Abstract:
A thin film transistor includes a base substrate (19); an active layer (11); an etch stop layer (12) on a side of the active layer (11) distal to the base substrate (19); and a source electrode (13) and a drain electrode (14) on a side of the etch stop layer (12) distal to the active layer (11). The active layer (11) includes a channel region (100), a source electrode contact region (200), and a drain electrode contact region (300). An orthographic projection (12p) of the etch stop layer (12) on the base substrate (19) surrounds an orthographic projection (300p) of the drain electrode contact region (300) on the base substrate (19). An orthographic projection (200p) of the source electrode contact region (200) on the base substrate (19) at least partially peripherally surrounding the orthographic projection (12p) of the etch stop layer (12) on the base substrate (19).
Abstract:
A transistor including a channel disposed between a source and a drain, a gate electrode disposed on the channel and surrounding the channel, wherein the source and the drain are formed in a body on a substrate and the channel is separated from the body. A method of forming an integrated circuit device including forming a trench in a dielectric layer on a substrate, the trench including dimensions for a transistor body including a width; forming a channel material in the trench; recessing the dielectric layer to expose a first portion of the channel material; increasing a width dimension of the exposed channel material; recessing the dielectric layer to expose a second portion of the channel material; removing the second portion of the channel material; and forming a gate stack on the first portion of the channel material, the gate stack including a gate dielectric and a gate electrode.
Abstract:
A novel material is provided. A composite oxide semiconductor includes a first region and a second region. The first region contains indium. The second region contains an element M (the element M is one or more of Ga, Al, Hf, Y, and Sn). The first region and the second region are arranged in a mosaic pattern. The composite oxide semiconductor further includes a third region. The element M is gallium. The first region contains indium oxide or indium zinc oxide. The second region contains gallium oxide or gallium zinc oxide. The third region contains zinc oxide.
Abstract:
Provided is a novel semiconductor device. The semiconductor device comprises a first transistor and a second transistor. The first transistor comprises a first gate electrode; a first insulating film over the first gate electrode; a first oxide semiconductor film over the first insulating film; a first source electrode and a first drain electrode over the first oxide semiconductor film; a second insulating film over the first oxide semiconductor film, the first source electrode, and the first drain electrode; and a second gate electrode over the second insulating film. The second transistor comprises a first drain electrode; the second insulating film over the second drain electrode; a second oxide semiconductor film over the second insulating film; a second source electrode and a second drain electrode over the second oxide semiconductor film; a third insulating film over the second oxide semiconductor film, the second source electrode, and the second drain electrode; and a third gate electrode over the third insulating film. The first oxide semiconductor film partly overlaps with the second oxide semiconductor film.