layer. The metallic fine particle layer is a catalysis layer, an electroless plating layer is formed on the metallic fine particle layer, and the metallic layer, which is an electroplating layer, is formed on the electroless plating layer, and thus the wiring is set up. By the formation of fine wiring, a build-up multilayer wiring board, a flexible wiring board, and a wiring board for multi-chip modules all excellent in reliability are provided.

    Abstract translation: 具有金属层的构件，其由于化学相互作用而在树脂基底和沉淀金属之间具有增强的粘附性，而不会使树脂基底的表面变粗糙，其制造方法，使用该构件的堆积多层布线板， 公开了一种柔性布线板和用于多芯片模块的布线板，所有这些板都是优异的并且使用该构件。 该构件的特征在于包含树脂组合物的树脂基材，其树脂组合物的化学结构含有芳香族酰胺部位，在树脂基材上形成的金属微粒层，形成在金属微粒层上的金属氧化物层，以及金属层 形成在金属氧化物层上。 金属微粒层是催化层，在金属微粒层上形成化学镀层，在化学镀层上形成作为电镀层的金属层，由此形成配线。 通过形成精细布线，提供了可靠性优异的多层布线板，柔性布线板和多芯片模块用布线基板。

    DOUBLE-DIP Pd/Sn CROSSLINKER
    84.
    发明申请
    DOUBLE-DIP Pd/Sn CROSSLINKER 审中-公开
    双DIP DIP / Sn CROSSLINKER

    公开(公告)号：WO00036189A1

    公开(公告)日：2000-06-22

    申请号：PCT/US1999/030124

    申请日：1999-12-14

    IPC: C23C18/16 ,  C23C18/24 ,  C23C18/28 ,  C23C18/30 ,  C25D5/56 ,  C25D5/54 ,  B05D3/04 ,  B05D3/10 ,  C25D5/34 ,  C25D7/00

    CPC classification number: C23C18/1653 ,  C23C18/24 ,  C23C18/285 ,  C23C18/30 ,  C25D5/12

    Abstract: Process for the direct metallizing of the surface of a plastic object. The surface of the plastic object is roughened by pickling. The surface is activated with the aid of a colloidal or ionogenic aqueous solution of a first precious metal, which colloidal or ionogenic aqueous solution also contains a second base metal. This forms an activation coat on the surface containing the first precious and the second base metal. Electron conductivity of the activation coat is provided with the aid of a treatment solution, with which the second base metal is at least partially dissolved out of the activation coat and an electron conducting substance is adsorbed in the activation coat. Then the electron-conductive activation coat is metallized. Before the electron conducting activation coat is metallized, the sequence of steps "activation of the surface and establishment of electronic conductivity" is repeated at least once.

    Abstract translation: 用于直接金属化塑料物体表面的工艺。 塑料物体的表面被酸洗粗糙。 借助于第一种贵金属的胶体或离子型水溶液来激活表面，该胶态或离子型水溶液也含有第二种贱金属。 这在包含第一贵金属和第二贱金属的表面上形成活化涂层。 借助于处理溶液提供活化涂层的电导率，第二基底金属至少部分地从活化涂层中溶出并且电子传导物质被吸附在活化涂层中。 然后电子传导活化涂层被金属化。 在电子传导活化涂层金属化之前，将至少一次重复步骤“激活表面和建立电子导电性”的步骤。

    METALLIZED TEXTILE
    86.
    发明申请
    METALLIZED TEXTILE 审中-公开
    金属纺织品

    公开(公告)号：WO1998006508A1

    公开(公告)日：1998-02-19

    申请号：PCT/US1997013779

    申请日：1997-08-06

    Applicant: MTC LTD. ,  FRIEDMAN, Mark, M. ,  TAL, Meirav

    Inventor： MTC LTD. ,  FRIEDMAN, Mark, M.

    IPC: B05D03/04

    CPC classification number: B32B5/26 ,  A47G9/0238 ,  A47G2009/001 ,  B32B27/12 ,  B32B2255/02 ,  B32B2255/205 ,  C23C18/1658 ,  C23C18/1682 ,  C23C18/285 ,  C23C18/30 ,  D06M11/83

    Abstract: A process for activating a textile to catalyze the reduction of a metal cation, a process for metallizing the activated textile with the reduced metal, and the activated textile and metallized textile thereby produced. The textile is activated by precipitating noble metal nucleation sites on the fibers of the textile. Immersing the activated textile in a suitably prepared solution of a metal cation, and adding a reducing agent, leads to the formation of a metal plating tightly and intimately bonded to the fibers of the textile.

    Abstract translation: 用于活化织物以催化还原金属阳离子的方法，用还原金属对活化的织物进行金属化的方法以及由此产生的活化的纺织品和金属化织物。 织物通过在织物的纤维上沉淀贵金属成核位点来活化。 将活化的织物浸入适当制备的金属阳离子溶液中并加入还原剂，导致金属电镀的形成紧密并紧密地结合到纺织品的纤维上。

    A METHOD FOR DRYSENSITIZATION OF AN INSULATING SURFACE AND A POWDER FOR USE WITH THE METHOD
    88.
    发明申请
    A METHOD FOR DRYSENSITIZATION OF AN INSULATING SURFACE AND A POWDER FOR USE WITH THE METHOD 审中-公开
    绝缘表面和粉末混合使用方法的方法

    公开(公告)号：WO1980002222A1

    公开(公告)日：1980-10-16

    申请号：PCT/DK1980000023

    申请日：1980-04-11

    Applicant: NESELCO AS ,  SORENSEN G ,  SVENDSEN L

    Inventor： NESELCO AS

    IPC: H05K03/10

    CPC classification number: H05K3/182 ,  C23C18/1608 ,  C23C18/285 ,  G03G15/225 ,  G03G15/6585 ,  H05K3/1266 ,  H05K2203/0517 ,  Y10T428/2998

    Abstract: In order to sensitize the surface of an insulating substrate with a view to subsequent electroless metallization, powder particles are transferred to the surface by means of a xerographic process. The particles carry the sensitizing compound, at least on their surface. After fixing of the transferred powder, conventional electroless metallization may take place. The xerographic transfer enables selective plating, since any master that might be copied by the xerographic process may also be transferred to the surface of the substrate. The powder used with the process may be manufactured by acting on an existing plastic powder by a sensitizing metal compound in an organic solution having at least a superficial influence on the individual powder particles.

    Abstract translation: 为了使绝缘基板的表面敏感化以后续的无电镀金属化，粉末颗粒通过静电复印工艺转移到表面。 颗粒至少在其表面上携带敏化化合物。 在固定转移的粉末之后，可以进行常规的无电镀金属化。 静电复印可以进行选择性电镀，因为可能由静电印刷工艺复制的任何主板也可能会传输到基板的表面。 与该方法一起使用的粉末可以通过在至少对各个粉末颗粒具有表面影响的有机溶液中的敏化金属化合物作用于现有的塑料粉末来制造。

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