Abstract:
An analog controlled angle diffuser and associated methods provide a wavelength insensitive diffuser with a controlled output. The diffuser has free formed shaped analog fringes, i.e., fringes which have a continuous cross section from their peak to their term ination. Preferably, the depth of the analog fringes will be at least 2p, even more preferably at least 20p. Advantageously, the pattern of the diffuser is computer-generated.
Abstract:
An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.
Abstract:
A spectrometer for use with a desired wavelength range includes an array of filters. Each filter outputs at least two non-contiguous wavelength peaks within the desired wavelength range. The array of filters is spectrally diverse over the desired wavelength range, and each filter in the array of filters outputs a spectrum of a first resolution. An array of detectors has a detector for receiving an output of a corresponding filter. A processor receives signals from each detector, and outputs a reconstructed spectrum having a second resolution, the second resolution being higher than any of the first resolution of each filter.
Abstract:
A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.
Abstract:
An optical transceiver (200) includes at least one light source (202) and at least one detector mounted on the same surface of the same substrate (206). At least one of the light source and the detector is mounted on the surface. An optics block (220) having optical elements (222, 224) for each light source and detectors is attached via a vertical spacer to the substrate. Electrical interconnections (208) for the light source and the detector are accessible from the same surface of the substrate with the optics block attached thereto. One of the light source and the detector may be monolithically integrated into the substrate.
Abstract:
An apparatus which couples light to a fiber from a light source at an input plane while reducing back reflections includes returning light reflected back through such that the returning light does not substantially overlap with an output of the light source in the input plane. This apparatus may include a mode matching element and/or an angular distribution altering element. The apparatus may be reciprocal. The reciprocal apparatus may prevent light traversing the apparatus again having a change in phase of light from substantially overlapping an original object in an input plane.
Abstract:
Arrays (100) of non-rod shaped optical elements (104) may be integrated with fiber arrays (108) arranged in a positioning structure (110, 114). The use of non-rod shaped optical elements allow the elements to be lithographically created already accurately aligned relative to one another. This also allows for simultaneous alignment of the array of optical elements with the array of fibers. The arrays may be one or two dimensional. The support structure for the fibers may be any desired structure. The fiber endfaces may be angled. The array of optical elements may include more than one substrate bonded together. Passive alignment features, including visual alignment mark and/or mechanical mating features, may be provided on the arrays.
Abstract:
A power monitor for a light emitter uses an absorptive material placed in the path of the application beam. The absorptive has a measurable characteristics thereof altered by an intensity of the light beam, the absorptive material being thin enough to allow a poriton of the light beam sufficient for a desired application to be passed to the desired application. Preferably, an anti-reflective coating is placed between the absorptive material and the light emitting device. The absorptive material may be formed directly on the light emitting device or may be formed on or integrated with a spacer.
Abstract:
An integrated micro-optical system (61) includes at least two wafers with at least two optical elements (71, 73, 75, 77) provided on respective surfaces (50, 52, 54, 56, 58) of the at least two wafers. An active element (63) having a characteristic which changes in response to an applied field may be integrated on a bottom surface (67) of the wafers. The resulting optical system may present a high numerical aperture. Preferably, one of the optical elements is a refractive element formed in a material having a high index of refraction.
Abstract:
Different techniques may be used to realize the simultaneous provision of bonding material at a controlled height on a wafer level. These techniques include photolithographically patterning a layer of bonding material and providing spacer elements on a wafer then contacting another surface having the bonding material provided thereon to transfer the bonding material to the spacer elements. The patterning of the bonding material may include using a mask direct contact with or spaced from the bonding material. The providing of the spacer elements may include forming the spacers in the wafer itself or attaching spacer elements, particularly a wafer of spacer elements. The resultant integrated structure has controlled spacing between the bonded elements.