公开(公告)号：WO2016019335A1

公开(公告)日：2016-02-04

申请号：PCT/US2015/043283

申请日：2015-07-31

Applicant: KYOCERA AMERICA, INC. ,  LIEU, Dinah

Inventor： LIEU, Dinah

IPC: H01L23/488 ,  H01L23/12

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1182 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1356 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/814 ,  H01L2224/81444 ,  H01L2224/8149 ,  H01L2224/81815 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Forming the chip attachment system includes obtaining a chip having a bump core on a die. The method also includes obtaining an intermediate structure having a transfer pad on a substrate. The method further includes transferring the transfer pad from the substrate to the bump core such that the transfer pad becomes a solder layer on the bump core.

Abstract translation: 形成芯片附接系统包括在芯片上获得具有凸块的芯片。 该方法还包括获得在基底上具有转移垫的中间结构。 该方法还包括将转移垫从衬底转移到凸起芯，使得转移垫变为凸点芯上的焊料层。