Abstract:
An apparatus and method for connecting and interconnecting spherical ICs. The apparatus includes an enclosure (232) which is used to hold and secure one or more spherical ICs (212) or to connect to a device such as a printed circuit board (214). The enclosure (232) includes two groups of electrical contact points. These contact points may be solder bumps, pads, leads, or any other type of connector. One group of contact points (236, 238) on the enclosure (232) aligns and connects with a corresponding set of contact points (216, 218) on the first spherical shaped IC (212) and the other group of contact points (240, 242) on the enclosure (232) aligns and connects with a corresponding set of contact points (220, 222) on the other device (214). The two groups of enclosure contact points are interconnected with each other through a circuit (250) located inside the enclosure (232). As a result, alignment is no longer required by the contact points on the spherical shaped IC (212) and the other device (214).
Abstract:
The invention concerns a device for providing supply voltage to a mounting rack (10) multipoint connector (20), characterised in that the multipoint connector (20) pins are divided into two groups: one first group connected to a bus system (22) lines (24) and optionally to an element supplying voltage to the system and a second group of pins. Said second group pins project sufficiently from the rear connecting wall (18) to enable the voltage transmission card (28) to be plugged in, which itself is connected to at least a conducting bar (36) guiding the system power supply.
Abstract:
A multi-chip module (10) includes a housing (200) having insulative side walls (210) and an end plate (220), conductive leads (300) extending from the side walls, integrated circuit (IC) dies (100-1) mounted to the end plate, and one or more interconnect dies (400-1) mounted to the end plate.
Abstract:
A bulkhead feedthrough assembly has a first end for releasable mating engagement with an underwater cable, a second end for releasable mating engagement in a bulkhead opening, and a through bore for guiding a plurality of leads from the cable through the bulkhead opening. A seal member is releasably mounted in the bore, and has a plurality of through bores equal to the number of leads, each lead extending through a respective bore. The seal member in a unstressed condition has an outer diameter greater than the feedthrough bore diameter, and each of the seal member through bores has an unstressed diameter less than the diameter of the respective lead, so as to resist leakage of seawater past the seal member.
Abstract:
An apparatus includes a base; a mount attached to the base, the mount including a backplate, a bottom platform formed perpendicular to the backplate along a bottom of the backplate, the bottom platform including a retention wall formed as part of the bottom platform distant from the portion of the bottom platform attached to the backplate, the retention wall being perpendicular to the bottom platform, and a first side arm formed as part of the backplate along a side of the backplate and extending outwards from the backplate, and a notch holder formed as part of the base, the notch holder configured to secure a drug test device to the base.
Abstract:
An immersion cooling thermal management system i(500) ncludes a heat duct (526) thermally coupled to a heat-generating electronic component (524). The heat duct has an inlet at a first longitudinal end of a channel and an outlet at an opposite second longitudinal end of the channel. The heat-generating electronic component is thermally coupled with the channel longitudinally between the inlet and the outlet. The outlet of the channel is higher than the inlet relative to a direction of gravity.