RECONFIGURABLE MULTI-ZONE GAS DELIVERY HARDWARE FOR SUBSTRATE PROCESSING SHOWERHEADS
    3.
    发明申请
    RECONFIGURABLE MULTI-ZONE GAS DELIVERY HARDWARE FOR SUBSTRATE PROCESSING SHOWERHEADS 审中-公开
    可重构的多区域气体输送硬件用于基板处理喷头

    公开(公告)号:WO2011068730A2

    公开(公告)日:2011-06-09

    申请号:PCT/US2010057959

    申请日:2010-11-24

    Abstract: Reconfigurable showerheads used in process chambers for substrate processing are provided herein. In some embodiments, a reconfigurable showerhead may include a body having one or more plenums disposed therein; and one or more inserts configured to be disposed within the one or more plenums, wherein the one or more inserts divide the reconfigurable showerhead into a plurality of zones. In some embodiments, a substrate processing system may include a process chamber having a reconfigurable showerhead coupled to a gas supply for providing one or more process gases to the process chamber, the reconfigurable showerhead including a body having one or more plenums disposed therein and one or more inserts configured to be disposed within the one or more plenums, wherein the one or more inserts divide the reconfigurable showerhead into a plurality of zones.

    Abstract translation: 本文提供了用于基板处理的处理室中使用的可重构喷头。 在一些实施例中,可重新配置的喷头可以包括具有布置在其中的一个或多个增压室的主体; 以及一个或多个插入件,其被配置为布置在所述一个或多个增压室内,其中所述一个或多个插入件将所述可重新配置的喷淋头分成多个区域。 在一些实施例中,衬底处理系统可以包括处理室,处理室具有耦合到气体供应的可重新配置的喷头,用于向处理室提供一种或多种处理气体,可重新配置的喷头包括具有布置在其中的一个或多个增压室的主体, 更多的插入件被构造成布置在一个或多个增压室内,其中一个或多个插入件将可重新配置的喷淋头分成多个区域。

    APPARATUS FOR EFFICIENT REMOVAL OF HALOGEN RESIDUES FROM ETCHED SUBSTRATES
    4.
    发明申请
    APPARATUS FOR EFFICIENT REMOVAL OF HALOGEN RESIDUES FROM ETCHED SUBSTRATES 审中-公开
    用于有效去除蚀刻基质中的卤素残余物的装置

    公开(公告)号:WO2010042410A3

    公开(公告)日:2010-06-10

    申请号:PCT/US2009059449

    申请日:2009-10-02

    Abstract: An apparatus for removing volatile residues from a substrate is provided. In one embodiment, an apparatus for removing halogen-containing residues from a substrate includes a chamber suitable for operating maintaining a vacuum therein and a heat module positioned to heat a substrate disposed in the chamber. The apparatus for removing halogen-containing residues from a substrate also includes at least one of A) a temperature controlled pedestal having a projection extending radially therefrom suitable for supporting the temperature control pedestal on a ledge of the chamber body, the projection thermally isolating the base from the chamber body; B) a pair of substrate holders that include two support flanges extending radially inward from an inner edge of an arc-shaped body, each support flange having a substrate support step that includes a sloped landing; or C) a domed window.

    Abstract translation: 提供了一种从基底去除挥发性残留物的设备。 在一个实施例中,用于从基板去除含卤素残余物的装置包括适于在其中保持真空的操作的腔室和定位成加热设置在腔室中的基板的加热模块。 用于从基底去除含卤素残余物的装置还包括以下至少一个:A)具有从其径向延伸的突起的温度控制基座,适于将温控基座支撑在腔室主体的突出部上,突出部将基座热隔离 来自腔体; B)一对衬底支架,其包括从弧形主体的内边缘径向向内延伸的两个支撑凸缘,每个支撑凸缘具有衬底支撑台阶,所述衬底支撑台阶包括倾斜平台; 或者C)圆顶窗户。

    HEATED SHOWERHEAD ASSEMBLY
    10.
    发明申请
    HEATED SHOWERHEAD ASSEMBLY 审中-公开
    加热淋浴组件

    公开(公告)号:WO2009089245A2

    公开(公告)日:2009-07-16

    申请号:PCT/US2009030267

    申请日:2009-01-07

    Abstract: The present invention generally comprises a heated showerhead assembly that may be used to supply processing gases into a processing chamber. The processing chamber may be an etching chamber. When processing gas is evacuated from the processing chamber, the uniform processing of the substrate may be difficult. As the processing gas is pulled away from the substrate and towards the vacuum pump, the plasma, in the case of etching, may not be uniform across the substrate. Uneven plasma may lead to uneven etching. To prevent uneven etching, the showerhead assembly may be separated into two zones each having independently controllable gas introduction and temperature control. The first zone corresponds to the perimeter of the substrate while the second zone corresponds to the center of the substrate. By independently controlling the temperature and the gas flow through the showerhead zones, etching uniformity of the substrate may be increased.

    Abstract translation: 本发明通常包括可用于将处理气体供应到处理室中的加热喷头组件。 处理室可以是蚀刻室。 当处理气体从处理室排出时,衬底的均匀处理可能是困难的。 当处理气体从衬底被拉离并且朝向真空泵时,在蚀刻的情况下,等离子体在衬底上可能不均匀。 不均匀的等离子体可能导致不均匀的蚀刻。 为了防止不均匀的蚀刻,喷头组件可以分成两个区域,每个区域具有独立可控的气体引入和温度控制。 第一区域对应于衬底的周边,而第二区域对应于衬底的中心。 通过独立地控制温度和通过喷头区域的气体流动,可以增加基板的蚀刻均匀性。

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