摘要:
A structure for a chemical vapor deposition reactor includes a support element (50) defining oppositely-facing substantially planar upper and lower surfaces and a vertical rotational axis (52) substantially perpendicular to the upper and lower surfaces, and a plurality of carrier sections (70) releasably engaged with the support element. Each carrier section (70) can include oppositely-facing substantially planar top and bottom surfaces and at least one aperture (73) extending between the top and bottom surfaces. The carrier sections (70) can be disposed on the support element (50) with the bottom surfaces (79) of the carrier sections facing toward the upper surface (59) of the support element, so that (wafers 30) can be held in the apertures (73) of the carrier sections with one surface (32) of each wafer confronting the support element and an opposite surface (31) exposed at the top (surface 78) of the carrier sections.
摘要:
A wafer carrier (30) for a rotating disc CVD reactor includes a unitary plate (32) of a ceramic such as silicon carbide defining wafer-holding features such as pockets (38) on its upstream surface (34) and also includes a hub (40) removably mounted to the plate (32) in a central region (44) of the plate (32). The hub (40) provides a secure connection to the spindle (16) of the reactor without imposing concentrated stresses on the ceramic plate (32). The hub (40) can be removed during cleaning of the plate (32). The wafer carrier (30) also preferably includes a gas flow facilitating element (348, 448) on the upstream surface (34) of the plate (32) in the central region (44) of the plate (32). The gas flow facilitating element (348, 448) helps redirect the flow of incident gases along the upstream surface (34) and away from a flow discontinuity in the central region (44).
摘要:
An apparatus provides a carrier (80) rotatable about an axis of rotation (22) where the carrier has a top surface (88) adapted to hold at least one semiconductor wafer (140) and a surface characterization tool (120) which is operative to move over a plurality of positions relative to the top surface of the carrier and/or the wafer transverse to the axis of rotation A method using the apparatus is also included.
摘要:
A method of in-situ pyrometer calibration for a wafer treatment reactor such as a CVD reactor 12 desirably includes the steps of positioning a calibrating pyrometer 80 at a first calibrating position A and heating the reactor until the reactor reaches a pyrometer calibration temperature. The method desirably further includes rotating a support element 40 about a rotational axis 42, and while the support element is rotating about the rotational axis, obtaining first operating temperature measurements from a first operating pyrometer 71 installed at a first operating position 1R, and obtaining first calibrating temperature measurements from the calibrating pyrometer 80. Both the calibrating pyrometer 80 and the first operating pyrometer 71 desirably are adapted to receive radiation from a first portion of the wafer support element 40 at a first radial distance D1 from the rotational axis 42 of the wafer support element.
摘要:
A system and method for uniform deposition of material layers on wafers in a rotating disk chemical vapor deposition reaction system is provided, wherein one or more substrates (138) are rotated on a carrier (104) about an axis (106) while maintaining surfaces of the one or more substrates substantially perpendicular to the axis of rotation and facing in an upstream direction along the axis of rotation. During rotating a first gas is discharged in the downstream direction towards the one or more substrates from a first set of gas inlets (170). A second gas is discharged in the downstream direction towards the one or more substrates from at least one movable gas injector (108), and the at least one movable gas inlet is moved with a component of motion in a radial direction towards or away from the axis of rotation.
摘要:
A rotating disk reactor for chemical vapor deposition includes a vacuum chamber and a ferrofluid feedthrough comprising an upper and a lower ferrofluid seal that passes a motor shaft into the vacuum chamber. A motor is coupled to the motor shaft and is positioned in an atmospheric region between the upper and the lower ferrofluid seal. A turntable is positioned in the vacuum chamber and is coupled to the motor shaft so that the motor rotates the turntable at a desired rotation rate. A dielectric support is coupled to the turntable so that the turntable rotates the dielectric support when driven by the shaft. A substrate carrier is positioned on the dielectric support in the vacuum chamber for chemical vapor deposition processing. A heater is positioned proximate to the substrate carrier that controls the temperature of the substrate carrier to a desired temperature for chemical vapor deposition.
摘要:
An apparatus provides a carrier (80) rotatable about an axis of rotation (22) where the carrier has a top surface (88) adapted to hold at least one semiconductor wafer (140) and a surface characterization tool (120) which is operative to move over a plurality of positions relative to the top surface of the carrier and/or the wafer transverse to the axis of rotation A method using the apparatus is also included.
摘要:
A method of in-situ pyrometer calibration for a wafer treatment reactor such as a CVD reactor 12 desirably includes the steps of positioning a calibrating pyrometer 80 at a first calibrating position A and heating the reactor until the reactor reaches a pyrometer calibration temperature. The method desirably further includes rotating a support element 40 about a rotational axis 42, and while the support element is rotating about the rotational axis, obtaining first operating temperature measurements from a first operating pyrometer 71 installed at a first operating position 1R, and obtaining first calibrating temperature measurements from the calibrating pyrometer 80. Both the calibrating pyrometer 80 and the first operating pyrometer 71 desirably are adapted to receive radiation from a first portion of the wafer support element 40 at a first radial distance D1 from the rotational axis 42 of the wafer support element.
摘要:
A system and method for uniform deposition of material layers on wafers in a rotating disk chemical vapor deposition reaction system are provided, wherein one or more substrates (138) are rotated on a carrier (104) about an axis (106) while maintaining surfaces of the one or more substrates substantially perpendicular to the axis of rotation and facing in an upstream direction along the axis of rotation. During rotating a first gas is discharged in the downstream direction towards the one or more substrates from a first set of gas inlets (170). A second gas is discharged in the downstream direction towards the one or more substrates from at least one movable gas injector (108), and the at least one movable gas inlet is moved with a component of motion in a radial direction towards or away from the axis of rotation.