NANOWIRE TRANSISTOR DEVICES AND FORMING TECHNIQUES
    5.
    发明申请
    NANOWIRE TRANSISTOR DEVICES AND FORMING TECHNIQUES 审中-公开
    纳米晶体管器件和成形技术

    公开(公告)号:WO2014018201A1

    公开(公告)日:2014-01-30

    申请号:PCT/US2013/047146

    申请日:2013-06-21

    Abstract: Techniques are disclosed for customization of nanowire transistor devices to provide a diverse range of channel configurations and/or material systems within the same integrated circuit die. In accordance with one example embodiment, sacrificial fins are removed and replaced with custom material stacks of arbitrary composition and strain suitable for a given application. In one such case, each of a first set of the sacrificial fins is recessed or otherwise removed and replaced with a p-type layer stack, and each of a second set of the sacrificial fins is recessed or otherwise removed and replaced with an n-type layer stack. The p-type layer stack can be completely independent of the process for the n-type layer stack, and vice-versa. Numerous other circuit configurations and device variations are enabled using the techniques provided herein.

    Abstract translation: 公开了用于定制纳米线晶体管器件以提供同一集成电路管芯内的不同范围的通道配置和/或材料系统的技术。 根据一个示例性实施例,除去牺牲翅片并用适合于给定应用的任意组合和应变的定制材料堆叠代替。 在一种这样的情况下,第一组牺牲散热片中的每一个凹陷或以其它方式移除并被p型层堆叠代替,并且第二组牺牲散热片中的每一个凹进或以其它方式移除, 类型层堆栈。 p型层堆栈可以完全独立于n型层堆栈的过程,反之亦然。 使用本文提供的技术可实现许多其它电路配置和设备变化。

    COMMON-SUBSTRATE SEMICONDUCTOR DEVICES HAVING NANOWIRES OR SEMICONDUCTOR BODIES WITH DIFFERING MATERIAL ORIENTATION OR COMPOSITION
    6.
    发明申请
    COMMON-SUBSTRATE SEMICONDUCTOR DEVICES HAVING NANOWIRES OR SEMICONDUCTOR BODIES WITH DIFFERING MATERIAL ORIENTATION OR COMPOSITION 审中-公开
    具有不同材料取向或组成的纳米线或半导体器件的共面衬底半导体器件

    公开(公告)号:WO2013095656A1

    公开(公告)日:2013-06-27

    申请号:PCT/US2011/067242

    申请日:2011-12-23

    Abstract: Common-substrate semiconductor devices having nanowires or semiconductor bodies with differing material orientation or composition and methods to form such common-substrate devices are described. For example, a semiconductor structure includes a first semiconductor device having a first nanowire or semiconductor body disposed above a crystalline substrate. The first nanowire or semiconductor body is composed of a semiconductor material having a first global crystal orientation. The semiconductor structure also includes a second semiconductor device having a second nanowire or semiconductor body disposed above the crystalline substrate. The second nanowire or semiconductor body is composed of a semiconductor material having a second global crystal orientation different from the first global orientation. The second nanowire or semiconductor body is isolated from the crystalline substrate by an isolation pedestal disposed between the second nanowire or semiconductor body and the crystalline substrate.

    Abstract translation: 描述具有不同材料取向或组成的纳米线或半导体主体的共基板半导体器件以及形成这种共基板器件的方法。 例如,半导体结构包括具有设置在结晶衬底之上的第一纳米线或半导体本体的第一半导体器件。 第一纳米线或半导体主体由具有第一全局晶体取向的半导体材料组成。 半导体结构还包括具有设置在晶体衬底上方的第二纳米线或半导体本体的第二半导体器件。 第二纳米线或半导体本体由具有与第一全局取向不同的第二全局晶体取向的半导体材料构成。 通过设置在第二纳米线或半导体本体与晶体衬底之间的隔离基座,将第二纳米线或半导体本体与晶体衬底隔离。

    SEMICONDUCTOR DEVICES HAVING THREE-DIMENSIONAL BODIES WITH MODULATED HEIGHTS
    8.
    发明申请
    SEMICONDUCTOR DEVICES HAVING THREE-DIMENSIONAL BODIES WITH MODULATED HEIGHTS 审中-公开
    具有调制高度的三维体的半导体器件

    公开(公告)号:WO2013095443A1

    公开(公告)日:2013-06-27

    申请号:PCT/US2011/066544

    申请日:2011-12-21

    Abstract: Semiconductor devices having three-dimensional bodies with modulated heights and methods to form such devices are described. For example, a semiconductor structure includes a first semiconductor device having a first semiconductor body disposed above a substrate. The first semiconductor body has a first height and an uppermost surface with a first horizontal plane. The semiconductor structure also includes a second semiconductor device having a second semiconductor body disposed above the substrate. The second semiconductor body has a second height and an uppermost surface with a second horizontal plane. The first and second horizontal planes are co-planar and the first and second heights are different.

    Abstract translation: 描述具有调制高度的三维体的半导体器件和形成这种器件的方法。 例如,半导体结构包括具有设置在基板上方的第一半导体本体的第一半导体器件。 第一半导体本体具有第一高度和具有第一水平面的最上表面。 半导体结构还包括具有设置在衬底上方的第二半导体本体的第二半导体器件。 第二半导体本体具有第二高度和具有第二水平面的最上表面。 第一和第二水平面是共面的,第一和第二高度是不同的。

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