公开(公告)号：WO2010089696A2

公开(公告)日：2010-08-12

申请号：PCT/IB2010/050441

申请日：2010-02-02

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  DE SAMBER, Marc, A. ,  EGGINK, Hendrik, J.

Inventor： DE SAMBER, Marc, A. ,  EGGINK, Hendrik, J.

IPC: H01L25/16

CPC classification number: H01L25/167 ,  H01L2224/48465 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In summary, the present invention relates to a device, a system, a method and a computer program enabling a thermally improved packaging of a plurality of light emitting diodes (110, 112, 114) and at least one integrated circuit (116). A most temperature sensitive light emitting diode (110) of the plurality of light emitting diodes is located between less temperature sensitive light emitting diodes (112, 114) of the plurality of light emitting diodes and the at least one integrated circuit. Further, various additional measures such as e.g. varying at least one mounting area (102, 104, 106) of at least one light emitting diode, providing at least one thermal shielding (118), etc. can be taken in order to thermally optimize the packaging.

Abstract translation: 总之，本发明涉及能够对多个发光二极管（110,112,114）和至少一个集成电路（116）进行热改善的封装的装置，系统，方法和计算机程序。 多个发光二极管的最温度敏感的发光二极管（110）位于多个发光二极管的较少温度敏感的发光二极管（112,114）和至少一个集成电路之间。 此外，各种附加措施，例如 改变至少一个发光二极管的至少一个安装区域（102,104,106），提供至少一个热屏蔽（118）等，以便热包装的最佳化。

公开(公告)号：WO2010032181A1

公开(公告)日：2010-03-25

申请号：PCT/IB2009/053980

申请日：2009-09-11

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  WEEKAMP, Johannes, W. ,  EGGINK, Hendrik, J.

Inventor： WEEKAMP, Johannes, W. ,  EGGINK, Hendrik, J.

IPC: F21K99/00 ,  F21Y101/02

CPC classification number: F21V3/00 ,  F21K9/232 ,  F21V17/101 ,  F21V29/70 ,  F21V29/85 ,  F21Y2115/10

Abstract: The present invention relates to a method for making a global LED lamp (10) having a transparent globe (14) and a base (12) for connecting to a lamp socket. By wrapping the base (12) in expansive foam tape (38) of Compriband type or similar, prior to inserting it in a neck shaped portion (16) of the globe (14), automatic alignment of the base (12) in the globe neck (16) may be obtained. Further, soft metal strips (36) may be wrapped about the tape (38) prior to wrapping the tape (38) about the base (12). The tape (38) acts as an inflatable cushion, which presses the metal strips (36) towards the base (12) and the globe (14). Improved heat transfer between the globe (14) and the base (12) may thus be obtained.

Abstract translation: 本发明涉及一种制造具有透明球面（14）的全球LED灯（10）和用于连接到灯座的基座（12）的方法。 通过将基底（12）包裹在制品类型或类似物的膨胀泡沫胶带（38）中，在将其插入球体（14）的颈部部分（16）之前，基底（12）在球体 颈部（16）。 此外，在将带（38）围绕基部（12）缠绕之前，可以将软金属条（36）缠绕在带（38）周围。 胶带（38）用作充气垫，其将金属条（36）朝向底座（12）和球体（14）挤压。 因此可以获得改善的球体（14）和基座（12）之间的热传递。

公开(公告)号：WO2006103596A3

公开(公告)日：2007-03-15

申请号：PCT/IB2006050877

申请日：2006-03-22

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  DE SAMBER MARC A ,  SIKKENS MARTEN ,  EGGINK HENDRIK J

Inventor： DE SAMBER MARC A ,  SIKKENS MARTEN ,  EGGINK HENDRIK J

IPC: H01L25/075 ,  H01L33/64

CPC classification number: H05B33/26 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K1/189 ,  H01L2924/00

Abstract: A light emitting device, comprising a flexible substrate (2) with a single, structured conductive layer (5), and a plurality of LEDs (3) arranged on said substrate (2), said structured conductive layer (5) forming electrodes for driving said LEDs (3). The structured conductive layer comprises a plurality of heat dissipating pads (8), each having an area significantly larger than the area of each LED (3), and each LED (3 a) is thermally connected to at least one of said pads (8a), and electrically connected in series between two pads (8a, 8b). Through this design, each LED is thermally connected to a relatively large heat dissipating area, and the thermal energy built up in the LED will be distributed over this area, and then dissipated upwards and downwards from this area. As the addressing can be handled by a single conducting layer, the flexibility of the substrate is improved compared to multilayer substrates. By connecting each LED in series between two pads, a very large portion of the conducting layer can be used for the pads, and very little area needs to be occupied by conducting tracks, which otherwise may be a problem with single layer designs.

Abstract translation: 一种发光器件，包括具有单个结构化导电层（5）的柔性衬底（2）和布置在所述衬底（2）上的多个LED（3），所述结构化导电层（5）形成用于驱动的​​电极 所述LED（3）。 结构化导电层包括多个散热焊盘（8），每个散热焊盘具有明显大于每个LED（3）的面积的面积，并且每个LED（3a）热连接到所述焊盘（8a）中的至少一个 ），并且串联地电连接在两个焊盘（8a，8b）之间。 通过这种设计，每个LED被热连接到相对较大的散热区域，并且LED中积聚的热能将分布在该区域上，然后从该区域向上和向下散开。 由于可以通过单个导电层处理寻址，与多层基板相比，衬底的柔性得到改善。 通过将每个LED串联连接在两个焊盘之间，导电层的非常大的部分可以用于焊盘，并且非常小的面积需要由导电轨道占据，否则可能是单层设计的问题。

公开(公告)号：WO2010113120A1

公开(公告)日：2010-10-07

申请号：PCT/IB2010/051394

申请日：2010-03-31

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  DE SAMBER, Marc, A. ,  EGGINK, Hendrik, J. ,  VAN GRUNSVEN, Eric, C., E.

Inventor： DE SAMBER, Marc, A. ,  EGGINK, Hendrik, J. ,  VAN GRUNSVEN, Eric, C., E.

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/49537 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit system (1) comprises a first device (2), a second device (4) and a first frame (6) having a first supporting face (18) for supporting the first device (2). The integrated circuit system further comprises a second frame (8) displaced in a direction orthogonal to the first supporting face (18) and having a second supporting face (20) for supporting the second device (4). The second frame (8) is thermally isolated from the first frame (6) and the first device (2). The integrated circuit system further comprises a third frame (9) thermally isolated from the first frame (6) and thermally connected to the second frame (8). A good thermal mutual isolation between the first device (2) and the second device (4) is achieved in the integrated circuit system (1).

Abstract translation: 集成电路系统（1）包括第一装置（2），第二装置（4）和第一框架（6），其具有用于支撑第一装置（2）的第一支撑面（18）。 集成电路系统还包括在与第一支撑面（18）正交的方向上位移的第二框架（8），并具有用于支撑第二装置（4）的第二支撑面（20）。 第二框架（8）与第一框架（6）和第一装置（2）热隔离。 集成电路系统还包括与第一框架（6）热隔离并热连接到第二框架（8）的第三框架（9）。 在集成电路系统（1）中实现了第一器件（2）和第二器件（4）之间良好的热互相隔离。

公开(公告)号：WO2005101457A3

公开(公告)日：2009-02-19

申请号：PCT/IB2005051188

申请日：2005-04-11

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  VAN DE VOORDE PATRICK C ,  SHULEPOV SERGEI ,  BOUMA PETER H ,  EGGINK HENDRIK J

Inventor： VAN DE VOORDE PATRICK C ,  SHULEPOV SERGEI ,  BOUMA PETER H ,  EGGINK HENDRIK J

IPC: F21V29/00 ,  F21Y101/00 ,  H01J61/52 ,  H01K9/00

CPC classification number: F21V29/71 ,  F21V29/004 ,  F21V29/74 ,  F21V29/763 ,  F21V29/767 ,  F21V29/777 ,  H01J61/523

Abstract: The present invention relates to a lamp unit, especially to a UHP lamp unit, comprising a housing, a lamp positioned within said housing, a reflector assigned to said lamp for reflecting light emitted by said lamp through a transmission window, and at least one thermal bridge and/or heat sink unit being assigned to the reflector and/or to the lamp and/or to the housing. The or each thermal bridge and/or heat sink unit is preferably made from a material having a good thermal conductivity, e.g. the or each thermal bridge and/or heat sink is made from metal or ceramics.

Abstract translation: 技术领域本发明涉及一种灯单元，特别涉及一种UHP灯单元，包括壳体，位于所述壳体内的灯，分配给所述灯的反射器，用于通过透射窗反射由所述灯发射的光，以及至少一个热 桥和/或散热单元被分配给反射器和/或分配给灯和/或壳体。 所述或每个热桥和/或散热单元优选地由具有良好导热性的材料制成，例如， 该或每个热桥和/或散热器由金属或陶瓷制成。

公开(公告)号：WO2010089696A3

公开(公告)日：2010-09-30

申请号：PCT/IB2010050441

申请日：2010-02-02

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  DE SAMBER MARC A ,  EGGINK HENDRIK J

Inventor： DE SAMBER MARC A ,  EGGINK HENDRIK J

IPC: H01L25/16 ,  H01L33/64

CPC classification number: H01L25/167 ,  H01L2224/48465 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In summary, the present invention relates to a device, a system, a method and a computer program enabling a thermally improved packaging of a plurality of light emitting diodes (110, 112, 114) and at least one integrated circuit (116). A most temperature sensitive light emitting diode (110) of the plurality of light emitting diodes is located between less temperature sensitive light emitting diodes (112, 114) of the plurality of light emitting diodes and the at least one integrated circuit. Further, various additional measures such as e.g. varying at least one mounting area (102, 104, 106) of at least one light emitting diode, providing at least one thermal shielding (118), etc. can be taken in order to thermally optimize the packaging.

Abstract translation: 总之，本发明涉及实现多个发光二极管（110,112,114）和至少一个集成电路（116）的热改进封装的装置，系统，方法和计算机程序。 多个发光二极管中的最温度敏感的发光二极管（110）位于多个发光二极管中温度较低的发光二极管（112,114）和至少一个集成电路之间。 此外，各种附加措施例如， 改变至少一个发光二极管的至少一个安装区域（102,104,106），提供至少一个热屏蔽（118）等，以便对包装进行热优化。

公开(公告)号：WO2010010495A1

公开(公告)日：2010-01-28

申请号：PCT/IB2009/053097

申请日：2009-07-16

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  HUISMAN, Bart-Hendrik ,  MIGNOT, Nicolas ,  EGGINK, Hendrik , J. ,  LASANCE, Clémens J.M.

Inventor： HUISMAN, Bart-Hendrik ,  MIGNOT, Nicolas ,  EGGINK, Hendrik , J. ,  LASANCE, Clémens J.M.

IPC: H01L23/473 ,  H01L33/64

CPC classification number: F21V29/02 ,  F21K9/00 ,  F21V29/67 ,  F21V29/677 ,  F21V29/773 ,  F21V29/83 ,  F21V29/89 ,  F21Y2115/10 ,  H01L23/473 ,  H01L33/648 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module(111)to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing(150); and a fluid path (155)arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.

Abstract translation: 一种用于从半导体管芯（111）传递热量的半导体冷却装置。 半导体冷却装置包括散热器（112），其可热耦合到半导体模块（111）以被冷却以从半导体管芯（111）散热; 其上安装有半导体管芯（111）的壳体（150）; 流体流动通道（153），用于在所述壳体（150）内提供强制流体流动; 以及流体路径（155），布置成在流体流动通道（153）和散热器（112）之间沿第一方向引导强制流体流动，并且还设置成沿着散热器（112）引导流体流动 第二方向与第一方向不同。 在特定实施例中，半导体冷却装置用于从LED阵列散发热量。

公开(公告)号：WO2006103596A2

公开(公告)日：2006-10-05

申请号：PCT/IB2006/050877

申请日：2006-03-22

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  DE SAMBER, Marc, A. ,  SIKKENS, Marten ,  EGGINK, Hendrik, J.

Inventor： DE SAMBER, Marc, A. ,  SIKKENS, Marten ,  EGGINK, Hendrik, J.

IPC: H01L33/64

CPC classification number: H05B33/26 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K1/189 ,  H01L2924/00

Abstract: A light emitting device, comprising a flexible substrate (2) with a single, structured conductive layer (5), and a plurality of LEDs (3) arranged on said substrate (2), said structured conductive layer (5) forming electrodes for driving said LEDs (3). The structured conductive layer comprises a plurality of heat dissipating pads (8), each having an area significantly larger than the area of each LED (3), and each LED (3 a) is thermally connected to at least one of said pads (8a), and electrically connected in series between two pads (8a, 8b). Through this design, each LED is thermally connected to a relatively large heat dissipating area, and the thermal energy built up in the LED will be distributed over this area, and then dissipated upwards and downwards from this area. As the addressing can be handled by a single conducting layer, the flexibility of the substrate is improved compared to multilayer substrates. By connecting each LED in series between two pads, a very large portion of the conducting layer can be used for the pads, and very little area needs to be occupied by conducting tracks, which otherwise may be a problem with single layer designs.

Abstract translation: 一种发光器件，包括具有单个结构化导电层（5）的柔性衬底（2）和布置在所述衬底（2）上的多个LED（3），所述结构化导电层（5）形成用于驱动的​​电极 所述LED（3）。 结构化导电层包括多个散热焊盘（8），每个散热焊盘具有明显大于每个LED（3）的面积的面积，并且每个LED（3a）热连接到所述焊盘（8a）中的至少一个 ），并且串联地电连接在两个焊盘（8a，8b）之间。 通过这种设计，每个LED被热连接到相对较大的散热区域，并且LED中积聚的热能将分布在该区域上，然后从该区域向上和向下散开。 由于可以通过单个导电层处理寻址，与多层基板相比，衬底的柔性得到改善。 通过将每个LED串联连接在两个焊盘之间，导电层的非常大的部分可以用于焊盘，并且非常小的面积需要由导电轨道占据，否则可能是单层设计的问题。

公开(公告)号：WO2006077511A1

公开(公告)日：2006-07-27

申请号：PCT/IB2006/050133

申请日：2006-01-13

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  COMPTER, Johan, C. ,  FRISSEN, Petrus, C., M. ,  TABOR, Rob ,  VAN GAAL, Frans ,  EGGINK, Hendrik, J.

Inventor： COMPTER, Johan, C. ,  FRISSEN, Petrus, C., M. ,  TABOR, Rob ,  VAN GAAL, Frans ,  EGGINK, Hendrik, J.

IPC: H02K41/03 ,  H02K5/20

CPC classification number: H02K41/031 ,  H02K5/20 ,  H02K2201/18

Abstract: Coil assemblies (2) of electric motors (1) produce heat that can be a disadvantage when needing the electric motor (1) for high precision positioning applications. To reduce the negative impact of the heat, the coils (26a, 26b, 26c) are arranged in an internally cooled housing (21). The housing (21) has an outermost layer (25) at least on the side lacing the magnet assembly (3) of the electric motor (1), the outermost layer (25) being made of low or non-electrically conductive, non-magnetic or nearly non-magnetic material. The outermost layer (25) prevents heat radiation to the environment.

Abstract translation: 电动机（1）的线圈组件（2）产生热量，当需要电动机（1）用于高精度定位应用时，这可能是一个缺点。 为了减少热的负面影响，线圈（26a，26b，26c）布置在内部冷却的壳体（21）中。 壳体（21）至少在装在电动机（1）的磁体组件（3）的一侧上具有最外层（25），最外层（25）由低或非导电， 磁性或近乎非磁性的材料。 最外层（25）防止对环境的热辐射。

公开(公告)号：WO2006067687A1

公开(公告)日：2006-06-29

申请号：PCT/IB2005/054238

申请日：2005-12-14

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  RIJKEN, Antonius, M. ,  CUPPEN, Martinus, A, M. ,  EGGINK, Hendrik, J. ,  NIJLAND, Bjorn, A., H.

Inventor： RIJKEN, Antonius, M. ,  CUPPEN, Martinus, A, M. ,  EGGINK, Hendrik, J. ,  NIJLAND, Bjorn, A., H.

IPC: B23Q1/01 ,  B23Q11/00

CPC classification number: B23Q11/0003

Abstract: A precision apparatus has a movable member (A), moving in a bridge element (2) arranged perpendicular to the movement of the moveable element. The bridge element comprising an air slit (S) and a exhaust (E). The bridge element (2) comprises a primary air duct (21), substantially extending along the length of the bridge element, which primary air duct is provided with apertures (21a, 21b), The apertures (21a, 21b) are evenly distributed along the length of the bridge element, and form an air flow passage to a secondary air duct (22), also substantially extending along the length of the bridge element. Through the secondary air duct in operation air is drawn through the air slit (S).

Abstract translation: 精密装置具有可移动构件（A），其在垂直于可移动元件的运动布置的桥元件（2）中移动。 桥构件包括空气狭缝（S）和排气（E）。 桥式元件（2）包括主要空气管道（21），其基本上沿桥梁元件的长度延伸，该主要空气管道设置有孔（21a，21b）。孔（21a，21b）均匀分布 桥梁元件的长度，并且形成到二次空气管道（22）的空气流动通道，其也基本上沿着桥接元件的长度延伸。 通过二次空气管道，空气通过空气狭缝（S）被吸入。