公开(公告)号：WO2010015678A3

公开(公告)日：2010-10-28

申请号：PCT/EP2009060213

申请日：2009-08-06

Applicant: IBM ,  IBM UK ,  STAMPER ANTHONY ,  ANDERSON FELIX PATRICK ,  MCDEVITT THOMAS LEDDY ,  EDELSTEIN DANIEL ,  COTE WILLIAM

Inventor： STAMPER ANTHONY ,  ANDERSON FELIX PATRICK ,  MCDEVITT THOMAS LEDDY ,  EDELSTEIN DANIEL ,  COTE WILLIAM

IPC: H01L23/532 ,  H01L21/3105 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485

CPC classification number: H01L24/13 ,  H01L21/3105 ,  H01L21/76807 ,  H01L21/76814 ,  H01L21/76826 ,  H01L21/76831 ,  H01L23/53238 ,  H01L23/53295 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2221/1036 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/45147 ,  H01L2224/48847 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01006

Abstract: Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The structure includes a trench formed in a dielectric layer which has at least a portion (12) thereof devoid of a fluorine boundary layer. The structure further includes a copper wire (20) in the trench having at least a bottom portion thereof in contact with the non- fluoride boundary layer (12) of the trench. A lead free solder bump (34) is in electrical contact with the copper wire (20).

Abstract translation: 具有改善的焊料凸点连接的结构和制造这种结构的方法在本文中提供。 该结构包括形成在电介质层中的沟槽，该沟槽至少具有一部分（12）缺少氟边界层。 该结构还包括在沟槽中的铜线（20），其至少其底部与沟槽的非氟化物边界层（12）接触。 无铅焊料凸块（34）与铜线（20）电接触。

公开(公告)号：WO2010015678A2

公开(公告)日：2010-02-11

申请号：PCT/EP2009/060213

申请日：2009-08-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  IBM UNITED KINGDOM LIMITED ,  STAMPER, Anthony ,  ANDERSON, Felix, Patrick ,  MCDEVITT, Thomas, Leddy ,  EDELSTEIN, Daniel ,  COTE, William

Inventor： STAMPER, Anthony ,  ANDERSON, Felix, Patrick ,  MCDEVITT, Thomas, Leddy ,  EDELSTEIN, Daniel ,  COTE, William

IPC: H01L23/532 ,  H01L23/485 ,  H01L21/3105 ,  H01L21/768 ,  H01L21/60

CPC classification number: H01L24/13 ,  H01L21/3105 ,  H01L21/76807 ,  H01L21/76814 ,  H01L21/76826 ,  H01L21/76831 ,  H01L23/53238 ,  H01L23/53295 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2221/1036 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/45147 ,  H01L2224/48847 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01006

Abstract: Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The structure includes a trench formed in a dielectric layer which has at least a portion thereof devoid of a fluorine boundary layer. The structure further includes a copper wire in the trench having at least a bottom portion thereof in contact with the non- fluoride boundary layer of the trench. A lead free solder bump is in electrical contact with the copper wire.

Abstract translation: 具有改善的焊料凸点连接的结构和制造这种结构的方法在本文中提供。 该结构包括在至少一部分没有氟边界层的电介质层中形成的沟槽。 该结构还包括在沟槽中的铜线，其至少其底部与沟槽的非氟化物边界层接触。 无铅焊料凸块与铜线电接触。